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ST7FLITE05Y0M6

STMicroelectronics

ST7FLITE05Y0M6 by STMicroelectronics

ST7FLITE05Y0M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85 °C. It supports SPI connectivity and includes 5 ADC channels for versatile applications. Ideal for industrial use, it operates on supply voltages of 3.3V to 5.5V.

Median Price

$1.109

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 50 parts In-Stock

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-

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$1.111

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50

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$1.111

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Arrow

USA . 50 parts In-Stock

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$1.107

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50

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$1.107

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Vyrian

USA . 5,077 parts In-Stock

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5,077

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Chip Stock

USA . 4,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,857 parts In-Stock

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Digiode

USA . 2,668 parts In-Stock

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Anansix

USA . 1,325 parts In-Stock

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ComSIT Distribution GmbH

Germany . 557 parts In-Stock

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557

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ComSIT USA

USA . 307 parts In-Stock

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R&J Components

USA . 213 parts In-Stock

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Prism Electronics

USA . 22 parts In-Stock

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Classic Components Corporation

USA . 6 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$12.540

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581

$12.540

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Microchip USA

USA . 467 parts In-Stock

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$49.628

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467

$49.628

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IDEA Electronic Components Group

UK . 608 parts In-Stock

1+ parts

$71.467

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$64.321

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608

$71.467

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$64.321

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MKK Technologies

India . 1,231 parts In-Stock

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$134.390

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$134.390

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$134.390

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Perfect Parts

USA . 71,017 parts In-Stock

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71,017

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Kepictronics

USA . 40,120 parts In-Stock

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Vigor

Singapore . 9,115 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,174 parts In-Stock

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S.R.D Solutions

India . 3,003 parts In-Stock

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Parana Technologies

USA . 2,162 parts In-Stock

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$85.450

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Corphita

USA . 2,145 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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iodParts Technologies Inc.

India . 307 parts In-Stock

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307

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Overview

Unlock limitless possibilities with the ST7FLITE05Y0M6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this compact powerhouse is ideal for industrial applications, offering reliability even in extreme temperatures. Enjoy enhanced performance with low power consumption while benefiting from seamless integration. Elevate your projects with a proven solution that combines cutting-edge technology and exceptional customer support—experience the difference with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resistance to environmental elements, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility for a range of applications across different power requirements.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for circuit layout and optimizing board space.

Bit Size: 8

An 8-bit architecture is typically sufficient for a variety of embedded applications, balancing performance and complexity.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies makes it versatile for integration into existing systems.

No. of Terminals: 16

With 16 terminals, it offers adequate connectivity options for multiple peripherals while keeping the design compact.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in compact designs, crucial for space-constrained applications.

Minimum Supply Voltage: 3.3 V

The ability to operate at 3.3V makes it suitable for low-power applications while maintaining good performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderately high-temperature environments.

CPU Family: ST72

Being part of the ST72 family connects this microcontroller to a well-established ecosystem, simplifying design and development.

Minimum Operating Temperature: -40 °C

Operating from -40 °C makes it ideal for industrial applications where extreme temperature conditions are common.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and improves connection reliability during assembly.

ADC Channels: YES

On-chip ADC channels allow for direct sensor interfacing, simplifying the design of data acquisition systems.

Terminal Position: DUAL

Dual terminal positioning supports efficient use of PCB space and facilitates better electrical performance.

ROM Words: 1536

A ROM capacity of 1536 words allows for versatile program storage without needing external memory.

Maximum Seated Height: 1.75 mm

A low seated height supports compact design while ensuring compatibility with other surface-mount components.

Width: 3.9 mm

A narrow width of 3.9 mm enables dense PCB layouts for small form factor applications.

Peripherals: TIMER(2)

Integrated timers provide essential functionality for time-sensitive applications, reducing the need for additional components.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for adequate processing speed for many control and monitoring tasks.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering processes, making it suitable for robust assembly methods.

Length: 9.9 mm

The compact length assists in making efficient use of PCB space and suits a variety of applications.

Temperature Grade: INDUSTRIAL

The industrial grade ensures reliability and performance in challenging environments and applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is designed for embedded applications, combining processing and control in a single device.

RAM Bytes: 128

128 bytes of RAM is adequate for handling lightweight tasks and operational data in embedded systems.

Technology: CMOS

CMOS technology contributes to low power consumption, increased performance, and reliability.

Terminal Form: GULL WING

Gull wing terminals provide enhanced soldering surface area, leading to improved connection reliability.

Analog To Digital Convertors: 5-Ch 8-Bit

Five channels of 8-bit ADC enable the microcontroller to handle multiple analog inputs effectively.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA indicates low power consumption, ideal for battery-operated devices.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, it aligns with standard digital logic levels, enhancing compatibility.

PWM Channels: YES

Pulse-width modulation channels facilitate motor control and signal generation, expanding application possibilities.

Connectivity: SPI

SPI connectivity allows for high-speed communication with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and reprogramming, making it flexible for development.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides a balance between compactness and ease of soldering.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates the device can be exposed to moisture environments, ensuring durability.

Speed: 16 rpm

A speed of 16 rpm indicates moderate performance suitable for various control applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data handling and interfacing with 8-bit peripherals.

No. of I/O Lines: 13

Thirteen I/O lines provide ample interface options with additional peripherals and sensors.

Technical Specifications

Microcontrollers ST7FLITE05Y0M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.4 V MINIMUM SUPPLY @ 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

13

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1536

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(2)

Analog To Digital Convertors:

5-Ch 8-Bit

Trade Compliance

ST7FLITE05Y0M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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