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ST7FLITEU05M6

STMicroelectronics

ST7FLITEU05M6 by STMicroelectronics

ST7FLITEU05M6 microcontroller from STMicroelectronics operates at 3.3-5.5 V with a max temp of 125 °C, making it ideal for automotive applications. It features 8-bit architecture, 2048 ROM words, and supports ADC/PWM channels. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,049 parts In-Stock

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6,049

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Digiode

USA . 3,135 parts In-Stock

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3,135

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Anansix

USA . 1,173 parts In-Stock

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1,173

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 234 parts In-Stock

1+ parts

$1.840

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-

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234

$1.840

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AZTECH Wire

Italy . 738 parts In-Stock

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$19.600

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738

$19.600

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IDEA Electronic Components Group

UK . 163 parts In-Stock

1+ parts

$32.791

100+ parts

-

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$29.512

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163

$32.791

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$29.512

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MKK Technologies

India . 252 parts In-Stock

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$61.661

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252

$61.661

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DigiPath Technology Company

USA . 252 parts In-Stock

1+ parts

$61.661

100+ parts

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252

$61.661

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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Corphita

USA . 2,498 parts In-Stock

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2,498

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Parana Technologies

USA . 756 parts In-Stock

1+ parts

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$39.206

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756

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$39.206

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Overview

Unlock the potential of your next project with the ST7FLITEU05M6 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a robust solution perfect for automotive applications and more. With its compact design, versatile power supply options, and reliable performance in extreme temperatures, this microcontroller offers unmatched value, empowering you to create efficient, high-quality designs that stand out in today’s technology landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the microcontroller lightweight and provides durability against environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design and simplifies the assembly process in automated environments.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a wide range of power supply options.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient space utilization on printed circuit boards (PCBs).

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many applications, balancing performance and cost.

Power Supplies (V): 3/5

The versatility in supply voltage options makes this microcontroller adaptable to various power requirements.

No. of Terminals: 8

With 8 terminals, this microcontroller is suitable for simple applications while keeping the design straightforward.

Package Style (Meter): SMALL OUTLINE

The small outline design makes this microcontroller ideal for space-constrained applications.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V enhances energy efficiency, making it suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Designed to operate at high temperatures, this microcontroller is reliable in demanding automotive and industrial environments.

CPU Family: ST72

Part of the ST72 family, it benefits from a rich ecosystem of development tools and resources, facilitating easier integration.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme environmental conditions, ensuring reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and improves the reliability of electrical connections.

ADC Channels: YES

Integrated ADC channels allow for quick and efficient analog signal processing, making it suitable for sensor applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout design, simplifying the integration process.

ROM Words: 2048

A ROM capacity of 2048 words allows for significant program storage, accommodating complex application needs.

Maximum Seated Height: 1.75 mm

A low seated height allows for placement in ultra-thin designs, appealing for modern compact device applications.

Width: 3.9 mm

With a width of 3.9 mm, the microcontroller fits nicely in small form factor designs, enhancing versatility.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency provides adequate speed for many applications while maintaining low power consumption.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature (°C): 260

The ability to withstand a peak reflow temperature of 260 °C makes this microcontroller suitable for modern PCB assembly techniques.

Length: 4.9 mm

A compact length of 4.9 mm enables more efficient use of PCB space, accommodating more components in a limited area.

Temperature Grade: AUTOMOTIVE

Designed with automotive applications in mind, ensuring durability and reliability in harsh conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functionalities, reducing the need for additional components in a design.

RAM Bytes: 128

With 128 bytes of RAM, this microcontroller is capable of handling basic data processing tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller energy-efficient and suitable for mobile applications.

Terminal Form: GULL WING

The gull-wing terminal form enhances soldering reliability and provides robust mechanical support for the chip.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, it is compatible with common digital logic levels, simplifying integration.

PWM Channels: YES

Integrated PWM channels allow for precise control of motors and other devices, enabling smoother operation in complex applications.

ROM Programmability: FLASH

Flash ROM programmability permits easy updates and modifications to the firmware, enhancing product longevity and adaptability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm makes it easier to connect to standard PCB layouts, promoting compatibility with existing designs.

Speed: 8 rpm

A speed rating of 8 rpm indicates the microcontroller's capability to perform operations at a suitable pace for many applications.

No. of I/O Lines: 6

Having 6 I/O lines allows for decent interfacing with external devices, making it versatile for various applications.

Technical Specifications

Microcontrollers ST7FLITEU05M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

6

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

ST7FLITEU05M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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