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SPC58EC80E7E0C0X

STMicroelectronics

SPC58EC80E7E0C0X by STMicroelectronics

SPC58EC80E7E0C0X by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 40 MHz, supporting AEC-Q100 screening for automotive applications. It features integrated cache and up to 64 DMA channels for efficient data handling. With a wide operating temp range (-40 °C to 105 °C), it's ideal for robust environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,951 parts In-Stock

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10,951

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Digiode

USA . 2,965 parts In-Stock

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2,965

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Anansix

USA . 1,673 parts In-Stock

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1,673

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 870 parts In-Stock

1+ parts

$17.000

100+ parts

-

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870

$17.000

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IDEA Electronic Components Group

UK . 584 parts In-Stock

1+ parts

$53.158

100+ parts

-

1k+ parts

$47.842

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584

$53.158

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$47.842

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MKK Technologies

India . 850 parts In-Stock

1+ parts

$99.959

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850

$99.959

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DigiPath Technology Company

USA . 850 parts In-Stock

1+ parts

$99.959

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850

$99.959

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Corphita

USA . 2,285 parts In-Stock

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2,285

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Parana Technologies

USA . 1,403 parts In-Stock

1+ parts

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$63.558

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1,403

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$63.558

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Overview

Unlock your project's potential with the SPC58EC80E7E0C0X microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for robustness and efficiency, this versatile MCU excels in automotive and industrial applications, ensuring exceptional performance even in extreme conditions. Benefit from its advanced features like integrated cache and multiple connectivity options, providing unparalleled value and reliability for your innovative designs. Choose STMicroelectronics for superior quality and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials like plastic and epoxy enhance the microcontroller's structural integrity and thermal resistance, making it suitable for diverse environments.

Integrated Cache: YES

The presence of integrated cache improves data processing speed, resulting in better overall performance for demanding applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easier integration into modern electronic devices.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage enhances energy efficiency, making this microcontroller ideal for battery-powered applications.

On Chip Data RAM Width: 8

The 8-bit RAM width provides a good balance of performance and resource allocation in a wide range of applications.

Screening Level: AEC-Q100

AEC-Q100 ensures automotive-grade reliability, making this microcontroller suitable for automotive and industrial applications.

Package Shape: SQUARE

The square package shape allows for efficient heat dissipation and easier layout on circuit boards.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle more complex computations and a larger data range, enhancing its capability for advanced applications.

No. of Terminals: 176

A greater number of terminals allows for more connectivity options and the ability to interface with a wide variety of peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This style allows for effective thermal management and space-saving designs, making it versatile for various applications.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage enhances efficiency and heat management in low-power applications.

Maximum Operating Temperature: 105 °C

With high-temperature tolerance, it operates reliably in harsh environments, making it suitable for a wide range of industrial applications.

CPU Family: E200Z4

The E200Z4 family provides a robust architecture with efficient power consumption, enhancing processing capabilities.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures allows this microcontroller to function in challenging environments, ensuring reliability.

ADC Channels: YES

Integration of ADC channels enhances the microcontroller's ability to handle analog signals, widening its application scope.

DMA Channels: YES

Dynamic memory access allows for efficient data transfers, improving overall system performance in data-intensive tasks.

Terminal Position: QUAD

Quad terminal position improves the microcontroller's ease of integration into various boards, ensuring stable connections.

ROM Words: 4194304

Ample ROM storage enables sophisticated programs and firmware, providing flexibility for complex applications.

Maximum Seated Height: 1.6 mm

A low profile design contributes to space-saving in compact devices and enables better performance in tighter layouts.

Width: 24 mm

This standard width makes it easily accommodated in various PCB designs, ensuring compatibility.

Data EEPROM Size: 128K

Generous EEPROM size supports ample data storage and retention, enhancing functionality in applications requiring data logging.

Boundary Scan: YES

Boundary scan capability facilitates debugging and testing, ensuring the reliability of the microcontroller's connections.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of integrated peripherals provides extensive functionalities, enabling versatile application designs.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for rapid processing, making this microcontroller suitable for performance-critical applications.

Length: 24 mm

Standardized length ensures compatibility in existing designs, making it easier to replace or upgrade components.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes the microcontroller for speed and efficiency, enhancing performance in embedded applications.

No. of Timers: 12

Multiple timers allow for greater flexibility in time-sensitive operations, which is critical in real-time applications.

RAM Bytes: 393216

Ample RAM supports complex algorithms and applications requiring significant data manipulation.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making it ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering connections, enhancing durability and stability on circuit boards.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs enable precise data acquisition from sensors, increasing application accuracy and quality.

Maximum Supply Current: 50 mA

A low maximum supply current is beneficial for energy-conscious designs, ensuring longer battery life in portable devices.

Nominal Supply Voltage: 1.2 V

Nominal voltage at 1.2 V strikes a balance between performance and power efficiency, perfect for low-power operations.

No. of DMA Channels: 64

Having 64 DMA channels maximizes data handling capabilities without CPU overhead, improving operational efficiency.

No. of Serial I/Os: 26

A higher number of serial I/O channels allows for extensive peripheral interfacing, which is essential for complex systems.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors and other actuators, broadening application possibilities.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options facilitate easy integration with multiple devices and protocols, enhancing system interoperability.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, offering flexibility in design and deployment.

Terminal Pitch: 0.5 mm

A fine terminal pitch caters to compact PCB layouts, maximizing functionality in small form-factor designs.

Format: FLOATING POINT

Floating point format enables efficient handling of complex mathematical calculations, enhancing performance in scientific applications.

Speed: 120 rpm

The supported speed is adequate for many applications, ensuring that the microcontroller can meet performance demands.

Low Power Mode: YES

Low power mode capabilities enhance energy efficiency, making this microcontroller particularly well-suited for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates easier management of firmware, simplifying development for designers.

Technical Specifications

Microcontrollers SPC58EC80E7E0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7E0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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