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ST735SCD-TR

STMicroelectronics

ST735SCD-TR by STMicroelectronics

ST735SCD-TR by STMicroelectronics is a compact buck-boost switching regulator with a max output current of 2 A and operates b/w -40 °C to 125 °C. It features a current-mode control technique and supports input voltages from 4 V to 6.2 V. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,472 parts In-Stock

1+ parts

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2,472

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Vyrian

USA . 718 parts In-Stock

1+ parts

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718

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Anansix

USA . 574 parts In-Stock

1+ parts

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574

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$14.578

100+ parts

$13.266

1k+ parts

$11.954

10k+ parts

-

600

$14.578

$13.266

$11.954

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IDEA Electronic Components Group

UK . 2,184 parts In-Stock

1+ parts

$15.385

100+ parts

-

1k+ parts

$13.847

10k+ parts

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2,184

$15.385

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$13.847

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MKK Technologies

India . 1,337 parts In-Stock

1+ parts

$28.931

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1,337

$28.931

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DigiPath Technology Company

USA . 1,337 parts In-Stock

1+ parts

$28.931

100+ parts

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1,337

$28.931

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Corphita

USA . 3,961 parts In-Stock

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3,961

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Parana Technologies

USA . 1,188 parts In-Stock

1+ parts

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100+ parts

$18.395

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1,188

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$18.395

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Overview

Unlock exceptional efficiency and reliability with the ST735SCD-TR from STMicroelectronics, a leader in innovation. Designed for automotive applications, this switching regulator excels in delivering precise power management while enduring extreme temperatures from -40 °C to 125 °C. Its compact, surface-mount design ensures seamless integration into your projects, empowering you to create high-performance solutions with confidence. Experience unparalleled value and performance that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the device suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for compact PCB designs and improved assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient space utilization on PCBs, making it a practical choice for designers.

No. of Terminals: 8

Having 8 terminals enhances connectivity and provides flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density designs, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product reliable in demanding thermal environments.

Control Mode: CURRENT-MODE

Current-mode control improves response times and stability, making it suitable for various applications that require precise regulation.

Minimum Operating Temperature: -40 °C

This low minimum operating temperature ensures functionality in extreme conditions, making it suitable for automotive and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent corrosion resistance and good electrical conductivity, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide ease of integration into different circuit layouts, allowing for design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height is beneficial for maintaining a slim profile on PCBs, which is advantageous in compact designs.

Width (mm): 3.9 mm

A narrow width ensures compatibility with a variety of PCB layouts and designs.

Other IC type: SWITCHING REGULATOR

As a switching regulator, this IC provides efficient voltage regulation, which is crucial for power-sensitive applications.

Nominal Input Voltage: 5 V

The standard nominal input voltage of 5V is widely used, making this product compatible with various systems.

Length: 4.9 mm

The short length contributes to the overall compactness of the device, facilitating integration into tight spaces.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this product has enhanced reliability and is engineered to withstand harsh conditions.

Maximum Switching Frequency: 300 kHz

A maximum switching frequency of 300 kHz allows for faster response times and improved performance in dynamic loads.

Maximum Output Current: 2 A

The ability to output up to 2 A is suitable for a wide range of applications, from small devices to larger systems.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of bipolar and CMOS, leading to low power consumption and high performance.

Terminal Form: GULL WING

Gull-wing terminal form is ideal for surface mount technology as it provides reliable soldering and improved thermal characteristics.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique is effective for maintaining accurate output voltages and minimizing power loss.

Switcher Config: BUCK-BOOST

The buck-boost configuration allows for a versatile voltage output, accommodating a variety of input voltages and application needs.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports standard PCB designs and enhances the ease of manufacturer assembly.

Minimum Input Voltage: 4 V

A minimum input voltage of 4 V makes this product versatile enough to operate under a wide range of conditions.

Maximum Input Voltage: 6.2 V

The high maximum input voltage allows for robustness in scenarios where voltage spikes may occur.

Technical Specifications

Switching Regulators & Controllers ST735SCD-TR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

6.2 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

300 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

ST735SCD-TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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