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SPC58EC80E3QMC0Y

STMicroelectronics

SPC58EC80E3QMC0Y by STMicroelectronics

SPC58EC80E3QMC0Y by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates up to 125 °C, making it ideal for automotive applications. It features integrated cache, DMA channels, and multiple connectivity options like Ethernet and UART. With its low power mode and robust performance, it's perfect for advanced control systems in vehicles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,827 parts In-Stock

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9,827

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Digiode

USA . 4,379 parts In-Stock

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4,379

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Anansix

USA . 2,843 parts In-Stock

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2,843

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Distributors (Availability)

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AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$22.160

100+ parts

-

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361

$22.160

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Vigor

Singapore . 73 parts In-Stock

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$24.750

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73

$24.750

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Microchip USA

USA . 312 parts In-Stock

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$29.545

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312

$29.545

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$37.443

100+ parts

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$33.699

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1,848

$37.443

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$33.699

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MKK Technologies

India . 1,783 parts In-Stock

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$70.409

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1,783

$70.409

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DigiPath Technology Company

USA . 1,783 parts In-Stock

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$70.409

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$70.409

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Component Stockers USA

USA . 452 parts In-Stock

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$99.990

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452

$99.990

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BidChips

USA . 29,160 parts In-Stock

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$15.380

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$15.380

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$15.380

29,160

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$15.380

$15.380

$15.380

Corphita

USA . 1,793 parts In-Stock

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1,793

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Parana Technologies

USA . 1,787 parts In-Stock

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$44.769

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1,787

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$44.769

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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Overview

Unlock unparalleled performance and reliability with the SPC58EC80E3QMC0Y microcontroller from STMicroelectronics. Renowned for its high-quality engineering, STMicroelectronics combines advanced features and robust design, ensuring exceptional efficiency for automotive applications and beyond. With low power consumption and a wide operational temperature range, this microcontroller empowers innovation while delivering unmatched value and performance to your projects. Experience seamless connectivity and enhanced processing power that drives success in every application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures longevity and reliability in various environments.

Integrated Cache: YES

The inclusion of integrated cache enhances performance by reducing access time to frequently used data.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 1.26 V

A maximum supply voltage of 1.26 V aids in energy efficiency and reduces power consumption.

On Chip Data RAM Width: 8

With an 8-bit wide RAM, the microcontroller efficiently handles data operations and improves processing speed.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards guarantees reliability in automotive applications.

Package Shape: SQUARE

The square package shape is advantageous for layout design and efficient thermal management.

Bit Size: 32

The 32-bit architecture allows for complex computations and efficient multitasking capabilities.

No. of Terminals: 100

A high number of terminals provides versatility in connectivity options, accommodating a variety of peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This versatile package style is ideal for applications requiring low-profile designs and effective heat dissipation.

Minimum Supply Voltage: 1.14 V

The ability to operate at a low voltage increases compatibility with battery-operated devices.

Maximum Operating Temperature: 125 °C

A high operating temperature range is suitable for challenging environments, enhancing application flexibility.

CPU Family: E200Z4

The E200Z4 CPU family is known for its performance efficiency, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

This wide operating temperature range ensures reliable performance in extreme conditions.

ADC Channels: YES

With ADC channels available, this microcontroller can handle analog signals, supporting more complex applications.

DMA Channels: YES

DMA channels improve data transfer efficiency, allowing for faster processing without CPU intervention.

Terminal Position: QUAD

Quad terminal position enhances soldering options and improves mechanical stability on the PCB.

ROM Words: 4194304

A large ROM capacity allows for complex firmware storage, supporting advanced functionalities in applications.

Maximum Seated Height: 1.2 mm

The low height allows for compact designs, which is critical in modern miniaturized electronics.

Width: 14 mm

The compact width contributes to space efficiency in PCB design, important in consumer electronics.

Data EEPROM Size: 128K

The substantial EEPROM size facilitates data storage and retention across power cycles.

Boundary Scan: YES

Boundary scan capability allows for easier testing and debugging, enhancing reliability in production.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A comprehensive range of peripherals makes this microcontroller versatile for various applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster data processing, improving overall system performance.

Length: 14 mm

The compact length contributes to efficient use of board space, essential for designing smaller applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enables efficient instruction execution, optimizing performance per watt.

No. of Timers: 12

Having 12 timers provides flexibility for various timing functions, essential in real-time applications.

RAM Bytes: 393216

A substantial RAM size supports complex operations and multitasking capabilities in embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve PCB layout options.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels ensure precise analog signal processing, key for sensor integrations.

Maximum Supply Current: 50 mA

A manageable maximum current allows for efficient power management in portable devices.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage is optimized for low power applications, benefiting battery life.

No. of DMA Channels: 64

With 64 DMA channels, data transfer is streamlined, enhancing system performance without CPU load.

No. of Serial I/Os: 18

18 serial I/O options ensure versatile communication possibilities with various devices.

PWM Channels: YES

PWM channels facilitate motor control and signal modulation, opening up a variety of control applications.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Rich connectivity options support integration in complex networks and data communication systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the code after deployment.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch aids in high-density layouts, making it suitable for advanced manufacturing processes.

Format: FLOATING POINT

Supporting floating point format enables advanced mathematical operations, crucial for applications like signal processing.

Speed: 180 rpm

The speed rating indicates suitability for real-time control applications, enhancing performance.

Low Power Mode: YES

Low power mode features are essential for battery-saving applications, extending operational lifespan.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for optimized data handling and efficient code execution.

Technical Specifications

Microcontrollers SPC58EC80E3QMC0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E3QMC0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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