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ST3384CD

STMicroelectronics

ST3384CD by STMicroelectronics

ST3384CD by STMicroelectronics is a dual line transceiver designed for EIA-232 interfaces, operating b/w 3V and 5.5V. It features a max output low current of 2A, with a compact SO package (7.5mm x 11.55mm). Ideal for commercial applications requiring reliable data transmission in limited space.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,660

-

-

-

-

Digiode

USA . 1,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,738

-

-

-

-

Anansix

USA . 1,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,343 parts In-Stock

1+ parts

$2.864

100+ parts

-

1k+ parts

$2.578

10k+ parts

-

2,343

$2.864

-

$2.578

-

MKK Technologies

India . 2,081 parts In-Stock

1+ parts

$5.385

100+ parts

-

1k+ parts

-

10k+ parts

-

2,081

$5.385

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-

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DigiPath Technology Company

USA . 2,081 parts In-Stock

1+ parts

$5.385

100+ parts

-

1k+ parts

-

10k+ parts

-

2,081

$5.385

-

-

-

Parana Technologies

USA . 2,264 parts In-Stock

1+ parts

-

100+ parts

$3.424

1k+ parts

-

10k+ parts

-

2,264

-

$3.424

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-

Corphita

USA . 1,023 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,023

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Overview

Elevate your designs with the ST3384CD from STMicroelectronics, a premier line driver and receiver that guarantees reliability and performance. Crafted for excellence, this compact surface-mount solution ensures seamless communication in various applications, from industrial automation to consumer electronics. With its robust temperature range and dual functionality, you gain unmatched versatility, making it an essential choice for engineers who value quality and efficiency. Discover the difference STMicroelectronics brings to your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures robust protection and reliability in various environments.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit boards, saving space and improving performance.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various applications without over-stressing the device.

No. of Functions: 2

Having two functions in one device increases versatility, making it suitable for a variety of line driving and receiving tasks.

Package Shape: RECTANGULAR

The rectangular shape is optimal for layout design and allows for more efficient use of PCB space.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies ensures compatibility with a wide range of systems.

No. of Terminals: 18

With 18 terminals, this package provides multiple connection options for complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency on PCBs, making it ideal for compact devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for operation in low-power applications, promoting energy conservation.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in warm environments and industrial applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, it can operate in standard indoor conditions, maintaining functionality across various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances conductivity and protects terminals from corrosion, ensuring long-term reliability.

Terminal Position: DUAL

This dual terminal position offers flexible routing options on the PCB, accommodating different designs and layouts.

Maximum Seated Height: 2.65 mm

A low seated height helps in reducing the overall height of the assembled PCB, facilitating a thinner design.

Width: 7.5 mm

The compact width makes it easy to integrate into tight spaces while maintaining performance.

Maximum Output Low Current: 2 Amp

The ability to handle up to 2 Amp makes this device capable of driving heavier loads efficiently.

Receiver No. of Bits: 2

With 2 bits for receiving, it ensures effective data handling for digital communication protocols.

Length: 11.55 mm

The length allows for a balanced footprint on the PCB while maximizing functionality.

Minimum Out Swing: 10 V

A minimum out swing of 10 V ensures compatibility with high-voltage signaling applications, enhancing performance.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ratings, this device is suitable for a wide range of regular consumer applications.

Maximum Receive Delay: 0 ns

A zero maximum receive delay signifies optimal performance in high-speed communication applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and improves reliability in connection due to its design.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Support for standard interface protocols ensures compatibility with a broad array of devices and legacy systems.

Maximum Supply Current: 1 mA

Low maximum supply current enhances energy efficiency, making it suitable for battery-powered applications.

Input Characteristics: STANDARD

Standard input characteristics simplify integration into existing systems and reduce design complexity.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is ideal for modern electronics aimed at lower power consumption.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch aids in compact PCB layouts while providing adequate spacing for soldering.

Driver No. of Bits: 2

Having 2 bits for driving ensures effective data transmission in communication protocols.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed for high-speed data transmission over long distances.

Technical Specifications

Line Drivers & Receivers ST3384CD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e4

Length:

11.55 mm

No. of Functions:

2

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ST3384CD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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