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SPC58EC80E7GMC0X

STMicroelectronics

SPC58EC80E7GMC0X by STMicroelectronics

SPC58EC80E7GMC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 105 °C. It features integrated cache, 64 DMA channels, and supports various connectivity options like Ethernet and SPI. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 10,868 parts In-Stock

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Anansix

USA . 813 parts In-Stock

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Digiode

USA . 207 parts In-Stock

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AZTECH Wire

Italy . 1,045 parts In-Stock

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$19.520

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$19.520

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Microchip USA

USA . 2,836 parts In-Stock

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$53.960

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IDEA Electronic Components Group

UK . 464 parts In-Stock

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$62.835

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$56.552

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464

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MKK Technologies

India . 1,135 parts In-Stock

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$118.157

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$118.157

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DigiPath Technology Company

USA . 1,135 parts In-Stock

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$118.157

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Corphita

USA . 2,278 parts In-Stock

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Parana Technologies

USA . 468 parts In-Stock

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$75.129

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Overview

Unlock unparalleled performance with the SPC58EC80E7GMC0X microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile solution perfect for automotive and industrial applications, ensuring reliability under extreme conditions. Enjoy enhanced efficiency, robust connectivity options, and low power consumption, empowering your designs while reducing time-to-market and boosting overall value. Experience the advantage of superior technology that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in varying environments, making it suitable for long-term applications.

Integrated Cache: YES

An integrated cache improves data access speed, enhancing overall performance for demanding applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint, facilitating compact designs in modern electronic products.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage reduces power consumption, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width can effectively support various processing tasks, balancing performance and complexity.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards signifies high reliability, making the product suitable for automotive applications.

Package Shape: SQUARE

A square package shape allows for easier mounting and circuit layout, enhancing design flexibility.

Bit Size: 32

A 32-bit architecture provides enhanced processing power, allowing for complex computations and multitasking.

No. of Terminals: 176

A higher number of terminals supports a wide array of connectivity options, making it versatile for various applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This style supports effective heat dissipation and space efficiency, critical for high-performance systems.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enhances efficiency and broadens compatibility with various power sources.

Maximum Operating Temperature: 105 °C

A high operating temperature range allows for use in demanding environments, ensuring reliability in harsh conditions.

CPU Family: E200Z4

The E200Z4 family offers optimized performance for embedded applications, ensuring faster processing and responsiveness.

Minimum Operating Temperature: -40 °C

Extensive operating temperature range (-40 °C to 105 °C) ensures functionality in extreme environments, suitable for industrial and automotive applications.

ADC Channels: YES

Analog-to-Digital Converter channels allow for better interaction with sensors, enhancing data processing capabilities.

DMA Channels: YES

Direct Memory Access (DMA) capabilities improve data handling efficiency, reducing CPU load and increasing system performance.

Terminal Position: QUAD

Quad terminal positions enhance connectivity and physical stability on PCB layouts, ensuring reliable installations.

ROM Words: 4194304

A large ROM capacity allows for significant program storage, enabling complex applications without compromising performance.

Maximum Seated Height: 1.6 mm

Low profile design optimizes space usage on PCBs, allowing for denser circuit layouts.

Width: 24 mm

A compact width aids in design versatility, allowing the microcontroller to fit into smaller devices.

Data EEPROM Size: 128K

Sufficient EEPROM storage facilitates data retention and logging capabilities, critical for many embedded applications.

Boundary Scan: YES

Boundary scan support enhances testing and debugging efficiency, ensuring robust system design and reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals including timers and watchdog timers offer advanced control features for complex applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency enables responsive operation and supports demanding performance needs in embedded systems.

Length: 24 mm

The length complements its width for a compact design, ideal for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller promotes efficiency and speed, optimizing performance in embedded tasks.

No. of Timers: 12

Multiple timers provide versatile scheduling and timing options, critical for various time-sensitive operations.

RAM Bytes: 393216

Ample RAM size supports complex applications, allowing for efficient data processing and execution.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making it ideal for portable devices.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering reliability and supports better thermal performance, essential for device durability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high precision enhance data acquisition from sensors, maintaining performance in analytical applications.

Maximum Supply Current: 50 mA

A relatively low supply current optimizes power efficiency, crucial for battery-powered applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage is conducive for low-power applications, ensuring longer battery life.

No. of DMA Channels: 64

64 DMA channels provide extensive data handling capabilities, streamlining operations in complex systems.

No. of Serial I/Os: 18

A high number of serial I/Os facilitate extensive connectivity for peripherals, enhancing functionality.

PWM Channels: YES

Pulse Width Modulation channels enable precise control in motor and lighting applications, enhancing versatility.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

A wide range of connectivity options supports communication with various devices, making it adaptable for different applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications, ensuring longevity and adaptability of the product.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports high-density designs, ideal for modern compact electronic systems.

Format: FLOATING POINT

Floating point support allows for complex mathematical computations, making the microcontroller suitable for advanced processing tasks.

Speed: 180 rpm

Speed capabilities of 180 rpm make it appropriate for applications requiring quick responses or adjustments.

Low Power Mode: YES

Low power mode capabilities enhance power efficiency further, extending operation time in battery-powered devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with various programming architectures while allowing efficient use of available resources.

Technical Specifications

Microcontrollers SPC58EC80E7GMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7GMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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