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ST7FLIT15BF0M3

STMicroelectronics

ST7FLIT15BF0M3 by STMicroelectronics

ST7FLIT15BF0M3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 125 °C. It supports up to 2048 ROM words and includes ADC channels for versatile applications in automotive systems. Its compact design and dual terminal position make it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,389 parts In-Stock

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8,389

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Anansix

USA . 2,557 parts In-Stock

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2,557

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Bristol Electronics

USA . 182 parts In-Stock

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182

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Digiode

USA . 74 parts In-Stock

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74

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Microchip USA

USA . 944 parts In-Stock

1+ parts

$14.251

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944

$14.251

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AZTECH Wire

Italy . 316 parts In-Stock

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$21.970

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316

$21.970

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IDEA Electronic Components Group

UK . 408 parts In-Stock

1+ parts

$73.275

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$65.948

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408

$73.275

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$65.948

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MKK Technologies

India . 2,139 parts In-Stock

1+ parts

$137.789

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2,139

$137.789

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DigiPath Technology Company

USA . 2,139 parts In-Stock

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$137.789

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2,139

$137.789

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 3,920 parts In-Stock

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3,920

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Parana Technologies

USA . 2,032 parts In-Stock

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$87.612

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2,032

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$87.612

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Vigor

Singapore . 1,191 parts In-Stock

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Overview

Unlock the potential of your next project with the ST7FLIT15BF0M3 microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for versatile applications, this compact powerhouse offers exceptional performance in automotive environments, ensuring durability and efficiency. With built-in peripherals and low power consumption, it streamlines development while maximizing functionality, delivering unmatched value and benefits for engineers seeking quality and excellence in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various applications.

Surface Mount: YES

Surface mount technology offers compact design and ease of integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

Allows for versatile application within safe voltage limits for many electronic systems.

Package Shape: RECTANGULAR

Rectangular packaging is efficient for PCB layout, optimizing space and performance.

Bit Size: 8

8-bit architecture provides simplicity and is ideal for low-power applications.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, enhancing its usability across various designs.

No. of Terminals: 20

Adequate number of terminals supports a variety of peripheral connections for complex tasks.

Package Style (Meter): SMALL OUTLINE

Small outline design allows for minimized board space use, beneficial in compact devices.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage makes it suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable performance in harsh environments.

CPU Family: ST72

Proven architecture known for its efficiency and performance in microcontroller applications.

Minimum Operating Temperature: -40 °C

Wide temperature range makes it an excellent choice for automotive and industrial applications.

Terminal Finish: TIN

Tin finish enhances solderability and ensures long-term reliability in electronic assemblies.

ADC Channels: YES

Integrated ADC channels facilitate effective data conversion from analog sensors.

Terminal Position: DUAL

Dual terminal position supports a variety of mounting configurations for versatility.

ROM Words: 2048

Generous flash memory capacity supports complex programs and functionalities.

Maximum Seated Height: 2.65 mm

Low profile allows for space-saving designs without compromising performance.

Width: 7.5 mm

Compact width helps in fitting into smaller electronic devices, broadening design options.

Peripherals: COMPARATOR, TIMER(5)

Includes essential peripherals enhancing the functionality for timer and comparison tasks.

Maximum Clock Frequency: 16 MHz

Adequate processing speed for most microcontroller applications ensuring responsive performance.

Length: 12.8 mm

Compact length contributes to overall miniaturization of electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ideal for automotive control systems.

Peripheral IC Type: MICROCONTROLLER

Versatile microcontroller setup is suitable for numerous applications in electronics.

RAM Bytes: 256

Sufficient RAM for managing multiple variables and functions in embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption, enhancing battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering.

Analog To Digital Converters: 7-Ch 10-Bit

Multiple ADC channels with 10-bit resolution support precise measurements in applications.

Maximum Supply Current: 9 mA

Low current consumption optimizes energy efficiency, especially for battery-operated devices.

Nominal Supply Voltage: 5 V

Ideal nominal voltage allows for reliable operation in standard electronic designs.

PWM Channels: YES

Integrated PWM channels enable advanced control over motors and other drives.

Connectivity: SPI

Supports SPI connectivity allowing for high-speed communication between devices.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updates of the firmware.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with various PCB layouts and components.

Speed: 8 rpm

Operational speed ideal for applications requiring gradual processes, enhancing system stability.

On Chip Program ROM Width: 8

8-bit wide program ROM supports efficient processing for compatible architectures.

No. of I/O Lines: 17

A plentiful I/O line count benefits complex I/O operations for diverse applications.

Technical Specifications

Microcontrollers ST7FLIT15BF0M3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

COMPARATOR, TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLIT15BF0M3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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