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ST7590

STMicroelectronics

ST7590 by STMicroelectronics

ST7590 by STMicroelectronics is a CMOS IC with 48 terminals, operating at -40 to 85 °C. It has a supply voltage of 18V and max current of 30mA. This chip carrier is surface mountable and suitable for industrial applications requiring telecom interface functions.

Median Price

$10.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,408 parts In-Stock

1+ parts

$0.407

100+ parts

$0.312

1k+ parts

$0.256

10k+ parts

$0.248

1,408

$0.407

$0.312

$0.256

$0.248

DigiKey

USA . 1,314 parts In-Stock

1+ parts

$9.870

100+ parts

$6.623

1k+ parts

$6.501

10k+ parts

-

1,314

$9.870

$6.623

$6.501

-

Newark

USA . 34 parts In-Stock

1+ parts

$10.170

100+ parts

$7.030

1k+ parts

$6.750

10k+ parts

-

34

$10.170

$7.030

$6.750

-

Verical

USA . 34 parts In-Stock

1+ parts

-

100+ parts

$10.383

1k+ parts

-

10k+ parts

-

34

-

$10.383

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,338 parts In-Stock

1+ parts

$0.387

100+ parts

-

1k+ parts

-

10k+ parts

-

1,338

$0.387

-

-

-

Vyrian

USA . 4,415 parts In-Stock

1+ parts

$0.407

100+ parts

-

1k+ parts

-

10k+ parts

-

4,415

$0.407

-

-

-

Anansix

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,704

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,180 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

-

10k+ parts

-

3,180

$0.366

-

-

-

Continental Prestige Electronics

USA . 1,078 parts In-Stock

1+ parts

$7.430

100+ parts

$5.580

1k+ parts

-

10k+ parts

-

1,078

$7.430

$5.580

-

-

IDEA Electronic Components Group

UK . 1,632 parts In-Stock

1+ parts

$9.396

100+ parts

-

1k+ parts

$8.456

10k+ parts

-

1,632

$9.396

-

$8.456

-

MKK Technologies

India . 1,716 parts In-Stock

1+ parts

$17.668

100+ parts

-

1k+ parts

-

10k+ parts

-

1,716

$17.668

-

-

-

DigiPath Technology Company

USA . 1,716 parts In-Stock

1+ parts

$17.668

100+ parts

-

1k+ parts

-

10k+ parts

-

1,716

$17.668

-

-

-

Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

-

100+ parts

$11.234

1k+ parts

-

10k+ parts

-

2,351

-

$11.234

-

-

Perfect Parts

USA . 582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

582

-

-

-

-

Overview

Experience seamless connectivity and exceptional performance with the ST7590 by STMicroelectronics. As a trusted industry leader, STMicroelectronics delivers top-notch quality in every product they create. The ST7590 falls under the category of Other Function Telecom Interface ICs, making it a versatile solution for various applications. With its advanced technology and industrial-grade temperature resistance, this chip carrier package offers unmatched reliability and efficiency. Trust STMicroelectronics to provide you with the cutting-edge technology you need for your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and labor costs.

Power Supplies (V): 18

Operates at a standard voltage level of 18V, suitable for many telecom applications.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperature environments without sacrificing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Other Function Telecom Interface ICs ST7590 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

18

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

30 mA

Nominal Supply Voltage:

18 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

ST7590 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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