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SPC58EC80C3QMC0X

STMicroelectronics

SPC58EC80C3QMC0X by STMicroelectronics

SPC58EC80C3QMC0X from STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures (-40 °C to 125 °C). It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and FlexRay. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,029 parts In-Stock

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Digiode

USA . 3,105 parts In-Stock

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Anansix

USA . 771 parts In-Stock

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Cyclops Electronics Ltd

UK . 500 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 795 parts In-Stock

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$15.580

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795

$15.580

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Vigor

Singapore . 1,053 parts In-Stock

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$23.240

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Microchip USA

USA . 297 parts In-Stock

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$27.433

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IDEA Electronic Components Group

UK . 1,472 parts In-Stock

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$56.463

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$50.817

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$56.463

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Component Stockers USA

USA . 447 parts In-Stock

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$99.990

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MKK Technologies

India . 863 parts In-Stock

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$106.175

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DigiPath Technology Company

USA . 863 parts In-Stock

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$106.175

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Corphita

USA . 3,643 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 1,380 parts In-Stock

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$67.510

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$67.510

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Overview

Unlock the future of innovation with the SPC58EC80C3QMC0X from STMicroelectronics, a leading name in microcontroller technology. This powerhouse combines exceptional performance and energy efficiency, making it ideal for automotive and industrial applications where reliability matters most. Its robust design guarantees seamless integration, while advanced features enhance connectivity and processing capabilities. Elevate your projects with a solution that offers unmatched value and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent protection against environmental factors, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the microcontroller's performance by speeding up data access and execution.

Surface Mount: YES

Surface-mount technology allows for a smaller footprint, enabling dense circuit layouts and ease of automated assembly.

Maximum Supply Voltage: 1.26 V

Lower maximum supply voltage can result in reduced power consumption, making this microcontroller ideal for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width enables efficient data handling, essential for processing larger datasets in embedded applications.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability for automotive applications and critical systems.

Package Shape: SQUARE

The square shape facilitates easier integration onto PCBs and offers flexibility in layout design.

Bit Size: 32

A 32-bit architecture allows for more complex computations and handling of larger data types, improving overall performance.

No. of Terminals: 292

A higher number of terminals provides greater connectivity options for integration with various peripherals and sensors.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid arrays allow for greater pin density, enabling compact designs vital for modern applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures the microcontroller is suitable for low-power applications, extending battery life.

Maximum Operating Temperature: 125 °C

High operating temperature range enhances reliability in extreme environments, making it suitable for industrial applications.

CPU Family: E200Z4

Designed for efficiency, the E200Z4 family provides optimized performance for embedded systems.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperatures, suitable for harsh weather conditions in outdoor applications.

ADC Channels: YES

Integrated ADC channels improve the microcontroller's ability to interact with analog signals, making it versatile for various applications.

DMA Channels: YES

Direct Memory Access channels enhance data handling capabilities, allowing for efficient data transfer without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier soldering and improves thermal performance.

ROM Words: 4194304

The large ROM capacity allows for extensive program storage, accommodating complex applications.

Maximum Seated Height: 1.8 mm

A low maximum seated height is ideal for compact designs, enabling space-saving solutions in electronic devices.

Width: 17 mm

Compact width aids in space-efficient PCB designs, making it suitable for small-form-factor applications.

Data EEPROM Size: 128K

Ample EEPROM size is crucial for applications that require non-volatile storage of critical configuration data.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, making manufacturing and design verification more efficient.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances the microcontroller’s functionality, catering to diverse application needs.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for faster processing, improving the responsiveness and performance of applications.

Length: 17 mm

The compact length helps in designing smaller devices without compromising on performance.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction execution, optimizing performance per watt.

No. of Timers: 12

Multiple timers provide flexibility for time-sensitive tasks, essential in real-time applications.

RAM Bytes: 393216

Sufficient RAM size enables effective handling of larger applications, supporting complex algorithms and processes.

Technology: CMOS

CMOS technology ensures low voltage operation and minimal power consumption, enhancing battery life.

Terminal Form: BALL

Ball terminal form allows for greater thermal dissipation and ensures reliable electrical connections.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

The availability of multiple ADC channels enhances versatility, allowing for simultaneous monitoring of various sensors.

Maximum Supply Current: 50 mA

limits peak current draw, which is crucial for low-power designs in portable applications.

Nominal Supply Voltage: 1.2 V

The nominal voltage is optimal for low-power applications, supporting energy-efficient designs.

No. of DMA Channels: 64

A high number of DMA channels streamlines data handling, improving overall system efficiency.

No. of Serial I/Os: 18

With 18 serial I/O options, this microcontroller can easily interface with various devices, enhancing connectivity.

PWM Channels: YES

Pulse-width modulation capability enables efficient control of motors and lights, making it ideal for automation tasks.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Versatile connectivity options support a wide range of communication protocols, ensuring compatibility with diverse systems.

ROM Programmability: FLASH

Flash programmability allows for easy software updates and modifications, increasing the device’s lifespan and flexibility.

Terminal Pitch: 0.8 mm

0.8 mm terminal pitch allows for dense layouts, crucial for advanced electronic designs.

Format: FLOATING POINT

Supports floating-point operations, which are essential for many complex mathematical and control applications.

Speed: 180 rpm

While speed might be less critical in microcontrollers, this ensures responsiveness in control applications.

Low Power Mode: YES

Low power mode extends battery life, making this microcontroller suitable for energy-conscious designs.

On Chip Program ROM Width: 8

An 8-bit ROM width is efficient for many embedded applications, balancing speed and data handling capabilities.

Technical Specifications

Microcontrollers SPC58EC80C3QMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

292

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.8 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80C3QMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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