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SPC58EC74E7E0C0X

STMicroelectronics

SPC58EC74E7E0C0X by STMicroelectronics

SPC58EC74E7E0C0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and an operating temp range of -40 °C to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like CAN and UART. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,632 parts In-Stock

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5,632

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Digiode

USA . 3,055 parts In-Stock

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3,055

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Anansix

USA . 1,991 parts In-Stock

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1,991

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Distributors (Availability)

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AZTECH Wire

Italy . 497 parts In-Stock

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$11.930

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497

$11.930

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Microchip USA

USA . 323 parts In-Stock

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$56.973

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323

$56.973

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IDEA Electronic Components Group

UK . 1,250 parts In-Stock

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$69.431

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$62.488

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$69.431

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$62.488

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Component Stockers USA

USA . 355 parts In-Stock

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$99.990

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355

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MKK Technologies

India . 1,618 parts In-Stock

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$130.560

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$130.560

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DigiPath Technology Company

USA . 1,618 parts In-Stock

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$130.560

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Corphita

USA . 494 parts In-Stock

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Parana Technologies

USA . 195 parts In-Stock

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$83.015

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$83.015

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Overview

Unlock the potential of your innovations with the SPC58EC74E7E0C0X microcontroller from STMicroelectronics. Renowned for their commitment to quality and cutting-edge technology, STMicroelectronics delivers unparalleled performance in a compact design. This versatile microcontroller excels in automotive and industrial applications, providing robust connectivity options and efficient power management. Experience exceptional reliability, enhanced functionality, and seamless integration that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for various applications.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency, resulting in better overall performance.

Surface Mount: YES

Surface mount technology allows for compact designs and enables automated assembly, reducing manufacturing costs.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage ensures compatibility with various low-voltage applications, contributing to energy efficiency.

On Chip Data RAM Width: 8

The 8-bit data RAM width supports efficient data handling and processing in suitable applications.

Screening Level: AEC-Q100

AEC-Q100 certification provides assurance of reliability and quality, making it ideal for automotive applications.

Package Shape: SQUARE

A square package shape offers efficient area utilization on PCBs, beneficial for compact designs.

Bit Size: 32

The 32-bit architecture enables complex calculations and efficient processing for high-performance applications.

No. of Terminals: 176

With 176 terminals, this microcontroller allows for extensive connectivity options, accommodating diverse peripheral connections.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This package style optimizes heat dissipation and facilitates integration into low-profile applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enhances compatibility with battery-operated devices, contributing to longer operational life.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures makes this microcontroller suitable for harsh environments.

CPU Family: E200Z4

The E200Z4 CPU family offers efficient processing capabilities tailored for embedded applications.

Minimum Operating Temperature: -40 °C

The operating temperature range allows for use in extreme weather conditions, enhancing its versatility.

ADC Channels: YES

Presence of ADC channels indicates capability for analog signal processing, integral for many sensor applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, reducing CPU load and improving performance.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and reduces board space requirements.

ROM Words: 3,145,728

A large ROM capacity allows for extensive program storage, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height allows for compact designs, accommodating space-constrained applications.

Width: 24 mm

A uniform width offers compatibility with standard PCB designs, simplifying integration.

Data EEPROM Size: 128K

Generous EEPROM size allows for storage of critical configuration settings, enhancing system reliability.

Boundary Scan: YES

Boundary scan support enables easier testing and debugging of the PCB, improving development efficiency.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals provides flexibility and functionality for a wide array of applications.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for rapid data processing, enhancing overall system efficiency.

Length: 24 mm

Standard length ensures compatibility with various mounting configurations, simplifying design efforts.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture leads to lower power consumption and faster execution times in microcontroller applications.

No. of Timers: 12

A high number of timers allows for precise timing operations, which is crucial in real-time applications.

RAM Bytes: 393216

Large RAM capacity supports complex applications that require substantial data processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing performance.

Terminal Form: GULL WING

Gull wing terminal form factor ensures easy mounting and soldering to PCBs.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

The presence of multiple ADC channels allows for robust analog signal conversion, beneficial in sensor-based applications.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA ensures efficient operation in low-power applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage further supports energy-efficient designs, ideal for battery-powered devices.

No. of DMA Channels: 64

Having 64 DMA channels enhances the data transfer capabilities, leading to improved system throughput.

No. of Serial I/Os: 26

A considerable number of serial I/Os allows for multiple connections to peripherals, increasing system versatility.

PWM Channels: YES

PWM support enables precise control of motors and other devices, improving operational functionality.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Extensive connectivity options allow for diverse communication protocols, making it adaptable in various projects.

ROM Programmability: FLASH

Flash memory programmability allows for easy updates and reprogramming, enhancing product lifecycle.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables denser designs, making it effective for space-limited applications.

Format: FLOATING POINT

Floating point capability supports sophisticated mathematical operations, beneficial for complex algorithm implementations.

Speed: 120 rpm

The ability to achieve up to 120 RPM indicates potential for varying control applications, enhancing performance.

Low Power Mode: YES

Low power modes significantly reduce power consumption during idle times, prolonging battery life for portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports effective programming for various applications, contributing to flexibility in design.

Technical Specifications

Microcontrollers SPC58EC74E7E0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC74E7E0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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