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SPC58EC80E1Q0C0Y

STMicroelectronics

SPC58EC80E1Q0C0Y by STMicroelectronics

SPC58EC80E1Q0C0Y microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40MHz clock speed. With integrated DMA channels and AEC-Q100 screening, it's ideal for automotive applications. Its compact design includes 64 terminals and low power modes for efficiency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,633 parts In-Stock

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7,633

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Digiode

USA . 2,060 parts In-Stock

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2,060

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Anansix

USA . 1,165 parts In-Stock

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1,165

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Distributors (Availability)

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AZTECH Wire

Italy . 139 parts In-Stock

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$12.630

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139

$12.630

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Vigor

Singapore . 1,647 parts In-Stock

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$24.420

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1,647

$24.420

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Microchip USA

USA . 384 parts In-Stock

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$24.744

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384

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

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$76.218

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$68.596

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1,918

$76.218

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$68.596

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Component Stockers USA

USA . 216 parts In-Stock

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$99.990

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216

$99.990

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MKK Technologies

India . 18 parts In-Stock

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$143.324

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18

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DigiPath Technology Company

USA . 18 parts In-Stock

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$143.324

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Corphita

USA . 1,287 parts In-Stock

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1,287

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Parana Technologies

USA . 320 parts In-Stock

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$91.131

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320

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$91.131

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Overview

Unlock the potential of your next project with the SPC58EC80E1Q0C0Y microcontroller from STMicroelectronics. Renowned for its cutting-edge quality and reliability, this versatile 32-bit device excels in automotive and industrial applications, delivering exceptional performance even in extreme conditions. With features like integrated cache and various connectivity options, it ensures efficient processing and seamless communication. Choose ST for unwavering support in innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy provides durability and reliability, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache improves processing speed and efficiency, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for smaller designs and easier assembly, ideal for compact applications.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage ensures minimal power consumption, contributing to energy efficiency.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data processing tailored to many embedded applications.

Screening Level: AEC-Q100

AEC-Q100 qualification indicates high reliability and suitability for automotive applications.

Package Shape: SQUARE

A square package shape facilitates uniform thermal distribution and easier mounting on PCBs.

Bit Size: 32

The 32-bit architecture allows for handling larger data types and improved processing capabilities.

No. of Terminals: 64

With 64 terminals, the microcontroller can support multiple I/O functions and peripherals efficiently.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This design aids in thermal management while maintaining a compact footprint for tight spaces.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage makes this microcontroller suitable for low-power applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in extreme environments.

CPU Family: E200Z4

The E200Z4 family is designed for high performance and efficiency in embedded systems.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures expands the range of applications in harsh conditions.

ADC Channels: YES

Integrated ADC channels facilitate easier sensor integration and signal processing.

DMA Channels: YES

DMA support allows efficient data transfer without CPU intervention, freeing up processing resources.

Terminal Position: QUAD

A quad terminal position enhances signal integrity and reduces interference, improving overall performance.

ROM Words: 4194304

A significant ROM capacity provides ample space for applications and firmware, supporting complex functionalities.

Maximum Seated Height: 1.2 mm

A low seated height allows for more compact designs in space-constrained applications.

Width: 10 mm

A width of 10 mm contributes to space efficiency in PCB layouts.

Data EEPROM Size: 128K

A sizeable EEPROM allows for data retention and storage of configuration settings, enhancing user flexibility.

Boundary Scan: YES

Boundary scan facilitates testing and debugging, reducing time-to-market for products.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals provides versatility for various application needs.

Maximum Clock Frequency: 40 MHz

A high clock frequency supports fast processing speeds, improving system responsiveness.

Length: 10 mm

A compact length makes it suitable for small embedded systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and efficiency for embedded processing tasks.

No. of Timers: 12

Multiple timers enhance the ability to handle time-sensitive applications effectively.

RAM Bytes: 393216

A generous RAM size allows for more complex computations and improved multitasking.

Technology: CMOS

CMOS technology ensures low power consumption and high integration, ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering quality and ease of handling.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution facilitate accurate data conversion from analog sensors.

Maximum Supply Current: 50 mA

A low supply current minimizes heat generation and boosts energy efficiency.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage aligns with modern low-power design strategies for efficiency.

No. of DMA Channels: 64

A high number of DMA channels allows simultaneous data transfers, improving overall system throughput.

No. of Serial I/Os: 26

Supports various serial communication protocols, enabling versatile connections to peripherals.

PWM Channels: YES

PWM channels are essential for motor control and signal modulation applications.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options enable integration with various devices, enhancing system flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware, saving time and effort.

Terminal Pitch: 0.5 mm

A fine terminal pitch is beneficial for high-density applications, allowing for more connections within a limited space.

Format: FLOATING POINT

Floating point format enhances mathematical operations, making it suitable for complex calculations.

Speed: 180 rpm

A speed rating of 180 rpm allows it to operate efficiently in motor applications.

Low Power Mode: YES

The availability of low power mode significantly extends battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit ROM width enables efficient data processing for more straightforward code execution.

Technical Specifications

Microcontrollers SPC58EC80E1Q0C0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E1Q0C0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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