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SPC58NG84E5QTH0Y

STMicroelectronics

SPC58NG84E5QTH0Y by STMicroelectronics

SPC58NG84E5QTH0Y by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 1.26V and operates b/w -40 °C to 125 °C. It features 144 terminals, 256K EEPROM, and supports advanced connectivity options like Ethernet and I2C. Ideal for automotive applications requiring high reliability and performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,968 parts In-Stock

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6,968

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Digiode

USA . 2,719 parts In-Stock

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2,719

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Anansix

USA . 531 parts In-Stock

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531

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$13.740

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-

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558

$13.740

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IDEA Electronic Components Group

UK . 624 parts In-Stock

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$35.480

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$31.932

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624

$35.480

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$31.932

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MKK Technologies

India . 1,684 parts In-Stock

1+ parts

$66.717

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1,684

$66.717

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$66.717

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1,684

$66.717

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Microchip USA

USA . 1,600 parts In-Stock

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$78.664

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1,600

$78.664

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Component Stockers USA

USA . 251 parts In-Stock

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$420.730

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251

$420.730

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Parana Technologies

USA . 665 parts In-Stock

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$42.422

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$42.422

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Corphita

USA . 438 parts In-Stock

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438

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Overview

Unlock the potential of your automotive applications with the SPC58NG84E5QTH0Y microcontroller from STMicroelectronics. Renowned for its reliability and innovative technology, STMicroelectronics delivers a powerhouse solution that enhances performance in demanding environments. With features designed for high efficiency and safety, this microcontroller excels in advanced driver assistance systems, ensuring seamless connectivity and precise control. Invest in quality and performance—choose SPC58NG84E5QTH0Y for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable package material suitable for automotive environments.

Surface Mount: YES

Enables efficient use of space on PCBs and automatic assembly processes.

Maximum Supply Voltage: 1.26 V

Low voltage requirement helps in power-efficient designs.

Screening Level: AEC-Q100; ISO 26262

Meets stringent automotive standards ensuring reliability in critical applications.

Package Shape: SQUARE

Compact form factor allows for versatile placement on PCB.

Bit Size: 32

32-bit architecture supports complex computations and advanced applications.

No. of Terminals: 144

Provides ample connectivity options for various peripherals and functions.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Designed to manage heat effectively while maximizing performance.

Minimum Supply Voltage: 1.14 V

Facilitates operation in low power conditions, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

Capable of functioning in high-temperature environments, suitable for automotive applications.

CPU Family: SPC58

Part of a robust family designed for automotive applications with performance and reliability.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold conditions, critical for automotive use.

ADC Channels: YES

Includes ADC for processing analog signals, improving sensor integration.

DMA Channels: YES

Integrated DMA channels enhance throughput and offload CPU for efficient data transfer.

Terminal Position: QUAD

Facilitates easier routing and supports various layout designs on PCB.

ROM Words: 6291456

Large memory capacity allows for complex program storage and execution.

Maximum Seated Height: 1.2 mm

Slim profile allows for denser circuitry and better thermal performance.

Width: 20 mm

Standard width effective for most PCB layouts, ensuring compatibility.

Data EEPROM Size: 256K

Ample EEPROM allows for extensive data storage and non-volatile memory requirements.

Peripherals: DMA(96), TIMER(12), RTC, WDT(4)

Rich peripheral set facilitates versatile application development and integration.

Maximum Clock Frequency: 40 MHz

High clock speed supports demanding applications, allowing for fast processing.

Length: 20 mm

Standard length aids in PCB design and component compatibility.

Temperature Grade: AUTOMOTIVE

Specifically designed to endure automotive specifications and harsh environments.

Peripheral IC Type: MICROCONTROLLER

Versatile microcontroller architecture supports a wide range of applications.

No. of Timers: 12

Multiple timers enable diverse timing functions essential for control tasks.

RAM Bytes: 622592

Significant RAM size allows for efficient multitasking and advanced algorithm execution.

Technology: CMOS

CMOS technology ensures high performance with low power consumption.

Terminal Form: GULL WING

Gull wing leads provide good solderability and stability in thermal environments.

Analog To Digital Converters: 5-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution enhance data accuracy from sensors.

Nominal Supply Voltage: 1.2 V

Optimized supply voltage for energy efficiency in modern electronic designs.

No. of DMA Channels: 96

High number of DMA channels supports high-speed data transfers with less CPU overhead.

PWM Channels: YES

PWM capability provides flexibility in motor control and other applications.

Connectivity: DSPI(10), ETHERNET(2), I2C, LIN(18)

Diverse connectivity options enable communication with a range of devices and networks.

ROM Programmability: FLASH

Flash memory allows for easy updates and reprogramming, enhancing longevity.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density interconnections in compact designs.

Speed: 180 rpm

Achieves fast operational speed, suitable for high-performance applications.

On Chip Program ROM Width: 8

8-bit program width enables efficient processing of instructions in various applications.

Technical Specifications

Microcontrollers SPC58NG84E5QTH0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

SPC58

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of DMA Channels:

96

No. of Terminals:

144

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

622592

ROM Words:

6291456

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; ISO 26262

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

DSPI(10), ETHERNET(2), I2C, LIN(18)

Peripherals:

DMA(96), TIMER(12), RTC, WDT(4)

Analog To Digital Convertors:

5-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58NG84E5QTH0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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