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SPC58EC70E3F000X

STMicroelectronics

SPC58EC70E3F000X by STMicroelectronics

SPC58EC70E3F000X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU, operates at a max voltage of 1.26V, and includes integrated cache for enhanced performance. With AEC-Q100 screening, it's ideal for automotive applications. It supports multiple connectivity options like CAN and UART, making it versatile for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,361 parts In-Stock

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13,361

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Digiode

USA . 3,585 parts In-Stock

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3,585

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Anansix

USA . 2,141 parts In-Stock

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2,141

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Formix International

India . 2,000 parts In-Stock

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2,000

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Chip Stock

USA . 458 parts In-Stock

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458

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Distributors (Availability)

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AZTECH Wire

Italy . 106 parts In-Stock

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$9.330

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-

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106

$9.330

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Vigor

Singapore . 1,089 parts In-Stock

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$10.550

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1,089

$10.550

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Microchip USA

USA . 418 parts In-Stock

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$15.000

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418

$15.000

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

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$29.561

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$26.605

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$29.561

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$26.605

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MKK Technologies

India . 1,235 parts In-Stock

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$55.588

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$55.588

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DigiPath Technology Company

USA . 1,235 parts In-Stock

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$55.588

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$55.588

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Component Stockers USA

USA . 277 parts In-Stock

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$99.990

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277

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Futuretech Components

Singapore . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Parana Technologies

USA . 1,533 parts In-Stock

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$35.345

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Authorized Procurement Solutions

USA . 1,400 parts In-Stock

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Corphita

USA . 428 parts In-Stock

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428

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Infinite Electronics LLP (Excess)

. 6 parts In-Stock

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Overview

Elevate your projects with the SPC58EC70E3F000X microcontroller from STMicroelectronics—where innovation meets reliability. Built to thrive in demanding environments with AEC-Q100 certification, this powerful 32-bit controller enhances efficiency across automotive and industrial applications. Experience superior performance, low power consumption, and versatile connectivity options that simplify design and deliver unmatched value. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures high reliability in various applications.

Integrated Cache: YES

Increases processing speed and improves performance efficiency in data handling.

Surface Mount: YES

Allows for compact designs and more efficient use of PCB space.

Maximum Supply Voltage: 1.26 V

Low voltage operation helps in reducing power consumption, suitable for battery-powered devices.

On Chip Data RAM Width: 8

Facilitates efficient data manipulation and usage within the microcontroller.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and robustness in harsh environments.

Package Shape: SQUARE

Standardized form factor allows for easy integration into existing designs.

Bit Size: 32

Offers a wide range of data processing capabilities, supporting complex computational tasks.

No. of Terminals: 100

Provides ample connectivity options for various peripherals and interfaces.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Versatile packaging styles for improved thermal management and space handling.

Minimum Supply Voltage: 1.14 V

Lower power requirements enhance efficiency, particularly in portable applications.

Maximum Operating Temperature: 105 °C

Suitable for operation in high-temperature environments, improving reliability in challenging conditions.

CPU Family: E200Z4

Optimized for embedded applications with efficient compute resources.

Minimum Operating Temperature: -40 °C

Ensures functionality in extremely cold conditions, ideal for outdoor and industrial applications.

ADC Channels: YES

Integrated Analog-to-Digital converters enhance versatility for sensor applications.

DMA Channels: YES

Direct Memory Access allows for faster data transfers and efficient multitasking within the system.

Terminal Position: QUAD

Facilitates easier PCB layout and design while enhancing connectivity.

ROM Words: 2097152

Large program memory capacity supports complex applications and advanced functionality.

Maximum Seated Height: 1.2 mm

Keeps form factor low, suitable for compact devices and embedded systems.

Width: 14 mm

Compact design makes it suitable for space-constrained applications.

Data EEPROM Size: 128K

Generous non-volatile memory capacity for storing crucial parameters and settings.

Boundary Scan: YES

Facilitates testing and debugging, increasing development efficiency.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich set of peripherals enhances functionality and allows for diverse applications.

Maximum Clock Frequency: 40 MHz

High clock speed allows for fast processing, suitable for real-time applications.

Length: 14 mm

Compact size is perfect for integration into smaller devices without compromising performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution and low power consumption.

No. of Timers: 12

Provides flexible timing solutions for various tasks and applications.

RAM Bytes: 393216

Sufficient RAM for handling complex data structures and multitasking.

Technology: CMOS

Low power consumption and high-speed operations make it ideal for modern applications.

Terminal Form: GULL WING

Facilitates easy soldering and reliability in surface mount technology.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs enable precise measurements and data acquisition in various applications.

Maximum Supply Current: 50 mA

Low current draw is beneficial for power-sensitive applications, prolonging battery life.

Nominal Supply Voltage: 1.2 V

Optimized for low-power applications, balancing performance and energy consumption.

No. of DMA Channels: 64

Extensive DMA channels improve data handling and system performance.

No. of Serial I/Os: 26

A wide range of serial interfaces makes it adaptable for numerous communication protocols.

PWM Channels: YES

Pulse Width Modulation capabilities are essential for motor control and signal generation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Multiple communication protocols supported for flexible interfacing and networking capabilities.

ROM Programmability: FLASH

In-system programmability allows for easy updates and flexibility in software development.

Terminal Pitch: 0.5 mm

Fine pitch terminals are advantageous for high-density PCB designs.

Format: FLOATING POINT

Support for floating point operations enhances computational precision and versatility.

Speed: 160 rpm

Ability to handle speed applications efficiently, ideal for motor and actuator control.

Low Power Mode: YES

Increases battery life and reduces heat generation in power-sensitive applications.

On Chip Program ROM Width: 8

Allows for efficient program storage and execution, optimizing memory usage.

Technical Specifications

Microcontrollers SPC58EC70E3F000X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC70E3F000X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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