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ST3384BDR

STMicroelectronics

ST3384BDR by STMicroelectronics

ST3384BDR by STMicroelectronics is a dual line transceiver designed for EIA-232 interfaces, operating b/w 3V and 5.5V. It features an industrial temperature range of -40 °C to 85 °C and supports up to 2A output current. Ideal for compact applications, it comes in a small outline package with nickel-palladium-gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,992 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,992

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Anansix

USA . 2,591 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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2,591

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Digiode

USA . 303 parts In-Stock

1+ parts

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100+ parts

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303

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,248 parts In-Stock

1+ parts

$13.454

100+ parts

-

1k+ parts

$12.109

10k+ parts

-

2,248

$13.454

-

$12.109

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MKK Technologies

India . 1,744 parts In-Stock

1+ parts

$25.300

100+ parts

-

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10k+ parts

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1,744

$25.300

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DigiPath Technology Company

USA . 1,744 parts In-Stock

1+ parts

$25.300

100+ parts

-

1k+ parts

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10k+ parts

-

1,744

$25.300

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-

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Parana Technologies

USA . 1,218 parts In-Stock

1+ parts

-

100+ parts

$16.086

1k+ parts

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1,218

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$16.086

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Corphita

USA . 657 parts In-Stock

1+ parts

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657

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Overview

Unlock the potential of your designs with the ST3384BDR from STMicroelectronics, a trusted leader in high-quality electronic components. This innovative line driver and receiver excels in versatile applications, providing robust performance even in challenging environments. With its compact package and reliable operation from -40 °C to 85 °C, it ensures seamless communication in industrial settings. Experience unmatched value and peace of mind, knowing you’re supported by ST's renowned expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protects the internal components from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and enables high-density PCB layouts, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies, improving usability.

No. of Functions: 2

Having two functions in a single device optimizes board space and reduces component count, leading to cost savings.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCBs, accommodating various layouts.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies enhances flexibility and allows usage in diverse electronic systems.

No. of Terminals: 18

With 18 terminals, this product can handle multiple connections, offering versatile application potential.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-limited applications, providing a compact solution without sacrificing performance.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures that the device operates efficiently at lower power levels, contributing to energy savings.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C allows for reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme conditions, enhancing suitability for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal position simplifies routing and PCB design for improved signal integrity.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm contributes to reduced profile designs, accommodating tighter spaces in circuitry.

Width: 7.5 mm

A width of 7.5 mm is balanced for accessibility in handling while still being compact for PCB layout.

Maximum Output Low Current: 2 Amp

A maximum low output current of 2 Amps ensures the device can drive loads effectively, suitable for various signaling tasks.

Receiver No. of Bits: 2

With a receiver configuration of 2 bits, it supports effective data processing and transfer for complex communication systems.

Length: 11.55 mm

A compact length of 11.55 mm makes this device suitable for fitting into smaller electronic designs, enhancing versatility.

Minimum Out Swing: 10 V

A minimum out swing of 10 V allows for robust signal transmission over longer distances, important in many communication applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in challenging environments, making this device a durable choice.

Maximum Receive Delay: 0 ns

Zero maximum receive delay facilitates real-time data processing and enhances overall system responsiveness.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering, improving the manufacturability and reliability of PCB assembly.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Compatibility with various interface standards enhances connectivity options and simplifies integration into existing systems.

Maximum Supply Current: 1 mA

A low maximum supply current of 1 mA contributes to energy efficiency, reducing the power consumption of the overall system.

Input Characteristics: STANDARD

Standard input characteristics ensure the device operates reliably within defined parameters, enhancing system stability.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V aligns with modern low-power designs, optimizing performance and energy efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for reasonable spacing, making it easy to accommodate in various PCB designs.

Driver No. of Bits: 2

Having 2 bits for the driver complements the receiver's configuration, allowing for efficient data transmission.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC type is specifically designed for robust signal transmission over various communication lines, ensuring reliability.

Technical Specifications

Line Drivers & Receivers ST3384BDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e4

Length:

11.55 mm

No. of Functions:

2

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ST3384BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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