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ST735CN

STMicroelectronics

ST735CN by STMicroelectronics

ST735CN by STMicroelectronics is a BICMOS switching regulator designed for automotive applications, featuring a max output current of 2 A and operating temp range from -40 °C to 125 °C. It supports a nominal input voltage of 5 V with PWM control at up to 160 kHz. Packaged in an 8-terminal, through-hole design, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,797 parts In-Stock

1+ parts

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1,797

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Vyrian

USA . 1,776 parts In-Stock

1+ parts

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1,776

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Digiode

USA . 497 parts In-Stock

1+ parts

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497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 366 parts In-Stock

1+ parts

$22.449

100+ parts

-

1k+ parts

$20.204

10k+ parts

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366

$22.449

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$20.204

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MKK Technologies

India . 562 parts In-Stock

1+ parts

$42.214

100+ parts

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562

$42.214

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DigiPath Technology Company

USA . 562 parts In-Stock

1+ parts

$42.214

100+ parts

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562

$42.214

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Corphita

USA . 3,499 parts In-Stock

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3,499

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Parana Technologies

USA . 1,844 parts In-Stock

1+ parts

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$26.841

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1,844

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$26.841

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Overview

Experience the power of reliable performance with the ST735CN by STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality switching regulator excels in automotive applications, delivering exceptional efficiency and thermal resilience from -40 °C to 125 °C. With its robust design, it ensures consistent output even under demanding conditions, making it the ideal choice for your next project. Trust STMicroelectronics for unparalleled quality and performance that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making this regulator suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization in PCB layouts, facilitating easier integration into designs.

Number of Terminals: 8

Having 8 terminals provides flexibility for a variety of connections, enhancing compatibility with different circuit configurations.

Package Style (Meter): IN-LINE

An in-line package style simplifies layout and assembly processes, contributing to more compact and organized designs.

Maximum Operating Temperature: 125 °C

This high operating temperature tolerance ensures reliability and performance in demanding environments, including automotive applications.

Control Mode: CURRENT-MODE

Current-mode control enhances transient response and stability, offering better performance in voltage regulation scenarios.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the product suitable for extreme environmental conditions, ensuring it works well in harsh climates.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and reliability, promoting long-term durability of connections.

Terminal Position: DUAL

Dual terminal positions enhance board layout flexibility, allowing for more efficient use of space in circuit designs.

Maximum Seated Height: 4.8 mm

A low seated height contributes to a compact design, making it ideal for applications where space is a critical concern.

Width: 7.62 mm

The compact 7.62 mm width aids in achieving smaller overall PCB dimensions, making this product ideal for space-constrained applications.

Other IC Type: SWITCHING REGULATOR

Being a switching regulator allows for higher efficiency compared to linear regulators, reducing heat dissipation and improving energy savings.

Nominal Input Voltage: 5 V

A nominal input voltage of 5 V is commonly used, making this product versatile and compatible with a wide range of systems.

Temperature Grade: AUTOMOTIVE

This automotive grade ensures compliance with stringent requirements for automotive applications, providing reliability and safety.

Maximum Switching Frequency: 160 kHz

A high switching frequency allows for smaller passive components, contributing to reduced overall size and weight of the circuit.

Maximum Output Current: 2 A

With a maximum output current of 2 A, this product can support a wide range of applications, from simple to more demanding circuits.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS, offering high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical stability and reliability for solder joints, making it ideal for robust applications.

Control Technique: PULSE WIDTH MODULATION

Pulse Width Modulation control technique enhances regulation efficiency and minimizes power loss, making this regulator a cost-effective choice.

Switcher Config: SINGLE

A single switcher configuration simplifies the design and implementation process, making it easier for engineers to integrate into their systems.

Terminal Pitch: 2.54 mm

The standard 2.54 mm terminal pitch facilitates compatibility with common PCB layouts and components, easing design integration.

Minimum Input Voltage: 4 V

The minimum input voltage of 4 V allows the regulator to remain functional in a variety of applications with different input power sources.

Maximum Input Voltage: 6.2 V

With a maximum input voltage of 6.2 V, this product can safely handle fluctuations in power supply, ensuring reliability.

Technical Specifications

Switching Regulators & Controllers ST735CN attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

6.2 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.8 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

160 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

ST735CN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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