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ST7FLITE25F2B6

STMicroelectronics

ST7FLITE25F2B6 by STMicroelectronics

ST7FLITE25F2B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, supporting supply voltages from 3.3V to 5.5V. It includes 7 ADC channels and operates in industrial temperatures (-40 °C to 85 °C). Ideal for embedded applications requiring efficient processing and connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,740 parts In-Stock

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3,740

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Vyrian

USA . 3,197 parts In-Stock

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3,197

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Anansix

USA . 1,926 parts In-Stock

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1,926

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LWI Electronics Inc

India . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 901 parts In-Stock

1+ parts

$21.840

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901

$21.840

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IDEA Electronic Components Group

UK . 1,076 parts In-Stock

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$29.042

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$26.137

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1,076

$29.042

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$26.137

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MKK Technologies

India . 2,015 parts In-Stock

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$54.611

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2,015

$54.611

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DigiPath Technology Company

USA . 2,015 parts In-Stock

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$54.611

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2,015

$54.611

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Vigor

Singapore . 7,818 parts In-Stock

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Microchip USA

USA . 5,931 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,590 parts In-Stock

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Corphita

USA . 4,254 parts In-Stock

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Perfect Parts

USA . 1,487 parts In-Stock

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1,487

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Parana Technologies

USA . 761 parts In-Stock

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$34.724

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$34.724

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Cyclops Electronics Ltd (Excess)

UK . 30 parts In-Stock

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Overview

Unlock a world of possibilities with the ST7FLITE25F2B6 microcontroller from STMicroelectronics, a leader in innovative technology. This versatile chip delivers exceptional performance for various applications, from industrial automation to consumer electronics, ensuring reliability and efficiency at every turn. With robust temperature tolerance and low power consumption, it meets the demands of diverse environments while providing seamless connectivity options. Enhance your projects with superior quality and advanced features that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resilience against environmental factors, making it suitable for industrial applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for compatibility with a wide range of power supplies, ensuring flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space-saving designs, making it suitable for compact electronic devices.

Bit Size: 8

An 8-bit architecture provides a good balance between simplicity and capability for many embedded applications.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, facilitating integration into diverse systems and making it versatile.

No. of Terminals: 20

20 terminals provide a reasonable number of I/O options, allowing for good interfacing capabilities with other devices.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB design by enabling easier soldering and assembly processes.

Minimum Supply Voltage: 3.3 V

A low minimum supply voltage of 3.3 V increases power efficiency, making it suitable for battery-operated designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can function reliably in moderately demanding environments.

CPU Family: ST72

The ST72 family is well-known for its robust performance and reliability in various embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this controller suitable for harsh environmental conditions and industrial applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and corrosion resistance, enhancing the longevity of connections.

ADC Channels: YES

The presence of ADC channels allows for direct sensor integration, broadening the application scope in embedded systems.

Terminal Position: DUAL

Dual terminal position facilitates flexible mounting options, making the product adaptable to different PCB layouts.

ROM Words: 8192

8192 ROM words provide substantial program memory for complex applications, allowing for more features and functionalities.

Maximum Seated Height: 5.33 mm

A maximum seated height of 5.33 mm supports compact design requirements, essential for modern electronic devices.

Width: 7.62 mm

The compact width of 7.62 mm makes it suitable for space-constrained applications, enhancing design flexibility.

Peripherals: TIMER(4)

Four timers provide essential timing functionalities for control and automation tasks, enhancing application versatility.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for responsive performance in microcontroller tasks, ensuring efficiency.

Length: 26.16 mm

The length of 26.16 mm keeps the microcontroller compact while providing ample functionality for various applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, ensuring reliability in challenging environments, making it ideal for industrial automation.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, it combines processing power with peripheral interfaces, streamlining embedded system design.

RAM Bytes: 384

384 bytes of RAM support efficient data handling for small to medium-sized applications, striking a good balance between capacity and cost.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, beneficial for battery-powered applications.

Terminal Form: THROUGH-HOLE

Through-hole technology provides robustness and ease of mounting in various PCB configurations.

Analog To Digital Converters: 7-Ch 10-Bit

With 7 channels of 10-bit ADC, this microcontroller can accurately read multiple analog sensors, adding to its versatility.

Maximum Supply Current: 12 mA

A maximum supply current of 12 mA ensures low power usage in a wide range of applications, contributing to energy efficiency.

Nominal Supply Voltage: 5 V

Operating at a nominal supply of 5 V ensures compatibility with many existing components and devices in the market.

PWM Channels: YES

The availability of PWM channels allows for precise control of motors and other devices, expanding application possibilities.

Connectivity: SPI

Support for SPI connectivity enables high-speed communication with other microcontrollers and peripheral devices.

ROM Programmability: FLASH

The use of FLASH for ROM programmability allows for easy updates and modifications to the embedded software.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard for many applications, ensuring compatibility with a wide range of components.

Speed: 8 rpm

The speed of 8 rpm is indicative of the controller's capability to manage low-speed applications effectively.

On Chip Program ROM Width: 8

An 8-bit program ROM width is efficient for handling data in various control operations, contributing to flexibility.

No. of I/O Lines: 15

Having 15 I/O lines allows for extensive interfacing options, making it an excellent choice for complex embedded systems.

Technical Specifications

Microcontrollers ST7FLITE25F2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE25F2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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