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ST7FLITEUS5U6TR

STMicroelectronics

ST7FLITEUS5U6TR by STMicroelectronics

ST7FLITEUS5U6TR microcontroller from STMicroelectronics operates at 3.3-5.5V with an 8 MHz clock, featuring 128 bytes of RAM and 1024 words of FLASH ROM. Its compact design (4.5x3.5 mm) suits industrial applications requiring reliable performance in harsh conditions (-40 °C to 85 °C). Ideal for embedded systems, it supports ADC and PWM channels for versatile control tasks.

Median Price

$0.688

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 18 parts In-Stock

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$0.688

18

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$0.688

Distributors (In-Stock)

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Vyrian

USA . 5,323 parts In-Stock

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5,323

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Anansix

USA . 1,784 parts In-Stock

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1,784

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Digiode

USA . 688 parts In-Stock

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688

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Distributors (Availability)

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Microchip USA

USA . 484 parts In-Stock

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$2.223

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484

$2.223

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IDEA Electronic Components Group

UK . 955 parts In-Stock

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$27.837

100+ parts

-

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$25.054

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955

$27.837

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$25.054

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MKK Technologies

India . 447 parts In-Stock

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$52.346

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447

$52.346

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DigiPath Technology Company

USA . 447 parts In-Stock

1+ parts

$52.346

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447

$52.346

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Component Stockers USA

USA . 756 parts In-Stock

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$99.990

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756

$99.990

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Perfect Parts

USA . 6,701 parts In-Stock

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6,701

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Corphita

USA . 4,170 parts In-Stock

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Parana Technologies

USA . 2,184 parts In-Stock

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$33.284

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2,184

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$33.284

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Overview

Elevate your projects with the ST7FLITEUS5U6TR microcontroller from STMicroelectronics, a trusted leader in innovation and quality. Designed for versatility, this compact powerhouse excels in industrial applications, offering high reliability and performance in challenging environments. With its low power consumption and extensive features, it empowers developers to create efficient, smart solutions that drive success. Harness the potential of advanced technology with STMicroelectronics and watch your ideas come to life!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact layouts, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The flexibility with a maximum supply voltage of 5.5 V ensures compatibility with a range of systems.

Package Shape: RECTANGULAR

The rectangular package shape is a standard design that fits well into various PCB layouts.

Bit Size: 8

An 8-bit architecture is ideal for simple control applications, providing sufficient processing power while minimizing complexity.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, offering flexibility in power management for different applications.

No. of Terminals: 8

With 8 terminals, the microcontroller provides a balanced interface for I/O operations while keeping design simple.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile enhance the versatility for use in space-limited designs and portable devices.

Minimum Supply Voltage: 3.3 V

Supports a low minimum supply voltage, making it energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures reliability in industrial environments.

CPU Family: ST72

Part of the ST72 family, this microcontroller benefits from a well-established ecosystem of support and resources.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, this is ideal for outdoor or harsh environments.

ADC Channels: YES

Onboard ADC channels allow for versatile data acquisition from analog sensors.

Terminal Position: DUAL

Dual terminal positioning simplifies connectivity and improves flexibility in mounting options.

ROM Words: 1024

1024 ROM words provide ample space for programming and storage of essential code.

Maximum Seated Height: 1 mm

A low seated height ensures compatibility with low-profile applications.

Width: 3.5 mm

A narrow width contributes to its space-saving design, ideal for compact devices.

Maximum Clock Frequency: 8 MHz

At 8 MHz, this microcontroller delivers satisfactory processing speeds for low to mid-range tasks.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum peak reflow time of 40 seconds indicates robustness during surface mounting processes.

Peak Reflow Temperature °C: 260

Withstand up to 260 °C during reflow soldering ensures durability during manufacturing processes.

Length: 4.5 mm

Compact length facilitates overall product design and integration into small-scale circuits.

Temperature Grade: INDUSTRIAL

Industrial temperature grade denotes reliability in challenging environments, suitable for heavy-duty applications.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller, it's optimized for processing control tasks in various applications.

RAM Bytes: 128

The 128 bytes of RAM provide sufficient temporary storage for program execution, maintaining efficient operation.

Technology: CMOS

CMOS technology ensures low power consumption, ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form promotes simpler, cleaner PCB designs and is environmentally friendly.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, it matches many existing electronic systems, simplifying integration.

PWM Channels: YES

The inclusion of PWM channels enables diverse control adjustments in motor and light applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware, enhancing flexibility.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm enables compatibility with a variety of PCB designs and facilitates ease of soldering.

Speed: 8 rpm

The specified speed of 8 rpm is effective for rotation control applications, making it suitable for motor management.

No. of I/O Lines: 5

With 5 I/O lines, this microcontroller can handle multiple inputs and outputs effectively, supporting versatile applications.

Technical Specifications

Microcontrollers ST7FLITEUS5U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MINIMUM SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XDSO-N8

Length:

4.5 mm

No. of I/O Lines:

5

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.12,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

ST7FLITEUS5U6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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