Loading...

ST3384CDR

STMicroelectronics

ST3384CDR by STMicroelectronics

ST3384CDR by STMicroelectronics is a dual line transceiver designed for EIA-232 interfaces, operating b/w 3V and 5.5V. It features a max output low current of 2A and supports commercial temp grades up to 70 °C. Ideal for compact communication applications with an 18-terminal SO package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

234

-

-

-

-

Anansix

USA . 224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

224

-

-

-

-

Vyrian

USA . 212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

212

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,067 parts In-Stock

1+ parts

$4.704

100+ parts

-

1k+ parts

$4.234

10k+ parts

-

2,067

$4.704

-

$4.234

-

MKK Technologies

India . 801 parts In-Stock

1+ parts

$8.845

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$8.845

-

-

-

DigiPath Technology Company

USA . 801 parts In-Stock

1+ parts

$8.845

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$8.845

-

-

-

Corphita

USA . 619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

619

-

-

-

-

Parana Technologies

USA . 357 parts In-Stock

1+ parts

-

100+ parts

$5.624

1k+ parts

-

10k+ parts

-

357

-

$5.624

-

-

Overview

Elevate your designs with the ST3384CDR from STMicroelectronics, a trusted leader in innovative electronic solutions. This versatile line driver and receiver promises reliable performance and seamless integration, perfect for efficient data communication in various applications. With its robust construction and small outline package, the ST3384CDR stands out for durability and efficiency, reducing system complexity while enhancing operational reliability. Empower your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier integration into modern PCBs.

Maximum Supply Voltage: 5.5 V

This flexibility in voltage limits makes it compatible with a wide range of circuits.

No. of Functions: 2

Dual functionality enhances efficiency, allowing for greater versatility in data transmission.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB while facilitating efficient layout.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies ensures compatibility with various systems.

No. of Terminals: 18

With 18 terminals, the product provides multiple connectivity options for enhanced performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and reduces assembly costs.

Minimum Supply Voltage: 3 V

This low minimum supply voltage expands the range of applications in battery-powered devices.

Maximum Operating Temperature: 70 °C

A high operating temperature rating ensures reliable performance even in warmer environments.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C allows the device to function well in cooler conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish enhances corrosion resistance and ensures reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and easier routing of signals.

Maximum Seated Height: 2.65 mm

A low seated height is essential for space-constrained designs, facilitating integration in slim form factors.

Width: 7.5 mm

The compact width allows for efficient use of limited PCB real estate.

Maximum Output Low Current: 2 Amp

Handles high current outputs efficiently, making it suitable for demanding applications.

Receiver No. of Bits: 2

Supports 2-bit data, enabling efficient data handling for various communication needs.

Length: 11.55 mm

The optimal length ensures it fits comfortably into standard-sized PCB layouts.

Minimum Out Swing: 10 V

A minimum output swing of 10V enhances signal integrity over longer communication lines.

Temperature Grade: COMMERCIAL

Commercial-grade components ensure quality and performance for general-purpose applications.

Maximum Receive Delay: 0 ns

Instantaneous receive delay ensures real-time communication, critical in fast-paced applications.

Terminal Form: GULL WING

Gull wing terminals provide a reliable and stable mounting option for improved soldering.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Compatibility with standard communication protocols makes it versatile for various interface applications.

Maximum Supply Current: 1 mA

A low supply current demand enhances energy efficiency, particularly in battery-operated devices.

Input Characteristics: STANDARD

Standard input characteristics facilitate ease of integration in existing designs.

Nominal Supply Voltage: 3.3 V

The nominal 3.3V supply supports modern low-voltage circuits, making it power-efficient.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows compatibility with established PCB design practices.

Driver No. of Bits: 2

The 2-bit driver capability ensures effective data signaling and processing.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver optimizes the device for reliable long-distance communication.

Technical Specifications

Line Drivers & Receivers ST3384CDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e4

Length:

11.55 mm

No. of Functions:

2

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ST3384CDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11