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ST7FLITE29F2B6

STMicroelectronics

ST7FLITE29F2B6 by STMicroelectronics

ST7FLITE29F2B6 microcontroller from STMicroelectronics operates at 3.3-5.5 V with a max clock frequency of 16 MHz, featuring 8-bit architecture and 15 I/O lines. It supports industrial applications with -40 °C to 85 °C temp range and includes ADC channels for versatile data processing. Ideal for embedded systems, it offers robust performance in compact designs.

Median Price

$7.690

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 5 parts In-Stock

1+ parts

$7.690

100+ parts

$5.770

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$5.000

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5

$7.690

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$5.000

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Vyrian

USA . 6,548 parts In-Stock

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Digiode

USA . 3,917 parts In-Stock

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3,917

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Anansix

USA . 2,339 parts In-Stock

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2,339

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ComSIT Distribution GmbH

Germany . 658 parts In-Stock

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658

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Speed Components Ltd

Israel . 6 parts In-Stock

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6

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Halfin

Belgium . 5 parts In-Stock

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5

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Distributors (Availability)

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AZTECH Wire

Italy . 965 parts In-Stock

1+ parts

$19.750

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965

$19.750

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IDEA Electronic Components Group

UK . 2,079 parts In-Stock

1+ parts

$21.075

100+ parts

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$18.968

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2,079

$21.075

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$18.968

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Microchip USA

USA . 352 parts In-Stock

1+ parts

$25.780

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352

$25.780

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MKK Technologies

India . 1,161 parts In-Stock

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$39.631

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$39.631

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DigiPath Technology Company

USA . 1,161 parts In-Stock

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$39.631

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$39.631

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 2,644 parts In-Stock

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Vigor

Singapore . 2,281 parts In-Stock

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Perfect Parts

USA . 1,155 parts In-Stock

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1,155

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Parana Technologies

USA . 1,041 parts In-Stock

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$25.199

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1,041

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$25.199

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Overview

Elevate your projects with the ST7FLITE29F2B6 microcontroller from STMicroelectronics, a trusted leader in innovation. Boasting robust performance in a compact design, this versatile 8-bit MCU is ideal for industrial applications, offering exceptional reliability even in extreme conditions. With its powerful features, including multiple ADC channels and efficient timers, you gain flexibility and efficiency, empowering your designs to achieve new heights of functionality and precision. Experience the quality and commitment that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures a lightweight and cost-effective solution, making it suitable for a variety of applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate efficiently in standard electronic circuits without risk of damage.

Package Shape: RECTANGULAR

A rectangular package shape facilitates efficient use of PCB space, allowing for dense circuit designs.

Bit Size: 8

An 8-bit size enables compatibility with a wide range of applications, especially in cost-sensitive projects and educational purposes.

Power Supplies (V): 3/5

Dual voltage supply options (3V and 5V) provide flexibility in design and compatibility with various power standards.

No. of Terminals: 20

Having 20 terminals offers ample I/O options for interfacing with other devices and components, making it versatile for complex projects.

Package Style (Meter): IN-LINE

An in-line package style is conducive for streamlined integration into various designs, enhancing assembly efficiency.

Minimum Supply Voltage: 3.3 V

The lower minimum supply voltage of 3.3 V supports battery-operated applications, making it an excellent choice for low-power devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows it to function reliably in various environmental conditions, suitable for industrial applications.

CPU Family: ST72

The ST72 CPU family is known for its robustness, providing a reliable base for development across numerous applications.

Minimum Operating Temperature: -40 °C

Operating in environments as low as -40 °C makes this microcontroller ideal for extreme conditions, such as outdoor and automotive applications.

Terminal Finish: MATTE TIN

A matte tin finish offers good solderability and corrosion resistance, enhancing long-term reliability.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with sensors and analyze analog signals, broadening its application potential.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, simplifying assembly in various designs.

ROM Words: 8192

With 8192 ROM words, there's sufficient memory for code storage, accommodating moderate applications effectively.

Maximum Seated Height: 5.33 mm

A compact seated height of 5.33 mm helps save space on the PCB while facilitating easy integration.

Width: 7.62 mm

A narrow width of 7.62 mm is beneficial for cramped board layouts, allowing more components within a limited space.

Data EEPROM Size: 256

A size of 256 bytes for data EEPROM provides enough storage for configuration parameters and user data, enhancing functionality.

Peripherals: TIMER(4)

Four built-in timer peripherals support timing applications and multitasking in real-time systems.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for efficient processing, enabling responsive performance for demanding applications.

Length: 26.16 mm

The 26.16 mm length of the package makes it easy to integrate into various form factors without sacrificing performance.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures the device can withstand tough conditions and prolonged use in critical applications.

Peripheral IC Type: MICROCONTROLLER

Classified as a microcontroller, it is designed for handling control tasks, making it suitable for embedded systems.

RAM Bytes: 384

384 bytes of RAM is adequate for handling medium-sized data sets and application needs, ideal for resource-constrained tasks.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller suitable for battery-operated gadgets.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical stability and are easier to solder by hand, ideal for prototyping and hobbyist projects.

Analog To Digital Converters: 7-Ch 10-Bit

A 7-channel 10-bit ADC enables the microcontroller to read multiple analog signals with decent precision, expanding its utility.

Maximum Supply Current: 12 mA

A maximum supply current of 12 mA ensures it remains energy-efficient while providing enough power for active operations.

Nominal Supply Voltage: 5 V

The 5 V nominal supply is a standard for many applications, enabling easy integration into existing systems.

PWM Channels: YES

With PWM channels available, this microcontroller can control speed and intensity of motors and lights, suitable for robotics and automation.

Connectivity: SPI

SPI connectivity allows for high-speed communication with other devices, making it versatile for various applications.

ROM Programmability: FLASH

Flash programmability allows users to easily update firmware, enhancing the adaptability of the microcontroller in evolving projects.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard, promoting compatibility with common headers and breadboards for prototyping.

Speed: 8 rpm

A speed rating of 8 rpm is suitable for various control applications, providing adequate response times without overextending resources.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, it aligns well with the 8-bit architecture, allowing for streamlined instruction processing.

No. of I/O Lines: 15

Fifteen I/O lines provide ample capacity for connecting external components and sensors, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers ST7FLITE29F2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE29F2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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