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SPC58EC80E7QMC0X

STMicroelectronics

SPC58EC80E7QMC0X by STMicroelectronics

SPC58EC80E7QMC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 125 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and FlexRay. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,210 parts In-Stock

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12,210

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Digiode

USA . 1,359 parts In-Stock

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1,359

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Anansix

USA . 332 parts In-Stock

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332

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Distributors (Availability)

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AZTECH Wire

Italy . 898 parts In-Stock

1+ parts

$12.170

100+ parts

-

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898

$12.170

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Microchip USA

USA . 475 parts In-Stock

1+ parts

$29.457

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475

$29.457

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Ampacity Inc.

Singapore . 1,067 parts In-Stock

1+ parts

$31.000

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1,067

$31.000

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IDEA Electronic Components Group

UK . 1,997 parts In-Stock

1+ parts

$60.869

100+ parts

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$54.782

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1,997

$60.869

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$54.782

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Component Stockers USA

USA . 216 parts In-Stock

1+ parts

$99.990

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216

$99.990

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MKK Technologies

India . 910 parts In-Stock

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$114.460

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910

$114.460

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DigiPath Technology Company

USA . 910 parts In-Stock

1+ parts

$114.460

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910

$114.460

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Vigor

Singapore . 2,674 parts In-Stock

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2,674

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Corphita

USA . 2,659 parts In-Stock

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2,659

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Parana Technologies

USA . 1,432 parts In-Stock

1+ parts

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100+ parts

$72.778

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1,432

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$72.778

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Overview

Unlock unparalleled performance with the SPC58EC80E7QMC0X microcontroller from STMicroelectronics, a leader in semiconductor innovation. Designed for automotive and industrial applications, this robust device excels in efficiency, reliability, and low power consumption, ideal for demanding environments. With advanced features like integrated cache and multiple connectivity options, it empowers engineers to create cutting-edge solutions while ensuring safety and precision in every project. Boost your designs with ST's commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability in various environments.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency in handling data.

Surface Mount: YES

Supports modern manufacturing processes, saving board space and minimizing assembly costs.

Maximum Supply Voltage: 1.26 V

Operating at a low voltage enhances energy efficiency, making it ideal for battery-powered devices.

On Chip Data RAM Width: 8

The 8-bit wide RAM facilitates simple data processing suitable for a wide range of applications.

Screening Level: AEC-Q100

Qualifies for automotive applications, ensuring reliability under harsh conditions.

Package Shape: SQUARE

Square package design aids in uniform layout and efficient use of PCB space.

Bit Size: 32

32-bit architecture supports larger data types and improves performance for complex applications.

No. of Terminals: 176

Provides extensive connectivity options for interfacing with various peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Versatile style suits various PCB layouts and enhances heat dissipation.

Minimum Supply Voltage: 1.14 V

Low minimum voltage further supports the energy efficiency needed for portable applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance allows it to function in extreme environments.

CPU Family: E200Z4

Belongs to a proven family of microcontrollers known for reliability and performance.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures makes it suitable for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC channels enhance flexibility for sensor interfacing and data acquisition.

DMA Channels: YES

Presence of DMA channels minimizes CPU load, improving overall system performance.

Terminal Position: QUAD

Allows for efficient routing on PCB, reducing complexity of the design.

ROM Words: 4194304

Large ROM capacity enables the storage of extensive applications and firmware.

Maximum Seated Height: 1.6 mm

Low profile aids in compact designs and thermal efficiency.

Width: 24 mm

Standard width makes it compatible with various enclosure and layout designs.

Data EEPROM Size: 128K

Sufficient EEPROM allows for data retention and adjustable settings in applications.

Boundary Scan: YES

Facilitates testing and debugging of the PCB, enhancing development efficiency.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals supports a wide variety of applications and system control.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast execution of tasks, improving responsiveness.

Length: 24 mm

Standard length aids in uniform PCB designs and manufacturability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance while reducing power consumption.

No. of Timers: 12

Multiple timers facilitate precise control and scheduling in complex applications.

RAM Bytes: 393216

Ample RAM size supports multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering quality and reliability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs enhance signal processing capabilities for a wide range of sensors.

Maximum Supply Current: 50 mA

Moderate supply current keeps energy usage relatively low, ensuring efficiency.

Nominal Supply Voltage: 1.2 V

A nominal voltage further supports low-power applications, ideal for energy-sensitive designs.

No. of DMA Channels: 64

A high count of DMA channels enhances data handling efficiency and system performance.

No. of Serial I/Os: 18

Ample serial I/O allows for extensive communication options, improving system versatility.

PWM Channels: YES

PWM capabilities enable precise control of motors and other actuators in applications.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Diverse connectivity options provide flexibility for various communication needs.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware.

Terminal Pitch: 0.5 mm

Fine pitch enables high-density designs, allowing for reduced PCB size.

Format: FLOATING POINT

Floating-point support allows for complex mathematical operations, enhancing processing capability.

Speed: 180 rpm

Planar speed facilitates efficient performance in motor control applications.

Low Power Mode: YES

Low power modes enhance battery life in portable applications, making it more energy-efficient.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient instruction processing suitable for various tasks.

Technical Specifications

Microcontrollers SPC58EC80E7QMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7QMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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