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SPC58EC74E3E0C0X

STMicroelectronics

SPC58EC74E3E0C0X by STMicroelectronics

SPC58EC74E3E0C0X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU, operates at a max voltage of 1.26V, and includes integrated cache. With AEC-Q100 screening, it's ideal for automotive applications requiring reliability. It supports multiple connectivity options like CAN and UART.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,609 parts In-Stock

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Digiode

USA . 2,421 parts In-Stock

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Anansix

USA . 1,385 parts In-Stock

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1,385

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Distributors (Availability)

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AZTECH Wire

Italy . 167 parts In-Stock

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$10.730

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167

$10.730

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Vigor

Singapore . 7,457 parts In-Stock

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$14.790

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7,457

$14.790

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Microchip USA

USA . 481 parts In-Stock

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$18.068

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481

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IDEA Electronic Components Group

UK . 752 parts In-Stock

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$75.905

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$68.314

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752

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Component Stockers USA

USA . 623 parts In-Stock

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$99.990

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623

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MKK Technologies

India . 1,429 parts In-Stock

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$142.734

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DigiPath Technology Company

USA . 1,429 parts In-Stock

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$142.734

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Parana Technologies

USA . 1,409 parts In-Stock

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$90.756

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Corphita

USA . 1,145 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Overview

Unlock unparalleled performance with the SPC58EC74E3E0C0X microcontroller from STMicroelectronics, a leader in innovative technology. Designed for excellence, this compact powerhouse offers exceptional energy efficiency and versatility, making it ideal for automotive, industrial, and IoT applications. With robust features and AEC-Q100 certification, it ensures reliability under demanding conditions, delivering unmatched quality and value for your next project. Discover the benefits of advanced connectivity and superior processing power today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances reliability and thermal performance, making it suitable for various applications.

Integrated Cache: YES

An integrated cache helps in faster data retrieval, improving overall processing efficiency.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and is ideal for high-density applications.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage means lower power consumption, which is crucial for battery-operated devices.

On Chip Data RAM Width: 8

The 8-bit data RAM width facilitates efficient data handling within various digital applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and suitability for automotive applications.

Package Shape: SQUARE

The square package shape provides an optimal layout for PCB assembly and design flexibility.

Bit Size: 32

A 32-bit architecture allows for more robust computing power, handling complex algorithms with ease.

No. of Terminals: 100

A 100-terminal configuration supports diverse peripheral connectivity options for various applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style supports efficient heat dissipation and is suited for space-constrained designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage contributes to lower overall power consumption and extends battery life.

Maximum Operating Temperature: 105 °C

Operating up to 105 °C ensures reliability in demanding environments such as automotive and industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family indicates advanced processing capabilities for embedded applications.

Minimum Operating Temperature: -40 °C

A wide temperature range from -40 °C makes it suitable for harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels enable efficient analog signal processing directly on the microcontroller.

DMA Channels: YES

DMA channels facilitate high-speed data transfer without CPU intervention, enhancing processing efficiency.

Terminal Position: QUAD

Quad terminal positions reduce the footprint on PCB, making it easier to incorporate into compact designs.

ROM Words: 3145728

A substantial ROM capacity allows for extensive program storage, supporting complex applications.

Maximum Seated Height: 1.2 mm

A low seated height is ideal for applications where space is a premium, allowing for compact designs.

Width: 14 mm

The slim width supports compact layouts, making it suitable for portable devices.

Data EEPROM Size: 128K

The 128K EEPROM size enables storage of configuration settings, enhancing device functionality.

Boundary Scan: YES

Boundary scan capabilities allow for easy testing and debugging of PCBs, enhancing reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

The comprehensive set of peripherals provides extensive functionality, reducing external component needs.

Maximum Clock Frequency: 40 MHz

A 40 MHz clock frequency supports fast processing and responsiveness for time-sensitive applications.

Length: 14 mm

The compact length is well-suited for space-constrained applications, maintaining design efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture ensures efficient instruction execution, enhancing performance for control tasks.

No. of Timers: 12

Multiple timers provide flexibility for creating precise timing applications and scheduling tasks.

RAM Bytes: 393216

A substantial RAM capacity allows for the execution of complex programs and real-time data processing.

Technology: CMOS

CMOS technology offers lower power consumption while maintaining high speed, making it ideal for portable devices.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and is standard for surface-mount applications.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

The presence of multiple ADC channels with varying resolution supports diverse signal acquisition needs.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA implies that it can operate with moderate power supplies, conserving energy.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V indicates low operational power requirements, suitable for energy-efficient designs.

No. of DMA Channels: 64

Having 64 DMA channels enhances concurrent data processing, improving system performance.

No. of Serial I/Os: 26

A large number of serial I/Os supports numerous communication options for different peripherals.

PWM Channels: YES

PWM channels enable efficient control of motors and power delivery, ideal for automation applications.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Wide connectivity options allow for seamless integration into various networks and protocols.

ROM Programmability: FLASH

Flash programmability promotes flexibility, allowing for easy updates and reconfiguration of the firmware.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is standard for modern components, facilitating integration on high-density PCBs.

Format: FLOATING POINT

Support for floating-point formatting enables processing of complex mathematical operations efficiently.

Speed: 120 rpm

At 120 rpm, the device ensures proper performance for applications requiring controlled rotational speeds.

Low Power Mode: YES

The low power mode feature is ideal for battery-saving applications, prolonging device operation between charges.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient code execution in embedded systems.

Technical Specifications

Microcontrollers SPC58EC74E3E0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC74E3E0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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