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ST7FLITE39F2M3

STMicroelectronics

ST7FLITE39F2M3 by STMicroelectronics

ST7FLITE39F2M3 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.3V and 5.5V, and includes 7 ADC channels. Its compact design is ideal for automotive applications, ensuring reliability in extreme temperatures from -40 °C to 125 °C. With integrated LIN, SCI, and SPI connectivity, it supports versatile communication needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,454 parts In-Stock

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5,454

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Digiode

USA . 4,728 parts In-Stock

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4,728

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Anansix

USA . 1,281 parts In-Stock

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1,281

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Distributors (Availability)

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Vigor

Singapore . 2,301 parts In-Stock

1+ parts

$3.090

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-

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2,301

$3.090

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AZTECH Wire

Italy . 936 parts In-Stock

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$10.590

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936

$10.590

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Microchip USA

USA . 3,444 parts In-Stock

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$21.365

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$21.365

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

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$44.467

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$40.021

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2,068

$44.467

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$40.021

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MKK Technologies

India . 1,766 parts In-Stock

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$83.618

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1,766

$83.618

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DigiPath Technology Company

USA . 1,766 parts In-Stock

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$83.618

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1,766

$83.618

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RC Electronics

USA . 11,000 parts In-Stock

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11,000

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Corphita

USA . 4,789 parts In-Stock

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4,789

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A-Z Elektronik GmbH

Germany . 4,721 parts In-Stock

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Perfect Parts

USA . 4,614 parts In-Stock

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Parana Technologies

USA . 1,075 parts In-Stock

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$53.167

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$53.167

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Overview

Unlock the potential of your next project with the ST7FLITE39F2M3 microcontroller from STMicroelectronics! Renowned for their commitment to quality and innovation, STMicroelectronics delivers a robust solution that seamlessly integrates into automotive applications and more. With its versatile power supply range, impressive operating temperatures, and advanced peripherals, this microcontroller promises reliability, efficiency, and exceptional performance—empowering you to create cutting-edge designs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and protection from environmental factors.

Surface Mount: YES

Surface mount technology makes for compact designs and easy integration onto PCBs.

Maximum Supply Voltage: 5.5 V

This upper limit allows for flexibility in power supply options, ensuring compatibility with various applications.

Package Shape: RECTANGULAR

A rectangular shape facilitates efficient space utilization on circuit boards.

Bit Size: 8

An 8-bit architecture is suitable for basic applications while maintaining simplicity in programming.

Power Supplies (V): 3/5

The dual voltage options provide versatility for different operational requirements.

No. of Terminals: 20

With 20 terminals, the microcontroller can handle a range of inputs and outputs, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package design is ideal for space-constrained applications.

Minimum Supply Voltage: 3.3 V

Operating down to 3.3 V allows for energy-efficient designs, suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this microcontroller suitable for harsh environments.

CPU Family: ST72

The ST72 family is known for its reliability and feature set tailored for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

This ensures reliable performance in extreme cold conditions, making it suitable for outdoor applications.

Terminal Finish: TIN

TIN finish ensures good solderability and corrosion resistance, enhancing longevity.

ADC Channels: YES

Support for Analog-to-Digital Conversion allows for interfacing with a variety of sensors.

Terminal Position: DUAL

Dual terminal position can improve layout flexibility on circuit boards.

ROM Words: 8192

Ample ROM storage allows for complex programs to be stored and executed.

Maximum Seated Height: 2.65 mm

A low profile minimizes the impact on overall device height when installed.

Width: 7.5 mm

Compact width enables efficient use of board space.

Data EEPROM Size: 256

Sufficient EEPROM memory for storing configuration data and user settings.

Peripherals: TIMER(5)

Multiple timers provide timing and scheduling flexibility for various applications.

Maximum Clock Frequency: 16 MHz

A decent clock speed for many applications, balancing performance and power consumption.

Length: 12.8 mm

Short length aids in space-efficient designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications ensures durability in rigorous conditions.

Peripheral IC Type: MICROCONTROLLER

Classified as a microcontroller, this IC is ideal for embedded systems and control applications.

RAM Bytes: 384

Decent RAM capacity allows for handling more complex applications and data processing.

Technology: CMOS

CMOS technology provides low power consumption, improving battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminations provide good mechanical stability during assembly.

Analog To Digital Convertors: 7-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for precise analog signal processing.

Nominal Supply Voltage: 5 V

Operating at a common nominal voltage makes integration straightforward with standard power supplies.

PWM Channels: YES

PWM capabilities allow for efficient motor control and other applications requiring analog-like signals.

Connectivity: LIN, SCI, SPI

Supports multiple communication protocols, enhancing compatibility with other devices.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming of the device as needed.

Terminal Pitch: 1.27 mm

A standard pitch that facilitates easy PCB layout and assembly.

Speed: 16 rpm

Generous processing speed facilitates responsive performance in control tasks.

On Chip Program ROM Width: 8

The 8-bit width matches the architecture's bit size, simplifying programming processes.

No. of I/O Lines: 15

Fifteen I/O lines provide sufficient connectivity for a range of peripherals, enhancing versatility.

Technical Specifications

Microcontrollers ST7FLITE39F2M3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE39F2M3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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