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ST7FDALIF2M6

STMicroelectronics

ST7FDALIF2M6 by STMicroelectronics

ST7FDALIF2M6 microcontroller from STMicroelectronics operates at 3.3-5.5 V with a max clock frequency of 16 MHz, featuring 8-bit architecture and 15 I/O lines. It supports DALI and SPI connectivity, making it ideal for industrial applications. With a robust temperature range of -40 °C to 85 °C, it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,200 parts In-Stock

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Digiode

USA . 3,163 parts In-Stock

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Anansix

USA . 785 parts In-Stock

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785

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Microchip USA

USA . 293 parts In-Stock

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$5.210

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293

$5.210

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AZTECH Wire

Italy . 161 parts In-Stock

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$8.840

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161

$8.840

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IDEA Electronic Components Group

UK . 57 parts In-Stock

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$28.319

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$25.487

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57

$28.319

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$25.487

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MKK Technologies

India . 2,314 parts In-Stock

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$53.253

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DigiPath Technology Company

USA . 2,314 parts In-Stock

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$53.253

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QUARKTWIN TECHNOLOGY LTD

USA . 29,925 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,501 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Metaverse IC Inc.

Canada . 4,000 parts In-Stock

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Perfect Parts

USA . 3,272 parts In-Stock

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Corphita

USA . 1,324 parts In-Stock

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Parana Technologies

USA . 433 parts In-Stock

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$33.860

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Assy Fe

Spain . 34 parts In-Stock

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Overview

Unlock unparalleled performance with the ST7FDALIF2M6 microcontroller from STMicroelectronics, your trusted partner in innovative solutions. Boasting robust industrial-grade quality, this versatile 8-bit MCU excels in a range of applications, from home automation to industrial control systems. Enjoy enhanced connectivity and energy efficiency while benefiting from ST's commitment to reliability and cutting-edge technology. Elevate your projects with a product designed for excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and light, plastic/epoxy materials enhance reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a variety of digital circuits.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient, making it easier to layout PCBs.

Bit Size: 8

An 8-bit architecture is suitable for low power applications, making it ideal for embedded systems.

Power Supplies (V): 3/5

Dual supply voltage supports design flexibility for various applications.

No. of Terminals: 20

With 20 terminals, this microcontroller provides ample connectivity options for peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline packages maximize PCB space, allowing for more components in compact designs.

Minimum Supply Voltage: 3.3 V

Suitable for low-voltage applications, this microcontroller conserves power and reduces heat generation.

Maximum Operating Temperature: 85 °C

High operating temperature range makes this component suitable for industrial applications.

CPU Family: ST72

The ST72 CPU family is known for versatility and reliability in embedded applications.

Minimum Operating Temperature: -40 °C

With a wide operational temperature range, it can function effectively in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality finish improves solderability and long-term reliability in connections.

ADC Channels: YES

Built-in ADC channels facilitate direct interfacing with analog sensors, enhancing functionality.

Terminal Position: DUAL

Dual terminal positioning helps achieve a balanced PCB layout for improved performance.

ROM Words: 8192

An 8192-word ROM size allows for substantial program storage capacity.

Maximum Seated Height: 2.65 mm

Low height allows for slim designs, making it suitable for space-constrained applications.

Width: 7.5 mm

Compact width allows for high-density layouts on PCBs.

Data EEPROM Size: 256

The 256-byte data EEPROM is ideal for storing configuration data without using external memory.

Peripherals: TIMER(4)

Four timers provide extensive timing and control capabilities for various tasks.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures efficient processing speeds for most applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for robust soldering processes without risking damage to the IC.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance makes it suitable for advanced soldering techniques.

Length: 12.8 mm

Compact length aids in fitting multiple components into small PCB areas.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type provides integrated processing and control features in one package.

RAM Bytes: 384

384 bytes of RAM support moderate data handling, suitable for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption, enhancing battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and easier placement on PCBs.

Analog To Digital Convertors: 7-Ch 10-Bit

Seven 10-bit ADC channels facilitate precise analog signal processing for various applications.

Maximum Supply Current: 12 mA

Low supply current contributes to energy-efficient designs and extended battery life.

Nominal Supply Voltage: 5 V

5 V nominal voltage is standard, making it easy to integrate into existing digital systems.

PWM Channels: YES

PWM capabilities allow for precise control of motors and other actuators, enhancing versatility.

Connectivity: DALI, SPI

Supports multiple communication protocols, enabling integration in diverse systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 1.27 mm

This pitch size accommodates tight component placements while maintaining manufacturability.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity, suitable for handling with standard precautions.

Speed: 8 rpm

The speed specification indicates applications such as control systems and robotics where precise speed is needed.

On Chip Program ROM Width: 8

An 8-bit program ROM width simplifies software development and minimizes complexity.

No. of I/O Lines: 15

Fifteen I/O lines provide ample connectivity for sensors, switches, and other peripherals.

Technical Specifications

Microcontrollers ST7FDALIF2M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MINIMUM SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

DALI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FDALIF2M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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