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SPC58EC80E1Q0C1X

STMicroelectronics

SPC58EC80E1Q0C1X by STMicroelectronics

SPC58EC80E1Q0C1X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40MHz clock speed. It includes integrated cache, DMA channels, and multiple connectivity options like CAN and UART. Ideal for automotive applications with AEC-Q100 screening.

Median Price

$20.750

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 197 parts In-Stock

1+ parts

$15.900

100+ parts

$10.870

1k+ parts

-

10k+ parts

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197

$15.900

$10.870

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-

DigiKey

USA . 75 parts In-Stock

1+ parts

$20.750

100+ parts

$14.395

1k+ parts

$13.520

10k+ parts

-

75

$20.750

$14.395

$13.520

-

Mouser Electronics

USA . 26 parts In-Stock

1+ parts

$20.750

100+ parts

$14.400

1k+ parts

$13.520

10k+ parts

-

26

$20.750

$14.400

$13.520

-

Newark

USA . 197 parts In-Stock

1+ parts

$21.370

100+ parts

$17.080

1k+ parts

$15.870

10k+ parts

-

197

$21.370

$17.080

$15.870

-

Element14

Singapore . 197 parts In-Stock

1+ parts

-

100+ parts

$23.820

1k+ parts

-

10k+ parts

-

197

-

$23.820

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,237 parts In-Stock

1+ parts

$22.658

100+ parts

-

1k+ parts

-

10k+ parts

-

2,237

$22.658

-

-

-

Vyrian

USA . 9,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,107

-

-

-

-

Anansix

USA . 1,318 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,318

-

-

-

-

Chip Stock

USA . 845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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845

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,550 parts In-Stock

1+ parts

$21.465

100+ parts

-

1k+ parts

-

10k+ parts

-

4,550

$21.465

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-

-

Microchip USA

USA . 3,035 parts In-Stock

1+ parts

$54.193

100+ parts

-

1k+ parts

-

10k+ parts

-

3,035

$54.193

-

-

-

IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$71.908

100+ parts

-

1k+ parts

$64.717

10k+ parts

-

1,888

$71.908

-

$64.717

-

MKK Technologies

India . 1,617 parts In-Stock

1+ parts

$135.219

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

$135.219

-

-

-

DigiPath Technology Company

USA . 1,617 parts In-Stock

1+ parts

$135.219

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

$135.219

-

-

-

Parana Technologies

USA . 1,328 parts In-Stock

1+ parts

-

100+ parts

$85.977

1k+ parts

-

10k+ parts

-

1,328

-

$85.977

-

-

Overview

Elevate your designs with the SPC58EC80E1Q0C1X microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile powerhouse is engineered for automotive applications, offering exceptional reliability under demanding conditions. With low power consumption and robust features like integrated cache and multiple connectivity options, it empowers you to create cutting-edge solutions that enhance performance and efficiency, ensuring your projects stand out in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures longevity and reliability in various environmental conditions.

Integrated Cache: YES

The presence of an integrated cache enhances processing speed and efficiency during execution of tasks.

Surface Mount: YES

Surface mount technology enables compact design and easier integration into modern electronic systems.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage allows for energy-efficient operation, making it suitable for battery-powered devices.

On Chip Data RAM Width: 8

8-bit data RAM width allows for optimized data processing while maintaining a balance between performance and cost.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards indicates suitability for automotive applications, ensuring high reliability.

Package Shape: SQUARE

A square package shape enhances the stability and performance of the circuitry on the PCB.

Bit Size: 32

A 32-bit architecture provides greater computational capability and memory addressing for complex applications.

No. of Terminals: 64

64 terminals facilitate extensive connectivity options, making it versatile for various sensor and actuator applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Flatpack and thin profile design support low-profile applications while aiding heat dissipation.

Minimum Supply Voltage: 1.14 V

Allows for robust performance even under lower power supply conditions, enhancing device longevity.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in extreme environments.

CPU Family: E200Z4

Part of the E200Z4 family, ensuring compatibility with various development tools and robust computing capabilities.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for reliable performance in harsh conditions.

ADC Channels: YES

Integrated ADC channels facilitate analog signal processing, essential for modern sensing applications.

DMA Channels: YES

DMA support enhances data transfer efficiency, optimizing CPU usage for other critical tasks.

Terminal Position: QUAD

Quad terminal position improves connection stability and layout flexibility on the PCB.

ROM Words: 4194304

Substantial ROM storage allows for complex applications and firmware to be stored on-chip.

Maximum Seated Height: 1.2 mm

Low seated height contributes to thin designs, making it ideal for space-constrained applications.

Width: 10 mm

Compact width makes it easy to integrate into small circuit designs without sacrificing functionality.

Data EEPROM Size: 128K

Decent EEPROM size allows for storage of configuration data, ensuring persistent settings across power cycles.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of complex circuit designs.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich variety of peripherals enhance functionality, providing a comprehensive solution for embedded applications.

Maximum Clock Frequency: 40 MHz

40 MHz clock frequency provides a good balance of speed and power consumption for responsive applications.

Length: 10 mm

Compact length contributes to an overall space-efficient solution for board design.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing efficiency, ideal for performance-critical applications.

No. of Timers: 12

Multiple timers allow for complex timing operations, enabling robust control functionalities.

RAM Bytes: 393216

Ample RAM supports memory-intensive applications and multitasking capabilities.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and reliable connections in surface mounted applications.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs cater to precise measurements in applications requiring accuracy.

Maximum Supply Current: 50 mA

Low supply current enhances energy efficiency, particularly in battery-operated devices.

Nominal Supply Voltage: 1.2 V

Optimal nominal supply voltage for low-power applications to ensure extended battery life.

No. of DMA Channels: 64

64 DMA channels significantly improve data handling capabilities, reducing CPU load during data transfers.

No. of Serial I/Os: 26

A versatile number of serial I/Os allows for diverse connectivity options with other devices.

PWM Channels: YES

Support for PWM channels enables efficient control of motors and other devices requiring precise output.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Supports multiple communication protocols, making it adaptable for various networking needs.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density designs, ideal for compact electronic circuits.

Format: FLOATING POINT

Floating point format enhances mathematical computation capabilities, ideal for complex processing tasks.

Speed: 180 rpm

The operational speed is suitable for applications requiring moderate performance like motor control.

Low Power Mode: YES

Low power mode extends battery life in portable applications, making it energy-efficient.

On Chip Program ROM Width: 8

8-bit program ROM width provides efficient storage and execution of instructions necessary for operation.

Technical Specifications

Microcontrollers SPC58EC80E1Q0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E1Q0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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