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ST7FLITE09F0U6

STMicroelectronics

ST7FLITE09F0U6 by STMicroelectronics

ST7FLITE09F0U6 microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w -40 °C to 85 °C, and supports 5 ADC channels. With 1536 ROM words and 128 bytes of EEPROM, it's ideal for industrial applications requiring reliable performance. Its compact chip carrier design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,890 parts In-Stock

1+ parts

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3,890

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Vyrian

USA . 3,211 parts In-Stock

1+ parts

-

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-

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3,211

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Anansix

USA . 1,781 parts In-Stock

1+ parts

-

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1,781

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 449 parts In-Stock

1+ parts

$2.448

100+ parts

-

1k+ parts

-

10k+ parts

-

449

$2.448

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AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$17.560

100+ parts

-

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10k+ parts

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300

$17.560

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IDEA Electronic Components Group

UK . 2,205 parts In-Stock

1+ parts

$71.301

100+ parts

-

1k+ parts

$64.171

10k+ parts

-

2,205

$71.301

-

$64.171

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MKK Technologies

India . 2,370 parts In-Stock

1+ parts

$134.077

100+ parts

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2,370

$134.077

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DigiPath Technology Company

USA . 2,370 parts In-Stock

1+ parts

$134.077

100+ parts

-

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10k+ parts

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2,370

$134.077

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Corphita

USA . 2,116 parts In-Stock

1+ parts

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2,116

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Parana Technologies

USA . 1,322 parts In-Stock

1+ parts

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100+ parts

$85.251

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1,322

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$85.251

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Overview

Transform your projects with the ST7FLITE09F0U6 microcontroller from STMicroelectronics, a trusted leader in innovation. This compact yet powerful 8-bit solution is designed for a range of applications—from industrial automation to consumer electronics—delivering exceptional performance and reliability even in extreme conditions. With features like integrated ADC channels and versatile connectivity options, it empowers developers to bring their ideas to life, ensuring quality and efficiency every step of the way.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supply options, ensuring versatility in various applications.

Package Shape: SQUARE

Square packages facilitate easier placement on PCBs and are well-suited for high-density designs.

Bit Size: 8

8-bit architecture allows for simpler design and lower power consumption, suitable for many control applications.

No. of Terminals: 20

Provides a sufficient number of connection points for interfacing with other components, enhancing design flexibility.

Package Style (Meter): CHIP CARRIER

Chip carrier packages are reliable and easy to handle, making them a practical choice for manufacturing.

Minimum Supply Voltage: 3.3 V

Lower voltage requirements enable energy-efficient operations, extending the battery life in portable applications.

Maximum Operating Temperature: 85 °C

High-temperature tolerance ensures stability and reliability in industrial environments.

Minimum Operating Temperature: -40 °C

Low-temperature capability makes it suitable for harsh operating conditions and outdoor applications.

ADC Channels: YES

With onboard Analog-to-Digital Converters, this microcontroller can easily interface with analog sensors for monitoring and control.

Terminal Position: QUAD

Quad terminal positioning aids in better connectivity and reduces the risk of errors during assembly.

ROM Words: 1536

Ample ROM storage allows for the development of complex programs, enabling advanced functionality in applications.

Data EEPROM Size: 128

Sufficient EEPROM size for storing configuration settings and user data, enhancing the microcontroller's utility.

Peripherals: TIMER(2)

Multiple timers enable precise control and timing operations in various applications, enhancing capabilities.

Maximum Clock Frequency: 16 MHz

Higher clock frequency allows for faster processing speeds, improving performance in time-sensitive applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller offers increased durability and longevity.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it simplifies design by integrating necessary functions into a single chip.

RAM Bytes: 128

Adequate RAM for handling temporary data storage needs, enabling smoother operational performance.

Technology: CMOS

CMOS technology offers lower power consumption and higher noise immunity, making it reliable for various applications.

Terminal Form: NO LEAD

No-lead terminals enhance thermal performance and reduce packaging stress during soldering.

Analog To Digital Converters: 5-Ch 8-Bit

Multiple ADC channels allow for simultaneous reading from various sensors, enhancing system integration.

Nominal Supply Voltage: 5 V

Standard 5V operation integrates well with common components and makes power supply configurations straightforward.

PWM Channels: YES

The presence of PWM channels allows for precise control of motors and other actuators, expanding the product's application range.

Connectivity: SPI

SPI connectivity supports fast communication with other devices, facilitating real-time data exchange.

ROM Programmability: FLASH

Flash programmability provides flexibility to update code, allowing for iterative design and bug fixes without hardware changes.

Speed: 16 rpm

Operates efficiently at a relatively low speed, suitable for applications requiring accurate control over speed-sensitive processes.

On Chip Program ROM Width: 8

8-bit program ROM width supports efficient coding practices and is ideal for many embedded applications.

No. of I/O Lines: 13

Thirteen I/O lines provide substantial interfacing options, enabling the connection of multiple sensors and actuators.

Technical Specifications

Microcontrollers ST7FLITE09F0U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.4 V MINIMUM SUPPLY @ 8 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N20

No. of I/O Lines:

13

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1536

ROM Programmability:

FLASH

Speed:

16 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

SPI

Peripherals:

TIMER(2)

Analog To Digital Convertors:

5-Ch 8-Bit

Trade Compliance

ST7FLITE09F0U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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