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SPC58EC70E1F0C1X

STMicroelectronics

SPC58EC70E1F0C1X by STMicroelectronics

SPC58EC70E1F0C1X by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 40 MHz, integrated cache, and AEC-Q100 screening. It operates b/w -40 °C to 105 °C, making it ideal for automotive applications. With features like DMA channels and ADCs, it ensures efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,072 parts In-Stock

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6,072

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Digiode

USA . 2,308 parts In-Stock

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Anansix

USA . 1,294 parts In-Stock

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1,294

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Distributors (Availability)

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AZTECH Wire

Italy . 874 parts In-Stock

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$8.570

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874

$8.570

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IDEA Electronic Components Group

UK . 168 parts In-Stock

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$40.340

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$36.306

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168

$40.340

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$36.306

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MKK Technologies

India . 939 parts In-Stock

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$75.857

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939

$75.857

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DigiPath Technology Company

USA . 939 parts In-Stock

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$75.857

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939

$75.857

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Corphita

USA . 1,170 parts In-Stock

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1,170

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Parana Technologies

USA . 634 parts In-Stock

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$48.233

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634

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$48.233

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Overview

Unlock the future of innovation with the SPC58EC70E1F0C1X microcontroller from STMicroelectronics. Renowned for their commitment to quality and reliability, STMicroelectronics delivers exceptional performance across diverse applications, from automotive systems to industrial automation. This versatile microcontroller enhances efficiency with its low-power operation and advanced features, ensuring your designs are not only powerful but also sustainable. Experience unparalleled benefits and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Integrated Cache: YES

Integrated cache improves processing efficiency by speeding up data access, enhancing the overall performance of the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, saving PCB space and facilitating easier assembly.

Maximum Supply Voltage: 1.26 V

With a low maximum supply voltage, the product is energy-efficient, suitable for battery-powered devices.

On Chip Data RAM Width: 8

The 8-bit data RAM width optimizes the processing of data, making it better suited for certain applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 screening implies high reliability for automotive applications, ensuring it meets stringent automotive industry standards.

Package Shape: SQUARE

The square package shape improves PCB layout options and simplifies integration into various designs.

Bit Size: 32

A 32-bit architecture allows for more complex processing and higher performance, supporting advanced applications.

No. of Terminals: 64

With 64 terminals, this microcontroller offers extensive connectivity options, allowing for a wide range of peripheral integrations.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The flatpack style, complemented by a thin profile, is ideal for compact designs while the heat sink enhances thermal management.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures functionality in low-power applications, extending battery life.

Maximum Operating Temperature: 105 °C

High temperature tolerance makes this microcontroller suitable for harsh environment applications, ensuring reliability.

CPU Family: E200Z4

The E200Z4 CPU family ensures advanced performance and supports a wide range of applications with its modern architecture.

Minimum Operating Temperature: -40 °C

Operating at extremely low temperatures allows for deployment in cryogenic and outdoor environments.

ADC Channels: YES

Presence of ADC channels enables analog signal processing, making it suitable for sensor-based applications.

DMA Channels: YES

DMA support allows for efficient data transfer with minimal CPU intervention, improving performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal position provides flexibility in PCB design and allows for efficient routing.

ROM Words: 2097152

A large ROM capacity allows for extensive programmability and storage of application code.

Maximum Seated Height: 1.2 mm

The low seated height contributes to compact designs, catering to space-constrained applications.

Width: 10 mm

A width of 10 mm strikes a balance between size and surface area for effective thermal dissipation.

Data EEPROM Size: 128K

A sizable EEPROM enables non-volatile data storage, critical for applications that require data retention even without power.

Boundary Scan: YES

Supports boundary scan testing which simplifies debugging and improves manufacturing yield.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral set offers flexibility in functionality and control, enhancing the microcontroller's versatility.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster processing and efficient handling of complex tasks.

Length: 10 mm

The 10 mm length supports a compact form factor for space-critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance with minimal power consumption, ideal for various embedded applications.

No. of Timers: 12

The presence of 12 timers offers precise timing control for a variety of applications, including scheduling and event counting.

RAM Bytes: 393216

Ample RAM allows for efficient temporary data storage, enhancing performance in complex applications.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high performance, crucial for embedded devices.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering and reliability in PCB assembly.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution enable accurate and versatile signal sampling, essential for sensor integration.

Maximum Supply Current: 50 mA

Low maximum supply current supports energy-efficient designs, crucial for battery-operated devices.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V facilitates the design of low-power and energy-efficient applications.

No. of DMA Channels: 64

A high number of DMA channels allows for efficient data management in multi-functional applications.

No. of Serial I/Os: 26

With 26 serial I/O ports, the microcontroller can interface with various peripherals, offering flexibility in connectivity.

PWM Channels: YES

Support for PWM channels enables precise control of analog devices, essential for motor control and actuation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options make it easy to integrate the microcontroller into extensive system architectures.

ROM Programmability: FLASH

Flash programmability enables easy updates of firmware, enhancing lifecycle management.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for compact designs, optimizing PCB layout and component density.

Format: FLOATING POINT

Floating-point support enhances computational capabilities for complex mathematical tasks, broadening application scope.

Speed: 160 rpm

Operational speed of 160 RPM is suitable for various low-speed applications, ensuring efficiency in controlled environments.

Low Power Mode: YES

Low power mode extends battery life and is ideal for power-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient program storage, catering to specific usage scenarios.

Technical Specifications

Microcontrollers SPC58EC70E1F0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC70E1F0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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