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ST7FLIT19BY0B6

STMicroelectronics

ST7FLIT19BY0B6 by STMicroelectronics

ST7FLIT19BY0B6 microcontroller from STMicroelectronics operates at 3.3-5.5 V with a max clock frequency of 16 MHz and features 2048 ROM words. It supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,952 parts In-Stock

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4,952

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Vyrian

USA . 2,527 parts In-Stock

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2,527

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Anansix

USA . 975 parts In-Stock

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975

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 299 parts In-Stock

1+ parts

$1.893

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299

$1.893

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AZTECH Wire

Italy . 1,098 parts In-Stock

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$13.560

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1,098

$13.560

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IDEA Electronic Components Group

UK . 394 parts In-Stock

1+ parts

$42.450

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$38.205

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394

$42.450

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$38.205

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MKK Technologies

India . 459 parts In-Stock

1+ parts

$79.824

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459

$79.824

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DigiPath Technology Company

USA . 459 parts In-Stock

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$79.824

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459

$79.824

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Component Stockers USA

USA . 722 parts In-Stock

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$99.990

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722

$99.990

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Vigor

Singapore . 2,602 parts In-Stock

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2,602

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Corphita

USA . 1,728 parts In-Stock

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1,728

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Parana Technologies

USA . 383 parts In-Stock

1+ parts

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$50.755

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383

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$50.755

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Perfect Parts

USA . 78 parts In-Stock

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78

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Cyclops Electronics Ltd (Excess)

UK . 35 parts In-Stock

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35

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Overview

Elevate your projects with the ST7FLIT19BY0B6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for robustness and reliability, this powerful 8-bit MCU excels in industrial applications, offering superior performance even in extreme environments. Seamlessly integrate advanced features like ADC and PWM capabilities, ensuring optimal efficiency and responsiveness. Choose STMicroelectronics for quality you can trust and unlock endless possibilities for your next design!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy packaging provides excellent protection against environmental factors, making the microcontroller suitable for various applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the microcontroller can operate in a range of standard electronic applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into a variety of circuit boards and layouts, enhancing its usability in diverse projects.

Bit Size: 8

Being an 8-bit microcontroller makes it ideal for simpler tasks, providing an efficient solution for embedded systems that do not require high processing power.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies enhances compatibility with different sensors and components, making it versatile in mixed-voltage environments.

No. of Terminals: 16

With 16 terminals, it strikes a balance between complexity and functionality, suitable for a range of applications without overwhelming the design.

Package Style (Meter): IN-LINE

The in-line package style facilitates straightforward PCB assembly and minimizes space requirements, catering to compact designs.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V allows it to operate efficiently in low-power applications, making it energy-efficient and ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C ensures reliability in demanding industrial environments, enhancing its operational longevity.

CPU Family: ST72

The ST72 CPU family is known for its robustness and efficiency, providing reliable performance for various embedded applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes it suitable for extreme environments, ensuring consistent performance even in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances corrosion resistance and ensures better conductivity, which contributes to overall device reliability.

ADC Channels: YES

Having ADC channels enables the microcontroller to interact with analog signals, allowing for greater application flexibility in sensing and data acquisition.

Terminal Position: DUAL

Dual terminal positioning simplifies the integration process into various PCB layouts and minimizes space, enhancing design efficiency.

ROM Words: 2048

With 2048 ROM words, it provides ample program storage for moderate applications, enabling more complex functionality within a compact footprint.

Maximum Seated Height: 5.33 mm

A compact seated height enables integration into low-profile designs, making it suitable for space-constrained applications.

Width: 7.62 mm

The 7.62 mm width allows for easy placement on various PCB layouts, enhancing the microcontroller's adaptability.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, it offers a balance of performance and power consumption, ideal for many embedded processing tasks.

Length: 19.18 mm

A length of 19.18 mm ensures a compact footprint, making it easy to integrate into confined spaces while still providing adequate functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees performance in challenging environments, making it a reliable choice for industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it's versatile for various embedded applications, offering control, processing, and interaction capabilities.

RAM Bytes: 256

With 256 bytes of RAM, it adequately supports basic application needs, allowing for simple data processing and temporary data storage.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered and sensitive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical attachment to PCBs, ensuring durability and reliability in applications requiring solid connections.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA indicates low power consumption, enhancing its suitability for portable and low-energy applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V ensures compatibility with a wide range of components and power supplies in circuit designs.

PWM Channels: YES

PWM channels enable the generation of analog-like signals, expanding its functionality for motor control and signal modulation applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications during development, making it more flexible for prototyping and product iteration.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard in many electronic components, enhancing compatibility and ease of use in various designs.

Speed: 8 rpm

A speed of 8 rpm indicates the microcontroller's capability to manage slower processes and controls effectively, making it suitable for applications requiring gradual adjustments.

No. of I/O Lines: 17

Seventeen I/O lines provide ample connections for interfacing with peripherals, enhancing the microcontroller's adaptability in various applications.

Technical Specifications

Microcontrollers ST7FLIT19BY0B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.18 mm

No. of I/O Lines:

17

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

ST7FLIT19BY0B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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