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ST735TCD

STMicroelectronics

ST735TCD by STMicroelectronics

ST735TCD by STMicroelectronics is a compact buck-boost switching regulator with a max output current of 2 A and operates b/w -40 °C to 125 °C. It features a current-mode control technique and supports input voltages from 4 V to 6.2 V. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,213 parts In-Stock

1+ parts

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3,213

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Vyrian

USA . 759 parts In-Stock

1+ parts

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759

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Anansix

USA . 656 parts In-Stock

1+ parts

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656

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 195 parts In-Stock

1+ parts

$7.819

100+ parts

-

1k+ parts

$7.037

10k+ parts

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195

$7.819

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$7.037

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MKK Technologies

India . 337 parts In-Stock

1+ parts

$14.703

100+ parts

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337

$14.703

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DigiPath Technology Company

USA . 337 parts In-Stock

1+ parts

$14.703

100+ parts

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337

$14.703

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Corphita

USA . 3,395 parts In-Stock

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3,395

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Parana Technologies

USA . 737 parts In-Stock

1+ parts

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$9.349

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737

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$9.349

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Overview

Unlock unparalleled efficiency and reliability with the ST735TCD from STMicroelectronics. This compact switching regulator expertly balances performance and thermal management, making it the ideal choice for automotive applications. With a robust design that withstands extreme temperatures, you can trust its durability. Elevate your projects with cutting-edge technology, ensuring optimal power delivery and enhanced energy savings, all backed by ST's renowned quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental conditions, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards, optimizing space.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout options in PCB designs, promoting versatility in applications.

No. of Terminals: 8

Having 8 terminals enables a complex but efficient design, allowing for multiple connections and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package enhances space efficiency, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this regulator can function reliably in demanding thermal environments.

Control Mode: CURRENT-MODE

Current-mode control enhances response time and stability, making the regulator more efficient in a variety of loads.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable operation in extreme environments, such as automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and reliable electrical contact, promoting long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB design, accommodating various layout architectures.

Maximum Seated Height: 1.75 mm

A low seated height aids in creating a more compact overall design, improving integration into smaller devices.

Width (mm): 3.9 mm

A narrow width allows for efficient use of PCB space, making it easier to incorporate in multi-layer circuits.

Other IC type: SWITCHING REGULATOR

As a switching regulator, it provides higher efficiency compared to linear regulators, reducing heat generation and power loss.

Nominal Input Voltage: 5 V

A nominal input voltage of 5 V is standard in many applications, making it highly compatible and easy to integrate.

Length: 4.9 mm

Short length contributes to the compact form factor, ideal for high-density electronic designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring robustness against the harsh conditions often found in vehicles.

Maximum Switching Frequency: 300 kHz

A maximum switching frequency of 300 kHz provides fast response times and better performance in dynamic loads.

Maximum Output Current: 2 A

A maximum output current of 2 A makes it suitable for moderate power applications, providing sufficient output for many devices.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, resulting in low power consumption and faster performance.

Terminal Form: GULL WING

Gull wing terminals allow for reliable soldering and good mechanical connection, enhancing the durability of joint connections.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation increases the efficiency of voltage regulation, reducing energy waste during operation.

Switcher Config: BUCK-BOOST

The buck-boost configuration allows this regulator to step up or step down voltage, making it versatile for various applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many applications, making it easy to integrate with existing designs.

Minimum Input Voltage: 4 V

A minimum input voltage of 4 V ensures compatibility with battery-powered devices, allowing for better energy efficiency.

Maximum Input Voltage: 6.2 V

The maximum input voltage of 6.2 V provides flexibility in input sourcing, accommodating various power supply options.

Technical Specifications

Switching Regulators & Controllers ST735TCD attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

6.2 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

300 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

ST735TCD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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