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ST2149BQTR

STMicroelectronics

ST2149BQTR by STMicroelectronics

ST2149BQTR by STMicroelectronics is a 12-terminal interface IC with supply voltage range of 1.65V to 3.6V, suitable for industrial applications. It features a rectangular package style with 0.4mm terminal pitch and operates b/w -40°C to 85°C. Ideal for surface mount designs due to its very thin profile chip carrier package shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,362 parts In-Stock

1+ parts

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6,362

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Digiode

USA . 1,267 parts In-Stock

1+ parts

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1,267

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Anansix

USA . 1,169 parts In-Stock

1+ parts

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1,169

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Flip Electronics

USA . 130 parts In-Stock

1+ parts

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130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$2.673

100+ parts

-

1k+ parts

$2.405

10k+ parts

-

1,111

$2.673

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$2.405

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MKK Technologies

India . 2,003 parts In-Stock

1+ parts

$5.026

100+ parts

-

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2,003

$5.026

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DigiPath Technology Company

USA . 2,003 parts In-Stock

1+ parts

$5.026

100+ parts

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2,003

$5.026

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Microchip USA

USA . 360 parts In-Stock

1+ parts

$5.335

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360

$5.335

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AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$8.652

100+ parts

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737

$8.652

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Ampacity Inc.

Singapore . 1,592 parts In-Stock

1+ parts

$14.500

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1,592

$14.500

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Lixinc

USA . 4,185 parts In-Stock

1+ parts

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4,185

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A-Z Elektronik GmbH

Germany . 2,882 parts In-Stock

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2,882

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Corphita

USA . 2,020 parts In-Stock

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2,020

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Parana Technologies

USA . 784 parts In-Stock

1+ parts

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$3.196

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784

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$3.196

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Looking for a high-quality interface IC that delivers exceptional performance and reliability? Look no further than the ST2149BQTR by STMicroelectronics. With a sleek rectangular package style and industrial-grade temperature grade, this chip carrier boasts a wide range of applications and a maximum supply voltage of 3.6V. Whether you're designing consumer electronics or industrial machinery, this interface circuit offers unmatched value and benefits, making it the perfect choice for your next project. Trust STMicroelectronics to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology provides a compact and space-efficient solution for mounting the IC onto a PCB, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Offers a high maximum supply voltage, providing flexibility in powering the IC and allowing compatibility with various power sources.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into existing circuit designs and ensures compatibility with standard PCB layouts.

Power Supplies (V): 1.8/3.3, 1.8/5

Supports multiple power supply options, giving the user flexibility in choosing the appropriate power source for their specific application requirements.

No. of Terminals: 12

A higher number of terminals offer more connection options and functionality, making the IC versatile and suitable for complex circuit designs.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier package style with a very thin profile enables compact and lightweight designs, ideal for applications where space is limited or weight is a concern.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage allows for operation in low-power applications, saving energy and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions, making the IC suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function in cold environments, increasing its applicability across different temperature ranges.

Terminal Position: QUAD

Quad terminal position provides good stability and robustness in the connection, ensuring reliable operation even in dynamic or high-vibration environments.

Maximum Seated Height: 0.55 mm

Low maximum seated height minimizes the overall profile of the IC on the PCB, allowing for compact and slim device designs.

Width: 1.7 mm

Narrow width facilitates space-saving integration of the IC into the circuit layout, enabling efficient use of PCB real estate.

Length: 2 mm

Short length reduces the footprint of the IC on the PCB, enabling compact and sleek design implementations in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh environmental conditions typically found in industrial settings.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability by eliminating the risk of solder joint failures and ensuring robust connections in the circuit.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V provides a standard reference voltage for the IC, facilitating compatibility with other components in the system.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm allows for high-density mounting on the PCB, enabling compact and densely packed circuit designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates seamless communication between different parts of the system, enhancing overall system performance and functionality.

Technical Specifications

Other Function Interface ICs ST2149BQTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRED VCC = 3.3V SUPPLY NOMINAL

Interface IC Type:

JESD-30 Code:

R-XQCC-N12

Length:

2 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC12,.07X.08,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

1.8/3.3,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.7 mm

Trade Compliance

ST2149BQTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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