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SPC58EC80E1Q0C0X

STMicroelectronics

SPC58EC80E1Q0C0X by STMicroelectronics

SPC58EC80E1Q0C0X by STMicroelectronics is a 32-bit microcontroller designed for automotive applications, featuring AEC-Q100 screening. It operates at 1.14-1.26V with a max temp of 125 °C, integrating 64 DMA channels and multiple connectivity options like CAN and UART. With its advanced cache and low power mode, it ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,536 parts In-Stock

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12,536

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Digiode

USA . 1,530 parts In-Stock

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1,530

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Anansix

USA . 238 parts In-Stock

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238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$14.220

100+ parts

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644

$14.220

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Vigor

Singapore . 2,083 parts In-Stock

1+ parts

$16.960

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2,083

$16.960

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Microchip USA

USA . 466 parts In-Stock

1+ parts

$27.743

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466

$27.743

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

1+ parts

$36.710

100+ parts

-

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$33.039

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1,541

$36.710

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$33.039

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MKK Technologies

India . 1,867 parts In-Stock

1+ parts

$69.030

100+ parts

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1,867

$69.030

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DigiPath Technology Company

USA . 1,867 parts In-Stock

1+ parts

$69.030

100+ parts

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1,867

$69.030

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Corphita

USA . 3,827 parts In-Stock

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3,827

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Parana Technologies

USA . 1,991 parts In-Stock

1+ parts

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$43.892

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1,991

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$43.892

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Overview

Unlock exceptional performance with the SPC58EC80E1Q0C0X microcontroller from STMicroelectronics, a leader in innovative technology. Engineered for automotive and industrial applications, this robust chip excels in demanding environments, offering unparalleled reliability and efficiency. With advanced features like integrated cache and multiple connectivity options, it empowers your designs while reducing power consumption—delivering unmatched value and peace of mind for engineers and developers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making this microcontroller reliable in various applications.

Integrated Cache: YES

An integrated cache enhances performance by speeding up data access and processing, leading to more efficient execution of tasks.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier integration into modern electronic devices.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage minimizes power consumption, making it suitable for battery-operated devices or energy-sensitive applications.

On Chip Data RAM Width: 8

An 8-bit RAM width provides enough flexibility for various data operations while maintaining a compact design.

Screening Level: AEC-Q100

AEC-Q100 certification indicates the microcontroller meets automotive standards, ensuring reliability in automotive applications.

Package Shape: SQUARE

A square package shape maximizes PCB space efficiency and allows for easier placement on circuit boards.

Bit Size: 32

A 32-bit architecture offers improved computing capabilities and supports a wider range of applications.

No. of Terminals: 64

64 terminals provide ample connectivity options for peripherals, making this microcontroller versatile for various projects.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style allows for efficient heat dissipation and a compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enhances energy efficiency and supports longer battery life.

Maximum Operating Temperature: 125 °C

High operating temperature resilience makes the microcontroller suitable for harsh environments.

CPU Family: E200Z4

The E200Z4 CPU family is optimized for low-power applications, enhancing energy efficiency without compromising performance.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable operation in extreme conditions, making it ideal for industrial and automotive use.

ADC Channels: YES

Integrated ADC channels allow for direct data processing from analog sensors, improving interfacing capabilities.

DMA Channels: YES

DMA support enables faster data transfer and improved throughput, reducing CPU load and increasing efficiency.

Terminal Position: QUAD

Quad terminal positions ensure robust connections and compatibility with various circuit designs.

ROM Words: 4194304

A large ROM size provides ample space for firmware and application code, enabling complex functionalities.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for compact devices where space is a premium.

Width: 10 mm

The compact width contributes to a smaller footprint on PCB, allowing for more compact product designs.

Data EEPROM Size: 128K

Sufficient EEPROM size allows for storing important configuration data and improves the versatility of the microcontroller.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging, enhancing the reliability of the final product.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Diverse peripherals enhance functionality and enable a wide range of applications, contributing to overall versatility.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for fast processing speeds, enabling efficient execution of tasks.

Length: 10 mm

The compact length supports design in space-efficient electronic projects.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes simple instruction sets, optimizing performance per watt, ideal for embedded systems.

No. of Timers: 12

Multiple timers allow for precise timing control in various applications, enhancing the functionality of the microcontroller.

RAM Bytes: 393216

Substantial RAM size supports complex calculations and reduces memory bottlenecks in applications.

Technology: CMOS

CMOS technology improves power efficiency and reduces heat generation, extending battery life.

Terminal Form: GULL WING

Gull-wing terminal form allows for easier soldering and reliable connections in PCB design.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution enable precise analog signal processing, making it ideal for sensor integration.

Maximum Supply Current: 50 mA

Low maximum supply current contributes to reduced power consumption and enhances efficiency in powered devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V promotes energy efficiency in low-power applications.

No. of DMA Channels: 64

A large number of DMA channels enhances data handling and reduces CPU workload, optimizing overall system performance.

No. of Serial I/Os: 26

Ample serial I/O connections support various communication protocols, increasing versatility in interfacing.

PWM Channels: YES

PWM capabilities enable effective motor control and signal modulation, expanding the application range.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Multiple connectivity options allow seamless integration with various devices and sensors, enhancing versatility.

ROM Programmability: FLASH

Flash memory allows for easy updates and reprogramming, facilitating maintenance and upgrades.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch promotes higher pin density, enabling more connections in compact layouts.

Format: FLOATING POINT

Support for floating-point calculations enhances numerical precision and expands the scope of potential applications.

Speed: 180 rpm

Competitive speed specifications ensure the microcontroller can handle dynamic applications with quick responses.

Low Power Mode: YES

Low power mode extends battery life and is particularly useful in energy-constrained applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width can effectively manage instruction sets while maintaining efficiency.

Technical Specifications

Microcontrollers SPC58EC80E1Q0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E1Q0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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