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ST7FMC1K2T3

STMicroelectronics

ST7FMC1K2T3 by STMicroelectronics

ST7FMC1K2T3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 125 °C. It supports LIN, SCI, and SPI connectivity and includes 8 ADC channels for versatile applications. Ideal for automotive use, it operates on a supply voltage of 3.8V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,279 parts In-Stock

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8,279

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Digiode

USA . 1,740 parts In-Stock

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1,740

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Anansix

USA . 1,097 parts In-Stock

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1,097

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Distributors (Availability)

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$15.800

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-

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489

$15.800

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Microchip USA

USA . 3,244 parts In-Stock

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$16.278

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3,244

$16.278

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IDEA Electronic Components Group

UK . 362 parts In-Stock

1+ parts

$58.104

100+ parts

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$52.293

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362

$58.104

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$52.293

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Component Stockers USA

USA . 561 parts In-Stock

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$99.990

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561

$99.990

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MKK Technologies

India . 641 parts In-Stock

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$109.260

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641

$109.260

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DigiPath Technology Company

USA . 641 parts In-Stock

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$109.260

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641

$109.260

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Vigor

Singapore . 3,840 parts In-Stock

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3,840

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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A-Z Elektronik GmbH

Germany . 2,543 parts In-Stock

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2,543

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Corphita

USA . 1,804 parts In-Stock

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1,804

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Parana Technologies

USA . 1,558 parts In-Stock

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$69.472

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1,558

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$69.472

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Assy Fe

Spain . 15 parts In-Stock

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Overview

Unlock the potential of your projects with the ST7FMC1K2T3 microcontroller from STMicroelectronics, a leader in cutting-edge semiconductor solutions. Renowned for its reliability and performance, this versatile 8-bit microcontroller is perfect for automotive applications, integrating seamlessly into various systems. Enjoy enhanced efficiency and robustness, empowering your designs with advanced features while benefiting from ST’s commitment to quality and innovation that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers robust protection and durability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology facilitates compact designs and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with most standard power supplies.

Package Shape: SQUARE

The square package shape allows for easier placement on PCBs and better space utilization.

Bit Size: 8

An 8-bit architecture is efficient for simpler tasks, reducing computational overhead.

Power Supplies (V): 5

Utilizing a nominal power supply of 5 V simplifies power management and integration with common systems.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample connectivity options for peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style saves space in the design while providing a stable footprint.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V enhances versatility in power source options.

Maximum Operating Temperature: 125° C

A high maximum operating temperature makes this microcontroller suitable for automotive and harsh environments.

CPU Family: ST72

The ST72 CPU family is known for its reliability and performance in control applications.

Minimum Operating Temperature: -40° C

With a minimum operating temperature of -40 °C, it is ideal for extreme conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish promotes better solderability and longer shelf life of the components.

ADC Channels: YES

The inclusion of ADC channels allows for analog data processing, enhancing functionality.

Terminal Position: QUAD

Quad terminal positioning supports easier and more efficient PCB layout.

ROM Words: 8192

An 8192-word ROM provides sufficient memory for program storage and execution.

Maximum Seated Height: 1.6 mm

A low seated height allows for more compact designs with less height clearance needed.

Width: 7 mm

A width of 7 mm is conducive to space-constrained applications.

Peripherals: TIMER(5)

Five timers add versatility for task scheduling and managing timing-related operations.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate speed for many control tasks.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures compatibility with modern manufacturing processes.

Peak Reflow Temperature: 235° C

A peak reflow temperature of 235 °C guarantees reliability during soldering processes.

Length: 7 mm

A standardized length of 7 mm facilitates integration into various designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade signifies high-quality reliability for cars and transport applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control functionalities in a single unit.

RAM Bytes: 384

384 bytes of RAM are sufficient for small applications and real-time processing tasks.

Technology: CMOS

CMOS technology minimizes power consumption while ensuring efficient processing speeds.

Terminal Form: GULL WING

Gull wing terminals ensure reliable connections and are easy to solder onto PCBs.

Analog To Digital Converters: 8-Ch 10-Bit

Eight channels of 10-bit ADC enhance signal processing versatility.

Maximum Supply Current: 18 mA

A maximum supply current of 18 mA makes it energy-efficient for low-power applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with many standard components, making integration straightforward.

PWM Channels: YES

With PWM channels available, it supports varied applications like motor control and LED dimming.

Connectivity: LIN, SCI, SPI

Diverse connectivity options like LIN, SCI, and SPI enable flexible communication with other devices.

ROM Programmability: FLASH

Flash programmability offers the flexibility to update programs easily in the field.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, requiring careful handling to ensure reliability.

Speed: 8 rpm

The speed rating of 8 rpm indicates suitability for specific low-speed applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances compatibility with corresponding architectures and software.

No. of I/O Lines: 17

Seventeen I/O lines offer sufficient options for interfacing with other components and peripherals.

Technical Specifications

Microcontrollers ST7FMC1K2T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST7FMC1K2T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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