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SPC58NG84C3GEC0X

STMicroelectronics

SPC58NG84C3GEC0X by STMicroelectronics

SPC58NG84C3GEC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 105 °C. It features 96 DMA channels and supports various connectivity options like Ethernet and I2C. Ideal for industrial applications, it offers robust performance with 6M ROM and extensive peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,097 parts In-Stock

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6,097

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Digiode

USA . 3,018 parts In-Stock

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3,018

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Anansix

USA . 2,107 parts In-Stock

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2,107

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Distributors (Availability)

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AZTECH Wire

Italy . 960 parts In-Stock

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$8.920

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960

$8.920

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Vigor

Singapore . 2,845 parts In-Stock

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$31.800

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2,845

$31.800

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IDEA Electronic Components Group

UK . 661 parts In-Stock

1+ parts

$70.754

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-

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$63.678

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661

$70.754

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$63.678

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Microchip USA

USA . 3,404 parts In-Stock

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$83.452

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3,404

$83.452

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MKK Technologies

India . 378 parts In-Stock

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$133.047

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378

$133.047

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DigiPath Technology Company

USA . 378 parts In-Stock

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$133.047

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378

$133.047

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,407 parts In-Stock

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$84.597

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1,407

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$84.597

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Corphita

USA . 792 parts In-Stock

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792

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Overview

Unlock unparalleled performance for your next project with the SPC58NG84C3GEC0X microcontroller from STMicroelectronics. Renowned for their commitment to quality, ST delivers a robust solution designed for diverse applications in automotive and industrial sectors. With superior processing power and advanced features, this microcontroller ensures reliability under extreme conditions, helping you accelerate innovation while enhancing efficiency and reducing costs. Choose excellence; choose SPC58NG84C3GEC0X.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mounting facilitates compact designs and easy integration into modern circuit boards.

Maximum Supply Voltage: 1.26 V

Lower voltage operation reduces power consumption, which enhances battery life in portable devices.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures reliability and performance in automotive applications, suitable for critical environments.

Package Shape: SQUARE

The square package shape allows for efficient routing and placement in circuit designs.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities suitable for complex algorithms and applications.

No. of Terminals: 292

A high number of terminals offers extensive connectivity options for peripherals and external components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid arrays enable high-density mounting, perfect for compact designs requiring many connections.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage contributes to energy efficiency and reduces thermal output during operation.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures expands application possibilities in harsh environments.

CPU Family: SPC58

The SPC58 family is optimized for automotive and industrial embedded applications, ensuring high performance and reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for use in extreme conditions, extending product applicability to various fields.

ADC Channels: YES

Having ADC channels enables precise analog signal conversion, essential for sensor integrations in embedded systems.

DMA Channels: YES

DMA channels improve data transfer rates and system efficiency by allowing peripherals to communicate without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning aids in compact layout designs, providing better space utilization on PCBs.

ROM Words: 6291456

A large ROM capacity allows for extensive program storage, accommodating complex firmware requirements.

Maximum Seated Height: 1.8 mm

A low seated height promotes compact design, reducing the overall PCB thickness and enabling space-saving applications.

Width: 17 mm

Maintaining a 17 mm width strikes a balance between compactness and easy soldering/handling.

Data EEPROM Size: 256K

Generous EEPROM size enables the storing of non-volatile data, essential for applications requiring data retention.

Peripherals: DMA(96), TIMER(12), RTC, WDT(4)

A rich set of peripherals enhances functionality, offering versatility for various applications in automation and monitoring.

Maximum Clock Frequency: 40 MHz

A high clock frequency provides improved processing speed, essential for real-time applications.

Length: 17 mm

A compact length facilitates easier integration and design flexibility in space-constrained environments.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure stable operation in demanding conditions, making them suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control functions, making it ideal for embedded system designs.

No. of Timers: 12

Multiple timers allow for complex timing operations and event scheduling in applications.

RAM Bytes: 622592

Plenty of RAM supports data handling for complex tasks and multitasking functionalities in embedded systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing performance in various applications.

Terminal Form: BALL

Ball terminal form factors enable efficient thermal and electrical performance, vital for high-density applications.

Analog To Digital Convertors: 5-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-resolution ADC channels enhance signal processing capabilities, essential for high-fidelity sensor applications.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V is optimal for low power applications, facilitating energy-efficient designs.

No. of DMA Channels: 96

A high DMA channel count allows for advanced memory management and peripheral communication without CPU load.

PWM Channels: YES

Support for PWM channels enables precise control over motors and other actuators, ideal for robotics and control systems.

Connectivity: DSPI(10), ETHERNET, I2C, LIN(18)

Diverse connectivity options allow for easy integration with various communication protocols, enhancing system interoperability.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, providing flexibility in application deployment.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for high-density designs, maximizing space utilization on a PCB.

Speed: 180 rpm

Support for high-speed operations makes it suitable for applications requiring rapid processing and control.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances compatibility with a variety of applications, ensuring robust performance.

Technical Specifications

Microcontrollers SPC58NG84C3GEC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

SPC58

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

No. of DMA Channels:

96

No. of Terminals:

292

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

622592

ROM Words:

6291456

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.8 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

DSPI(10), ETHERNET, I2C, LIN(18)

Peripherals:

DMA(96), TIMER(12), RTC, WDT(4)

Analog To Digital Convertors:

5-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58NG84C3GEC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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