Loading...

SPC58EC80E7QMC0Y

STMicroelectronics

SPC58EC80E7QMC0Y by STMicroelectronics

SPC58EC80E7QMC0Y by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates up to 125 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and FlexRay. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,531

-

-

-

-

Digiode

USA . 1,727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,727

-

-

-

-

Anansix

USA . 844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

844

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 75 parts In-Stock

1+ parts

$12.640

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$12.640

-

-

-

Vigor

Singapore . 60 parts In-Stock

1+ parts

$27.570

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$27.570

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$51.151

100+ parts

$46.547

1k+ parts

$41.944

10k+ parts

-

1,000

$51.151

$46.547

$41.944

-

IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$59.117

100+ parts

-

1k+ parts

$53.206

10k+ parts

-

1,245

$59.117

-

$53.206

-

MKK Technologies

India . 1,030 parts In-Stock

1+ parts

$111.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$111.166

-

-

-

DigiPath Technology Company

USA . 1,030 parts In-Stock

1+ parts

$111.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$111.166

-

-

-

Microchip USA

USA . 331 parts In-Stock

1+ parts

$234.170

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$234.170

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,202

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Corphita

USA . 940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

940

-

-

-

-

Parana Technologies

USA . 440 parts In-Stock

1+ parts

-

100+ parts

$70.684

1k+ parts

-

10k+ parts

-

440

-

$70.684

-

-

Overview

Unlock your project's potential with the SPC58EC80E7QMC0Y from STMicroelectronics—a leader in high-quality microcontroller solutions. Designed for automotive and industrial applications, this robust 32-bit MCU offers reliable performance in extreme conditions, thanks to its AEC-Q100 screening. Experience enhanced efficiency and seamless connectivity features like Ethernet and FlexRay, ensuring your innovations thrive with precision and reliability. Elevate your designs with STMicroelectronics' commitment to excellence, delivering value and performance you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protection from environmental factors, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves data access speeds, enhancing overall processor performance and efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly, reducing manufacturing costs.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage contributes to energy efficiency, making this microcontroller ideal for battery-powered applications.

On Chip Data RAM Width: 8

An 8-bit RAM width is suitable for a range of tasks and can handle moderate processing requirements efficiently.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards ensures the microcontroller is optimized for automotive applications where durability is critical.

Package Shape: SQUARE

The square package shape lends flexibility in prototyping and integration into various circuit designs.

Bit Size: 32

The 32-bit architecture allows for greater data processing capabilities and improves performance for complex applications.

No. of Terminals: 176

A high number of terminals allows for extensive functionality and connectivity, enabling complex designs.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This package style facilitates efficient thermal management while providing a compact footprint for integration.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage further enhances energy efficiency, making it suitable for low-power applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature expands the range of environments where the microcontroller can function, ensuring reliability.

CPU Family: E200Z4

The E200Z4 family is known for its performance and efficiency in embedded applications, providing an excellent choice for many designs.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microcontroller suitable for harsh environments and outdoor applications.

ADC Channels: YES

Integrated ADC channels enable direct data acquisition from sensors, simplifying system design.

DMA Channels: YES

Direct Memory Access (DMA) channels improve processing efficiency by allowing peripherals to transfer data without CPU intervention.

Terminal Position: QUAD

Quad terminal position enhances connectivity flexibility and aids in board space optimization.

ROM Words: 4194304

A large ROM allows for extensive program storage, accommodating complex applications and functionalities.

Maximum Seated Height: 1.6 mm

Low seated height enables more compact circuit designs, appealing to space-conscious applications.

Width: 24 mm

A manageable width facilitates easy integration into various applications while maintaining a good number of connections.

Data EEPROM Size: 128K

Adequate EEPROM size allows for non-volatile data storage, enhancing the reliability of critical information.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging, reducing development time and costs.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances functional capabilities, making it versatile for various applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster processing and responsiveness in real-time applications.

Length: 24 mm

Length matches width, facilitating straightforward layout designs in electronic circuits.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient instruction execution, leading to improved performance and lower power consumption.

No. of Timers: 12

Multiple timers allow for complex timing applications, making it suitable for automation and control systems.

RAM Bytes: 393216

A substantial amount of RAM enhances the microcontroller's ability to handle more data and perform complex tasks effectively.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, making it suitable for modern applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring reliable electrical connections.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-precision ADC channels enable effective sensor integration for real-time data processing.

Maximum Supply Current: 50 mA

Low maximum supply current enhances energy efficiency, making it suitable for low-power devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage close to the minimum ensures energy efficiency in power-sensitive applications.

No. of DMA Channels: 64

Extensive DMA channels enhance data transfer efficiency between peripherals, reducing CPU load and improving overall system performance.

No. of Serial I/Os: 18

A high number of serial I/O channels increases connectivity options, allowing for a wide range of communication interfaces.

PWM Channels: YES

PWM support allows for easy implementation of motor control and other applications requiring precise timing.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Diverse connectivity options enhance compatibility with various external devices, making it a versatile choice for networking applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, ensuring longevity and adaptability of the product.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density designs, making better use of limited board space.

Format: FLOATING POINT

Floating point support enables complex arithmetic calculations, broadening the application range significantly.

Speed: 180 rpm

A reliable operational speed is suitable for applications requiring consistent performance and control.

Low Power Mode: YES

Low power mode enhances battery life in portable devices, making it an ideal choice for energy-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates simpler programming and handling of control processes efficiently.

Technical Specifications

Microcontrollers SPC58EC80E7QMC0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7QMC0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 21