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ST7FLITE35F2B6

STMicroelectronics

ST7FLITE35F2B6 by STMicroelectronics

ST7FLITE35F2B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w 3.3V and 5.5V. It includes 7 ADC channels and supports LIN, SCI, and SPI connectivity. Ideal for industrial applications due to its -40 °C to 85 °C temp range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,526 parts In-Stock

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Digiode

USA . 3,419 parts In-Stock

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Anansix

USA . 260 parts In-Stock

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260

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Microchip USA

USA . 455 parts In-Stock

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$2.137

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455

$2.137

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AZTECH Wire

Italy . 74 parts In-Stock

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$15.780

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74

$15.780

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IDEA Electronic Components Group

UK . 767 parts In-Stock

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$34.063

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$30.657

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767

$34.063

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$30.657

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MKK Technologies

India . 288 parts In-Stock

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$64.053

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288

$64.053

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DigiPath Technology Company

USA . 288 parts In-Stock

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$64.053

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288

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Kepictronics

USA . 30,276 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,244 parts In-Stock

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Vigor

Singapore . 2,777 parts In-Stock

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Parana Technologies

USA . 2,174 parts In-Stock

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$40.728

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$40.728

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Corphita

USA . 425 parts In-Stock

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S.R.D Solutions

India . 188 parts In-Stock

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Overview

Unlock the potential of your next project with the ST7FLITE35F2B6 microcontroller from STMicroelectronics, a leader in innovative technology. Combining durability with versatility, this reliable 8-bit MCU excels across various applications, from industrial automation to consumer electronics. Enjoy seamless connectivity and efficient power management while reaping the benefits of advanced features like ADC and PWM. Elevate your designs with proven quality and unmatched performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows flexibility in power supply choices, accommodating different system designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on pcbs, facilitating compact designs.

Bit Size: 8

An 8-bit architecture strikes a balance between performance and power efficiency for basic control tasks.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, providing versatility in a variety of applications.

No. of Terminals: 20

20 terminals offer ample connectivity options for peripherals and sensors, fostering integration in complex systems.

Package Style (Meter): IN-LINE

In-line package style makes this microcontroller easy to mount and solder onto pcbs.

Minimum Supply Voltage: 3.3 V

Minimum supply voltage of 3.3 V supports low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderately harsh environments.

CPU Family: ST72

Being part of the ST72 family guarantees robust performance and reliability, bolstered by established manufacturer support.

Minimum Operating Temperature: -40 °C

This capability allows usage in extreme conditions, ensuring durability in industrial and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin finish ensures better solderability and corrosion resistance, enhancing the longevity of connections.

ADC Channels: YES

Integrated ADC channels facilitate analog data processing, essential for sensor interfacing and monitoring applications.

Terminal Position: DUAL

Dual terminal positions enhance layout flexibility on pcbs, easing the design process.

ROM Words: 8192

With 8192 ROM words, it provides sufficient programmability for moderate application complexity.

Maximum Seated Height: 5.33 mm

The compact seated height accommodates space-constrained designs without sacrificing performance.

Width: 7.62 mm

A narrow width aids in space-saving designs, allowing more components within limited spaces.

Peripherals: TIMER(5)

Having five timers enhances the capabilities for timing operations, such as PWM or event counting.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides a balance of processing speed without excessive power consumption.

Length: 26.16 mm

The length of 26.16 mm is ideal for standard-sized applications, ensuring compatibility with many designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in challenging environments, suitable for a range of industrial applications.

Peripheral IC Type: MICROCONTROLLER

Standard microcontroller features enable versatile application across multiple domains, including automotive and consumer electronics.

RAM Bytes: 384

With 384 bytes of RAM, it supports basic data processing needs without overwhelming resource limitations.

Technology: CMOS

CMOS technology provides low power consumption, making it efficient for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole mounting offers robust physical support, especially important in high-vibration environments.

Analog To Digital Converters: 7-Ch 10-Bit

The inclusion of 7-channel 10-bit ADCs allows for versatile analog signal processing, crucial for sensor data readings.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with many standard components, ensuring compatibility in design.

PWM Channels: YES

PWM capability enhances control over motors and LEDs, making it suitable for diverse applications.

Connectivity: LIN, SCI, SPI

Diverse communication protocols (LIN, SCI, SPI) enable integration into various systems seamlessly.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware without hardware changes.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm makes it easy to integrate with existing designs and components.

Speed: 16 rpm

Although referencing speed might be less relevant in this context, it suggests suitable operational speeds for associated motors.

On Chip Program ROM Width: 8

An 8-bit program ROM width accommodates typical application requirements without sacrificing efficiency.

No. of I/O Lines: 15

With 15 I/O lines, it provides enough connectivity for various devices and sensors, fostering application versatility.

Technical Specifications

Microcontrollers ST7FLITE35F2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE35F2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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