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ST735SCN

STMicroelectronics

ST735SCN by STMicroelectronics

ST735SCN by STMicroelectronics is a versatile buck-boost switching regulator designed for automotive applications. It operates within -40 °C to 125 °C, supports up to 2A output current, and features a max switching frequency of 300kHz. Ideal for efficient power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,141 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,141

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Vyrian

USA . 2,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,356

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Anansix

USA . 401 parts In-Stock

1+ parts

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100+ parts

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401

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$15.715

100+ parts

-

1k+ parts

$14.143

10k+ parts

-

1,050

$15.715

-

$14.143

-

MKK Technologies

India . 2,238 parts In-Stock

1+ parts

$29.550

100+ parts

-

1k+ parts

-

10k+ parts

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2,238

$29.550

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DigiPath Technology Company

USA . 2,238 parts In-Stock

1+ parts

$29.550

100+ parts

-

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10k+ parts

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2,238

$29.550

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Corphita

USA . 3,810 parts In-Stock

1+ parts

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3,810

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Parana Technologies

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

$18.789

1k+ parts

-

10k+ parts

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1,085

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$18.789

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Overview

Elevate your projects with the ST735SCN from STMicroelectronics—a powerhouse in the world of switching regulators. Crafted for reliability and precision, this robust component thrives in extreme temperatures, making it ideal for automotive applications. Enjoy seamless integration and superior performance, backed by ST's unparalleled innovation and quality. Unlock efficiency and stability in your designs while ensuring long-lasting value and dependability for your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various environmental conditions, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on printed circuit boards (PCBs), allowing for compact design.

No. of Terminals: 8

Having 8 terminals provides sufficient connections for improved circuit functionality and flexibility in design.

Package Style (Meter): IN-LINE

In-line package style facilitates easy integration and soldering on PCBs, enhancing manufacturing efficiency.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes this regulator suitable for use in high-temperature environments typical in automotive applications.

Control Mode: CURRENT-MODE

Current-mode control provides improved transient response and stability, making the product suitable for dynamic load conditions.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C means the product performs reliably in cold environments, essential for automotive and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical contacts.

Terminal Position: DUAL

Dual terminal positions allow for flexible layout options on the PCB, accommodating various designs.

Maximum Seated Height: 4.8 mm

A low seated height of 4.8 mm contributes to compact designs, making it suitable for space-constrained applications.

Width: 7.62 mm

The width of 7.62 mm is ideal for tight spaces and helps in designing sleek circuits.

Other IC type: SWITCHING REGULATOR

As a switching regulator, it provides high efficiency and better thermal performance compared to linear regulators.

Nominal Input Voltage: 5 V

A nominal input voltage of 5 V is widely used in many electronics, ensuring compatibility with various devices.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, this product can withstand the harsh conditions often encountered in vehicles.

Maximum Switching Frequency: 300 kHz

A high switching frequency of 300 kHz allows for smaller inductors and capacitors, contributing to a compact design.

Maximum Output Current: 2 A

With a maximum output current of 2 A, it can support a variety of loads, making it versatile for different applications.

Technology: BICMOS

BICMOS technology offers the benefits of both bipolar and CMOS processes, resulting in high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole technology provides robust mechanical support and better solder joint reliability.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control allows for precise output regulation and improves efficiency.

Switcher Config: BUCK-BOOST

The buck-boost configuration offers versatility for stepping up or stepping down the input voltage, making it suitable for a wide range of applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm provides a standard spacing for easy integration into various PCB designs.

Minimum Input Voltage: 4 V

The ability to function with a minimum input voltage of 4 V widens the range of applications, allowing for voltages from different sources.

Maximum Input Voltage: 6.2 V

A maximum input voltage of 6.2 V enables usage in diverse systems, particularly where input voltages may vary.

Technical Specifications

Switching Regulators & Controllers ST735SCN attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

6.2 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.8 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

300 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

ST735SCN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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