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ST7FLITE25F2M6

STMicroelectronics

ST7FLITE25F2M6 by STMicroelectronics

ST7FLITE25F2M6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.3V and 5.5V, and includes 7 ADC channels. Its compact design suits industrial applications requiring reliable performance in harsh environments. Ideal for embedded systems with limited space.

Median Price

$1.990

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.990

1k+ parts

$1.780

10k+ parts

$1.670

5,000

-

$1.990

$1.780

$1.670

Distributors (In-Stock)

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Vyrian

USA . 8,965 parts In-Stock

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8,965

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ComSIT Distribution GmbH

Germany . 2,779 parts In-Stock

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2,779

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ComSIT USA

USA . 2,779 parts In-Stock

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2,779

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Anansix

USA . 2,199 parts In-Stock

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2,199

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Digiode

USA . 1,726 parts In-Stock

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1,726

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R&J Components

USA . 212 parts In-Stock

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212

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LWI Electronics Inc

India . 94 parts In-Stock

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94

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Zilex Electronics Inc.

Canada . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 316 parts In-Stock

1+ parts

$6.752

100+ parts

-

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-

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316

$6.752

-

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AZTECH Wire

Italy . 527 parts In-Stock

1+ parts

$17.430

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-

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527

$17.430

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IDEA Electronic Components Group

UK . 2,264 parts In-Stock

1+ parts

$31.020

100+ parts

-

1k+ parts

$27.918

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-

2,264

$31.020

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$27.918

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MKK Technologies

India . 1,859 parts In-Stock

1+ parts

$58.330

100+ parts

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1,859

$58.330

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DigiPath Technology Company

USA . 1,859 parts In-Stock

1+ parts

$58.330

100+ parts

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1,859

$58.330

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Component Stockers USA

USA . 772 parts In-Stock

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$99.990

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772

$99.990

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Perfect Parts

USA . 15,350 parts In-Stock

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15,350

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Vigor

Singapore . 4,406 parts In-Stock

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Corphita

USA . 903 parts In-Stock

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903

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Parana Technologies

USA . 569 parts In-Stock

1+ parts

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$37.089

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569

-

$37.089

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Kepictronics

USA . 109 parts In-Stock

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109

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Overview

Unlock your project’s full potential with the ST7FLITE25F2M6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and reliability, this compact powerhouse excels in industrial applications, delivering exceptional performance across various operating conditions. With advanced peripherals and seamless connectivity options, it empowers engineers to create efficient, cutting-edge designs while ensuring long-term stability and support. Elevate your next project with STMicroelectronics—where quality meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology enables a smaller footprint on the PCB, which is ideal for compact designs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, offering flexibility in system design and compatibility with different power sources.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and can aid in component placement during assembly.

Bit Size: 8

An 8-bit architecture is sufficient for many embedded applications, providing a balance between processing power and simplicity.

Power Supplies (V): 3/5

Dual power supply options allow for versatility in circuit design, accommodating a variety of peripherals.

No. of Terminals: 20

20 terminals provide ample connectivity options for interfacing with various components in a system.

Package Style (Meter): SMALL OUTLINE

Small outline package design contributes to space-saving in PCB layouts, ideal for compact electronic devices.

Minimum Supply Voltage: 3.3 V

Supports low voltage operation, making it suitable for battery-powered applications that prioritize power consumption.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in industrial and outdoor environments.

CPU Family: ST72

Part of the ST72 family, known for its robustness and suitability for various control and automation tasks.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 to 85 °C) ensures functionality in extreme conditions, making it ideal for industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Integrated ADC channels provide flexibility for interfacing with analog sensors, adding functionality without extra components.

Terminal Position: DUAL

Dual terminal positioning aids in more uniform heat distribution and simplifies board layout.

ROM Words: 8192

Provides sufficient ROM capacity for storing the program code, enabling complex applications within the device.

Maximum Seated Height: 2.65 mm

Compact seated height allows for low-profile designs, contributing to slimmer device form factors.

Width: 7.5 mm

Narrow width enables high-density PCB layouts, benefiting compact electronic design.

Peripherals: TIMER(4)

Multiple timers included facilitate various timing-related functionalities, essential for control applications.

Maximum Clock Frequency: 16 MHz

Reasonable clock speed ensures adequate processing power for most embedded applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum of 30 seconds at peak reflow temperature helps ensure reliable solder joint formation during assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates compatibility with lead-free soldering processes, which is important for modern manufacturing.

Length: 12.8 mm

Length of 12.8 mm complements compact designs, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the microcontroller operates reliably in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates multiple functionalities into a single chip, reducing system complexity.

RAM Bytes: 384

384 bytes of RAM provide adequate memory for variable storage and temporary data handling for most applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high speed and density, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull-wing terminals provide excellent solder joint stability and simplify the manufacturing process.

Analog To Digital Converters: 7-Ch 10-Bit

Multiple ADC channels and 10-bit resolution enhance the microcontroller's ability to interact with analog inputs effectively.

Maximum Supply Current: 12 mA

Low maximum supply current contributes to energy efficiency, making it a suitable choice for battery-operated devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is common and compatible with many components in the market.

PWM Channels: YES

The inclusion of PWM channels enables control over a variety of devices, such as motors and LEDs, enhancing application versatility.

Connectivity: SPI

SPI connectivity allows for high-speed communication with various peripherals, expanding the system's capabilities.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and reprogramming, which is vital for product lifecycle management.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a balance between ease of soldering and compactness, facilitating board assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable sensitivity to moisture, requiring proper handling but generally suitable for industrial use.

Speed: 8 rpm

A specified speed of 8 rpm is sufficient for low-speed applications, such as simple control tasks.

On Chip Program ROM Width: 8

8-bit program ROM width aligns with typical embedded control applications, facilitating straightforward programming and integration.

No. of I/O Lines: 15

15 I/O lines provide extensive connectivity options, making it flexible enough for a variety of applications.

Technical Specifications

Microcontrollers ST7FLITE25F2M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE25F2M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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