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SPV1050T

STMicroelectronics

SPV1050T by STMicroelectronics

SPV1050T by STMicroelectronics is a compact power management IC designed for industrial applications, featuring a -40 °C to 85 °C operating temp range. It supports supply voltages from 2.2V to 5.3V and comes in a very thin profile with no lead terminals. Ideal for efficient power supply support in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,114

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-

-

-

Vyrian

USA . 2,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,828

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Anansix

USA . 1,047 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,047

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$7.441

100+ parts

-

1k+ parts

$6.697

10k+ parts

-

986

$7.441

-

$6.697

-

MKK Technologies

India . 2,279 parts In-Stock

1+ parts

$13.992

100+ parts

-

1k+ parts

-

10k+ parts

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2,279

$13.992

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DigiPath Technology Company

USA . 2,279 parts In-Stock

1+ parts

$13.992

100+ parts

-

1k+ parts

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10k+ parts

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2,279

$13.992

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-

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Parana Technologies

USA . 1,160 parts In-Stock

1+ parts

-

100+ parts

$8.897

1k+ parts

-

10k+ parts

-

1,160

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$8.897

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Corphita

USA . 888 parts In-Stock

1+ parts

-

100+ parts

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888

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Overview

Elevate your power management solutions with the SPV1050T from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for exceptional efficiency and reliability, this compact IC excels in demanding industrial environments, ensuring stable operation from -40 °C to 85 °C. With its innovative design and high performance, the SPV1050T is perfect for applications ranging from automation to telecommunications, delivering unparalleled value and peace of mind for your projects.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for efficient use of space on PCBs, making it ideal for compact designs.

Package Shape: SQUARE

The square package shape provides uniform thermal dissipation and can simplify layout in multi-chip modules.

No. of Terminals: 20

With 20 terminals, this IC allows for a multitude of connections, enhancing functionality and reducing component count.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style promotes efficient heat management and is suitable for applications with space constraints.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in industrial environments where heat is a factor.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C) provides durability for harsh environmental conditions.

Terminal Position: QUAD

The quad terminal position allows for easy integration into various designs, improving assembly efficiency.

Maximum Seated Height: 1 mm

A low seated height enhances compatibility with thin-profile applications, crucial for modern electronics.

Width: 3 mm

A compact width of 3 mm maximizes layout flexibility and minimizes board space usage.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply applications, ensuring optimized performance in power management.

Minimum Supply Voltage (Vsup): 2.2 V

The low minimum supply voltage makes it compatible with a wide range of low-power applications.

Length: 3 mm

A length of 3 mm contributes to the compact size, facilitating integration into space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees robustness and reliability in demanding operating conditions.

Terminal Form: NO LEAD

No lead design enhances reliability and reduces PCB land requirements, enabling more efficient layouts.

Terminal Pitch: 0.4 mm

A smaller terminal pitch allows for denser packing of components, ideal for miniaturized applications.

Maximum Supply Voltage (Vsup): 5.3 V

A maximum supply voltage of 5.3 V ensures compatibility with various power rails, enhancing design versatility.

Technical Specifications

Power Management ICs SPV1050T attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N20

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

SPV1050T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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