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ST7FLI49MK1T6TR

STMicroelectronics

ST7FLI49MK1T6TR by STMicroelectronics

ST7FLI49MK1T6TR by STMicroelectronics is an 8-bit microcontroller with 2.5/5V power supplies, 4096 ROM words, and 384 RAM bytes. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and FLASH ROM programmability. Package style is flatpack with a square shape and matte tin finish, making it suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,544 parts In-Stock

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5,544

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Digiode

USA . 1,707 parts In-Stock

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1,707

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Anansix

USA . 1,626 parts In-Stock

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1,626

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 228 parts In-Stock

1+ parts

$6.942

100+ parts

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228

$6.942

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AZTECH Wire

Italy . 154 parts In-Stock

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$17.090

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154

$17.090

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IDEA Electronic Components Group

UK . 855 parts In-Stock

1+ parts

$35.975

100+ parts

-

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$32.377

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855

$35.975

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$32.377

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MKK Technologies

India . 785 parts In-Stock

1+ parts

$67.648

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785

$67.648

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DigiPath Technology Company

USA . 785 parts In-Stock

1+ parts

$67.648

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785

$67.648

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Kepictronics

USA . 21,000 parts In-Stock

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21,000

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Vigor

Singapore . 5,316 parts In-Stock

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5,316

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A-Z Elektronik GmbH

Germany . 2,877 parts In-Stock

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2,877

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Corphita

USA . 2,219 parts In-Stock

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2,219

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Parana Technologies

USA . 845 parts In-Stock

1+ parts

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$43.013

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845

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$43.013

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Overview

Unleash the power of innovation with the ST7FLI49MK1T6TR microcontroller by STMicroelectronics. Designed with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From automotive electronics to industrial automation, this product delivers exceptional value and benefits to customers looking for cutting-edge solutions. Elevate your projects to new heights with the ST7FLI49MK1T6TR and experience the quality and advantages that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microcontroller, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

Square shape makes it easy to handle and place on the PCB during assembly.

Bit Size: 8

8-bit architecture is suitable for various low to mid-level computing applications, offering a good balance of performance and cost.

Power Supplies (V): 2.5/5

Dual power supply options provide flexibility in voltage requirements, accommodating a wider range of applications.

No. of Terminals: 32

Sufficient number of terminals for connecting external components and peripherals, enhancing the capabilities of the microcontroller.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the microcontroller to function reliably in various environmental conditions, including extreme cold.

ROM Words: 4096

A large ROM size allows for storing a significant amount of program code and data, enabling complex and feature-rich applications.

RAM Bytes: 384

A decent amount of RAM for temporary data storage, facilitating efficient processing and multitasking.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling updates and modifications to the software without the need for special equipment.

Technical Specifications

Microcontrollers ST7FLI49MK1T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

ST72

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ST7FLI49MK1T6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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