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ST3384BPR

STMicroelectronics

ST3384BPR by STMicroelectronics

ST3384BPR by STMicroelectronics is a dual line transceiver with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. It features a compact SOIC package with 20 terminals, ideal for EIA-232 applications. This device supports both 3.3V and 5V power supplies, ensuring versatility in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,290 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,290

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-

-

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Vyrian

USA . 1,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,870

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-

-

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Digiode

USA . 1,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,112

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,872 parts In-Stock

1+ parts

$5.036

100+ parts

-

1k+ parts

$4.532

10k+ parts

-

1,872

$5.036

-

$4.532

-

MKK Technologies

India . 157 parts In-Stock

1+ parts

$9.470

100+ parts

-

1k+ parts

-

10k+ parts

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157

$9.470

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-

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DigiPath Technology Company

USA . 157 parts In-Stock

1+ parts

$9.470

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$9.470

-

-

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Corphita

USA . 4,271 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,271

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Parana Technologies

USA . 2,086 parts In-Stock

1+ parts

-

100+ parts

$6.021

1k+ parts

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10k+ parts

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2,086

-

$6.021

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Overview

Unlock seamless connectivity with the ST3384BPR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This robust line driver and receiver excels in industrial applications, ensuring reliable data transmission even in extreme temperatures. Its compact design and low power consumption make it perfect for space-constrained environments. Experience enhanced performance and longevity that elevate your projects—choose ST3384BPR for unmatched value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount capability allows for space-saving designs and easier integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply systems, enhancing versatility.

No. of Functions: 2

Having two functions in one IC reduces component count and lowers system complexity, making it cost-effective.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts and allows for efficient thermal management.

Power Supplies (V): 3.3/5

Dual voltage operation (3.3/5 V) enables usage in both low-power and standard applications, providing flexibility in design.

No. of Terminals: 20

A 20-terminal configuration offers multiple connectivity options to support complex applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style allows for high-density mounting and is ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for operation in low-voltage environments, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The extended maximum operating temperature ensures reliability in industrial environments and harsh conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for extreme conditions, expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures good conductivity and long-term reliability, making it suitable for critical applications.

Terminal Position: DUAL

Dual terminal position enhances layout options on PCBs, allowing for better space management and routing in designs.

Maximum Seated Height: 2 mm

Low seated height contributes to the compactness of the overall design, essential for applications with space constraints.

Width: 5.3 mm

A moderate width allows for ease of handling during assembly while fitting into varying PCB layouts.

Maximum Output Low Current: 2 Amp

A strong output capability of 2 A makes this device capable of driving loads effectively, ideal for a variety of applications.

Receiver No. of Bits: 2

The dual-bit receiver allows for support in applications needing efficient data handling, simplifying design needs.

Length: 7.2 mm

Compact length aids in reducing board space requirements, facilitating the design of smaller systems.

Minimum Out Swing: 10 V

High minimum out swing ensures strong signal integrity, which is key for maintaining communication reliability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes this device suitable for challenging environments, enhancing application range.

Maximum Receive Delay: 0 ns

Zero receive delay provides instantaneous data communication, crucial for high-speed applications.

Terminal Form: GULL WING

Gull wing leads facilitate easier soldering and assembly processes, ensuring reliable connections.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Standardized interface support ensures compatibility with a wide array of devices, enhancing the product's versatility.

Maximum Supply Current: 1 mA

Low supply current consumption translates to energy efficiency, making it ideal for battery-powered and green applications.

Input Characteristics: STANDARD

Standard input characteristics simplify integration with commonly used systems and components, reducing design time.

Nominal Supply Voltage: 3.3 V

Operating nominally at 3.3 V aids in reducing power consumption, making it suitable for modern electronic applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for tighter pin arrangements, contributing to high-density designs.

Driver No. of Bits: 2

With a dual-bit driver, this product supports efficient data processing and signal transmission, key for modern data communication.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product is optimized for robust data transmission, ensuring reliability across communication channels.

Technical Specifications

Line Drivers & Receivers ST3384BPR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

ST3384BPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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