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ST21491QTR

STMicroelectronics

ST21491QTR by STMicroelectronics

ST21491QTR by STMicroelectronics is a 16-terminal interface IC with supply voltage range of 1.65V to 3.6V, operating temperature from -40 °C to 85°C. It features a chip carrier package style and is suitable for industrial applications requiring very thin profile components in surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,902 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,902

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Vyrian

USA . 852 parts In-Stock

1+ parts

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-

1k+ parts

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852

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Anansix

USA . 348 parts In-Stock

1+ parts

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100+ parts

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348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,978 parts In-Stock

1+ parts

$4.365

100+ parts

-

1k+ parts

$3.929

10k+ parts

-

1,978

$4.365

-

$3.929

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MKK Technologies

India . 1,000 parts In-Stock

1+ parts

$8.209

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$8.209

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DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$8.209

100+ parts

-

1k+ parts

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10k+ parts

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1,000

$8.209

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-

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Parana Technologies

USA . 2,062 parts In-Stock

1+ parts

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100+ parts

$5.220

1k+ parts

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2,062

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$5.220

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Corphita

USA . 1,569 parts In-Stock

1+ parts

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10k+ parts

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1,569

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Overview

Elevate your electronic designs with the ST21491QTR by STMicroelectronics. This cutting-edge Interface IC offers unparalleled quality and reliability, backed by the trusted name of STMicroelectronics. Ideal for a wide range of applications, this product delivers exceptional performance at a competitive price point. With a sleek rectangular package shape and quad terminal position, the ST21491QTR is a versatile solution for any project. Upgrade your designs today and experience the value and benefits that only STMicroelectronics can deliver.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving space and improving overall system reliability.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, increasing the flexibility of the product.

Package Shape: RECTANGULAR

Standard package shape that is easy to handle and integrate into various electronic systems.

No. of Terminals: 16

Provides sufficient connectivity options for interfacing with other components, enhancing functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Compact and slim profile makes it suitable for space-constrained applications, optimizing design flexibility.

Minimum Supply Voltage: 1.65 V

Supports operation at low power levels, increasing energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in a wide range of environmental conditions, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

Ensures product functionality in extreme cold temperatures, making it suitable for various industrial applications.

Terminal Position: QUAD

Quad terminal position offers better stability and robustness in connectivity, enhancing overall reliability.

Maximum Seated Height: 0.6 mm

Low seated height enables compact and slim designs, facilitating integration into space-constrained systems.

Width: 1.8 mm

Narrow width makes it suitable for applications where board space is a constraint, enabling efficient use of available area.

Length: 2.6 mm

Compact length allows for easy placement on circuit boards, optimizing layout and maximizing board real estate.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in demanding operating conditions.

Terminal Form: NO LEAD

Leadless terminal form eliminates the risk of lead contamination and offers a more environmentally-friendly solution.

Nominal Supply Voltage: 1.8 V

Optimal supply voltage level for the product's intended functionality, ensuring efficient performance.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting, enabling compact and efficient system designs.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, providing specialized functionality and performance.

Technical Specifications

Other Function Interface ICs ST21491QTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRED VCC = 3.3V SUPPLY NOMINAL

Interface IC Type:

JESD-30 Code:

R-XQCC-N16

Length:

2.6 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.8 mm

Trade Compliance

ST21491QTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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