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SPEAR1340-2

STMicroelectronics

SPEAR1340-2 by STMicroelectronics

SPEAR1340-2 by STMicroelectronics is a RISC MICROPROCESSOR with CMOS technology. It has a peak reflow temperature of 260 °C and can withstand 30s at peak reflow temperature. Ideal for applications requiring high-performance microprocessors in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,654 parts In-Stock

1+ parts

-

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3,654

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Digiode

USA . 1,869 parts In-Stock

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1,869

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Anansix

USA . 1,752 parts In-Stock

1+ parts

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1,752

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EMSNET

USA . 30 parts In-Stock

1+ parts

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$77.299

100+ parts

-

1k+ parts

$69.569

10k+ parts

-

1,848

$77.299

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$69.569

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MKK Technologies

India . 1,433 parts In-Stock

1+ parts

$145.356

100+ parts

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1,433

$145.356

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DigiPath Technology Company

USA . 1,433 parts In-Stock

1+ parts

$145.356

100+ parts

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1,433

$145.356

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Corphita

USA . 2,717 parts In-Stock

1+ parts

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2,717

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Parana Technologies

USA . 2,151 parts In-Stock

1+ parts

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100+ parts

$92.423

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2,151

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$92.423

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Overview

Unleash the power of innovation with the SPEAR1340-2 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality microprocessors that push boundaries and drive progress. From smart devices to automotive applications, the SPEAR1340-2 offers unparalleled performance and reliability. Say goodbye to limitations and hello to endless possibilities with this cutting-edge technology. Upgrade your projects today with the SPEAR1340-2 and experience the difference for yourself.

Feature Benefit Bullets

Terminal Finish: TIN SILVER

TIN SILVER terminal finish provides a reliable and durable connection, ensuring stable performance of the microprocessor.

Maximum Time At Peak Reflow Temperature (s): 30

Having a maximum time of 30 seconds at peak reflow temperature allows for efficient and precise soldering during assembly, leading to a high-quality end product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this microprocessor can withstand high-temperature reflow processes, ensuring proper soldering and reliability.

Peripheral IC Type: MICROPROCESSOR, RISC

Featuring a RISC architecture, this microprocessor offers enhanced performance and efficiency in executing instructions, making it a suitable choice for advanced computing tasks.

Technology: CMOS

Utilizing CMOS technology, this microprocessor consumes low power while delivering high-speed performance, ideal for applications requiring energy efficiency and speed.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microprocessor is resistant to moisture-related issues during assembly and storage, ensuring product reliability in various environments.

Technical Specifications

Microprocessors SPEAR1340-2 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

SPEAR1340-2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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