Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
SPC58EC80E7FMC1X by STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has integrated cache, and offers extensive connectivity options like Ethernet and FlexRay. With a wide operating temp range (-40 °C to 105 °C), it ensures reliability in harsh environments.
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This durable material provides reliable performance and protection in various environments.
The presence of cache enhances speed and efficiency in data access, leading to improved overall performance.
The surface mount design allows for compact PCB layouts, saving space and enabling higher component density.
A low maximum supply voltage helps in reducing power consumption, making it ideal for battery-powered devices.
An 8-bit RAM width supports efficient data processing for a variety of applications.
Meeting AEC-Q100 standards ensures reliability and robustness for automotive applications.
A square package shape can facilitate better thermal performance and assembly for more complex designs.
A 32-bit architecture enables the microcontroller to handle larger data types and more complex instructions.
A high number of terminals allows for a greater variety of I/O options, facilitating more complex interfacing.
This versatile package style allows for effective heat dissipation and space-saving on circuit boards.
The low minimum supply voltage supports low-power operations, essential for energy-efficient designs.
Operating at higher temperatures makes it suitable for demanding environments, including automotive and industrial applications.
The E200Z4 CPU family is designed for high performance, optimizing processing capabilities in embedded systems.
Withstand extreme cold, making it especially suitable for rugged outdoor applications.
Integrated ADC channels allow for direct analog signal processing, which is vital for sensor applications.
DMA channels facilitate efficient data transfers, freeing up the CPU for other tasks and improving throughput.
Quad terminal positioning provides better performance with parallel data transfer and enhanced flexibility in layout.
A substantial amount of ROM enables the storage of complex firmware and applications.
The low profile offers design flexibility in compact devices, contributing to space savings.
A 24 mm width provides an optimal balance between size and functionality for various applications.
The significant EEPROM size allows for the storage of persistent data, which is crucial for many control applications.
Boundary scan capability simplifies testing and debugging processes in complex PCB assemblies.
An array of peripherals enables a wide range of functionalities, allowing it to cater to diverse applications.
The high clock frequency supports fast processing speeds, ideal for time-sensitive applications.
A compact length aids in maintaining a small form factor for devices, supporting modern design trends.
RISC architecture ensures efficient instruction processing, enhancing performance for embedded applications.
Multiple timers facilitate the ability to manage various time-based applications simultaneously.
A generous amount of RAM enables the processing of larger datasets and more complex algorithms.
CMOS technology provides low power consumption and high performance, making it ideal for portable applications.
The gull-wing terminal form enhances soldering reliability and performance in surface-mounted devices.
High-resolution ADCs allow for precise signal conversion, making it suitable for high-accuracy applications.
The low maximum supply current further enhances energy efficiency, beneficial for battery-operated devices.
A low nominal voltage aligns with current trends in energy-efficient designs and low-power systems.
A high count of DMA channels allows for extensive data handling capabilities without CPU overhead.
An ample number of serial I/O lines allows for versatile communication options with various peripherals.
Integrated PWM channels provide the means for effective motor control and analog signal generation.
Diverse connectivity options ensure compatibility with a wide range of communication protocols and devices.
Flash programmability allows for easy updates and modifications, essential for evolving application requirements.
A fine terminal pitch enables compact arrangements, supporting high-density PCB design configurations.
Floating point format supports high-precision calculations, essential for complex mathematical computations.
This speed is suitable for applications requiring quick and efficient processing, such as control systems.
The availability of a low power mode contributes to battery conservation, extending the operational lifetime of devices.
An 8-bit program ROM width facilitates efficient data handling, suitable for embedded application designs.
Microcontrollers SPC58EC80E7FMC1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics
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SPC58EC80E7FMC1X Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - CARRIER TAPE CHANGE 06/APR/2023
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NDT2955
Onsemi
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-T1-E3
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SPC TECHNOLOGY/ MULTICOMP
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
ULN2003ADR
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
Yangzhou Yangjie Electronics
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
Gec Plessey Semiconductors
ATMEGA644PA-PU
ATMEGA644PA-PU by Microchip: 5.5V max supply, 20MHz clock, 32 I/O lines. Ideal for industrial applications requiring low power consumption and high-speed processing with peripherals like PWM, timers, and ADC channels.
STM32F429ZET6
STMicroelectronics
STM32F429ZET6 by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 50 MHz. It features 262144 bytes of RAM, 524288 ROM words, and peripherals like DMA(2) and RTC. Ideal for industrial applications requiring high-speed processing and extensive connectivity options such as USB, Ethernet, and UART(4).
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
ATSAMC21G18A-AUT
Microchip ATSAMC21G18A-AUT is a 32-bit Cortex-M0+ microcontroller with 48 pins, operating at up to 48 MHz. It features 14-Ch ADC, 1-Ch DAC, and 12 DMA channels. Ideal for industrial applications requiring low power consumption and high-speed connectivity via SERCOM.
ATSAMD21G18A-MU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
TM4C123GH6PMIR
TM4C123GH6PMIR by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 25 MHz. It has 64 terminals, ADC and DMA channels, and can operate in industrial temperature grades. This microcontroller is commonly used in applications requiring high-speed processing and control.
MK70FN1M0VMJ15R
Freescale Semiconductor
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Width: 17 mm;
STM32F103TBU6
STM32F103TBU6 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 20480 RAM bytes. It operates at a max clock frequency of 25 MHz, suitable for industrial applications requiring CAN, I2C, SPI connectivity. With 10-Ch 12-Bit ADC channels and PWM support, it offers versatile peripheral options for efficient system integration.
MC705P6ACDWE
MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
MSP430G2452IN20
MSP430G2452IN20 by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 256B RAM. It features 8 ADC channels, 4 timers, and low power mode. Ideal for industrial applications requiring high-speed processing at up to 16MHz clock frequency.
STM32F437ZGT6
STM32F437ZGT6 by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 50 MHz. It features 262KB RAM, 1MB ROM, and ADC/DAC channels. Ideal for industrial applications requiring high-speed processing and extensive connectivity options like Ethernet, USB, and UART.
STM32H743ZGT6
STM32H743ZGT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, 28-channel ADC, and connectivity options like CAN, I2C, UART, and USB.
STM32F303CBT6TR
STM32F303CBT6TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 32768 RAM bytes, and 15-Ch 12-Bit ADC channels. It operates at a max clock frequency of 32 MHz and features peripherals like CAN, I2C(2), SPI(3), and USB. Ideal for industrial applications requiring high-speed processing and connectivity capabilities.
STM32F205VCT6
STM32F205VCT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, offering 262144 ROM words and 98304 RAM bytes. It features 2 DAC channels, 16 ADC channels, and 17 timers for applications in industrial-grade environments requiring high-speed processing and extensive peripheral connectivity like CAN, I2C, SPI, UART, USB.
STM32H757IIT6
STM32H757IIT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, 22 timers, and 28 ADC channels. It operates at up to 48 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With integrated cache and multiple connectivity options like CAN, I2C, SPI, and USB, it offers versatile solutions for various embedded systems.
STM32G071CBT6
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ATMEGA1280-16AU
ATMEGA1280-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It has a max clock frequency of 16 MHz and is commonly used in industrial applications for its low power mode and wide range of peripherals such as BOD, PWM, RTC, and more.
STM8S003F3P6
STM8S003F3P6 by STMicroelectronics is an 8-bit microcontroller with 16 MHz clock frequency, 5-Ch 10-Bit ADC, and 128 bytes of data EEPROM. Ideal for industrial applications requiring low power mode, it offers connectivity via I2C, SPI, and UART interfaces. With a compact form factor of 4.4mm x 6.5mm and operating temperature range from -40°C to +85°C, it suits various embedded system designs.
ATSAMD21J18A-MU
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;
ATSAMD21G18A-AUT
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SPC5517EBMLQ66R
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
NXP Semiconductors' SPC5517EBMLQ66R microcontroller features 32-bit architecture, 5V power supply, and 40MHz clock frequency. Ideal for automotive applications with CAN, I2C, SCI, SPI connectivity and AEC-Q100 screening level. Offers low power mode and extensive peripherals like DMA(16), RTC, POR.
SPC5517EBMLQ66
NXP Semiconductors' SPC5517EBMLQ66 microcontroller features 32-bit address bus, 8 DMA channels, and 40 MHz clock frequency. Ideal for automotive applications with CAN, I2C, SCI, SPI connectivity and low power mode support. This CMOS device offers 81920 bytes of RAM and operates b/w -40 to 125°C temperature range.
SPC5744PFK1AMLQ9
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
SPC584B70E3EHC0X
STMicroelectronics SPC584B70E3EHC0X is a 32-bit microcontroller with integrated cache, 64K data EEPROM, and 131072 RAM bytes. It operates at up to 40 MHz clock frequency and features CAN, DSPI, I2C connectivity for automotive applications. With low power mode and AEC-Q100 screening level, it's ideal for high-performance embedded systems.
SPC5604PGF1MLL6
NXP Semiconductors' SPC5604PGF1MLL6 microcontroller features 32-bit CPU, 524288 ROM words, and 40960 RAM bytes. Ideal for automotive applications with AEC-Q100 screening level, it operates b/w -40 to 125 °C at a max clock frequency of 40 MHz.
Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
SPC5645SF1VLUR
NXP Semiconductors' SPC5645SF1VLUR microcontroller features 32-bit architecture, 176 terminals, and 16 MHz clock frequency. Ideal for industrial applications requiring CAN, I2C, SPI connectivity with low power mode and 16 DMA channels for efficient data transfer.
Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: QFP; Package Shape: SQUARE;
SPC5674FF3MVY3R
NXP Semiconductors' SPC5674FF3MVY3R microcontroller features 32-bit CPU, 262144 bytes RAM, and 4194304 ROM words. Ideal for automotive applications with AEC-Q100 screening level, it offers 40 MHz clock frequency and supports ADC/DMA channels. Measuring 27mm x 27mm in a grid array package style, it operates b/w -40°C to 125°C temperature range.
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
SPC5643LFAMLQ1
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
SPC5604PGF1MLQ6
Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
SPC560B60L3C6E0X
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
SPC5643LF0MLQ8
SPC5643LF0MLQ8 by Freescale Semiconductor is a 32-bit microcontroller with 131072 RAM Bytes and 1048576 ROM Words. It is designed for automotive applications, featuring a temperature range of -40 to 125 °C and AEC-Q100 screening level. The package style is FLATPACK with 144 terminals in a SQUARE shape.
SPC5643LFK0MLL6
SPC5775BDK3MME2
Microcontrollers; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e2; Peak Reflow Temperature (C): 260;
SPC5775BDK3MME2R
Microcontrollers; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e2; Terminal Finish: TIN SILVER;
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