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SPC58EC80E3G001X

STMicroelectronics

SPC58EC80E3G001X by STMicroelectronics

SPC58EC80E3G001X by STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has 393216 bytes of RAM, and integrates multiple connectivity options like CAN and UART. With a compact design and low power mode, it excels in efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,179 parts In-Stock

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4,179

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Digiode

USA . 1,910 parts In-Stock

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1,910

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Anansix

USA . 901 parts In-Stock

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901

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Distributors (Availability)

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AZTECH Wire

Italy . 126 parts In-Stock

1+ parts

$15.740

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126

$15.740

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Microchip USA

USA . 1,949 parts In-Stock

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$53.869

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1,949

$53.869

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IDEA Electronic Components Group

UK . 832 parts In-Stock

1+ parts

$65.997

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$59.397

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832

$65.997

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$59.397

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MKK Technologies

India . 213 parts In-Stock

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$124.103

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213

$124.103

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DigiPath Technology Company

USA . 213 parts In-Stock

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$124.103

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213

$124.103

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Corphita

USA . 2,849 parts In-Stock

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2,849

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Parana Technologies

USA . 1,016 parts In-Stock

1+ parts

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$78.910

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1,016

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$78.910

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Overview

Unlock the potential of your projects with the SPC58EC80E3G001X microcontroller from STMicroelectronics. Renowned for its quality and innovation, STMicroelectronics offers this advanced 32-bit MCU designed for automotive applications, ensuring reliability in demanding environments. With features like integrated cache, multiple connectivity options, and robust temperature resilience, this microcontroller enhances efficiency while driving performance. Elevate your designs with a trusted partner that delivers exceptional value and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the longevity and reliability of the microcontroller in various environments.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency, making this microcontroller suitable for high-performance applications.

Surface Mount: YES

Surface mount capability allows for smaller and more efficient PCB designs, facilitating compact product development.

Maximum Supply Voltage: 1.26 V

Operating at a low maximum supply voltage aids in reducing power consumption, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit RAM width supports efficient data processing for many applications, enhancing overall performance.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability for automotive applications, making this microcontroller trustworthy for critical deployments.

Package Shape: SQUARE

The square package shape can simplify layout considerations on PCBs, beneficial for compact applications.

Bit Size: 32

A 32-bit architecture allows for advanced computational capabilities, making it suitable for complex applications.

No. of Terminals: 100

A higher number of terminals provides flexibility for peripheral connections, allowing for diverse use cases.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Versatile package styles allow integration into various designs, especially in space-constrained environments.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage further enhances energy efficiency, suitable for low-power applications.

Maximum Operating Temperature: 105 °C

Ability to operate at high temperatures expands the scope of applications, especially in harsh environments.

CPU Family: E200Z4

The E200Z4 CPU family offers robust performance for embedded applications, ensuring responsive operation.

Minimum Operating Temperature: -40 °C

Extreme temperature range capability makes it suitable for outdoor and industrial applications.

ADC Channels: YES

Analog to digital conversion capability allows for real-time data processing from various sensors.

DMA Channels: YES

With DMA channels, the microcontroller can efficiently handle data transfers, improving overall speed and performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier circuit board layout and optimized space utilization.

ROM Words: 4194304

Ample ROM space allows for complex firmware and enhanced functionality in the microcontroller.

Maximum Seated Height: 1.2 mm

A low seated height contributes to compact designs, beneficial for modern electronic applications.

Width: 14 mm

The compact width allows easy integration into size-sensitive projects while maintaining performance.

Data EEPROM Size: 128K

Sufficient EEPROM size enables storage of configuration and calibration data, necessary for embedded systems.

Boundary Scan: YES

Boundary scan capability helps in fault detection during testing, improving reliability in manufacturing processes.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

An extensive range of peripherals supports various functionalities, enhancing usability in multiple applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster processing, suitable for time-sensitive applications.

Length: 14 mm

The length complements its width to maintain a compact profile, suitable for modern electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient computational performance, which is essential for embedded systems.

No. of Timers: 12

Multiple timers afford greater flexibility for time-based operations, enhancing application versatility.

RAM Bytes: 393216

Large RAM size supports complex algorithms and data handling, beneficial for advanced applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed operations.

Terminal Form: GULL WING

Gull wing terminations allow for easy soldering and improved thermal dissipation.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Having multiple ADCs allows the microcontroller to interface well with various sensors and acquire precise data.

Maximum Supply Current: 50 mA

A low maximum supply current ensures efficiency, extending battery life in portable applications.

Nominal Supply Voltage: 1.2 V

Nominal voltage of 1.2 V indicates optimal performance at low power levels, ideal for energy-efficient designs.

No. of DMA Channels: 64

64 DMA channels permit efficient data handling, improving throughput and overall system performance.

No. of Serial I/Os: 26

Multiple serial I/O options facilitate communication with various peripherals, enhancing system interconnectivity.

PWM Channels: YES

Presence of PWM channels supports diverse output control applications, essential for motor control and signal modulation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Robust connectivity options enhance communication capabilities with external devices, making it versatile for various applications.

ROM Programmability: FLASH

FLASH programming provides flexibility for firmware updates, essential for evolving designs.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for denser connections in smaller packages, beneficial for compact designs.

Format: FLOATING POINT

Floating point support enables efficient processing of real numbers, essential for complex calculations.

Speed: 180 rpm

The speed specification may relate to application-specific functions, contributing to performance expectations in built systems.

Low Power Mode: YES

Low power mode functionality decreases energy consumption during idle periods, extending battery life.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width can enhance code efficiency and execution speed for many applications.

Technical Specifications

Microcontrollers SPC58EC80E3G001X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E3G001X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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