Loading...

SPC58EC70E1F0C0X

STMicroelectronics

SPC58EC70E1F0C0X by STMicroelectronics

SPC58EC70E1F0C0X by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 40 MHz, integrated cache, and AEC-Q100 screening. It operates b/w -40 °C to 105 °C, making it ideal for automotive applications. With features like DMA channels and multiple connectivity options, it ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,252

-

-

-

-

Anansix

USA . 1,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,221

-

-

-

-

Digiode

USA . 579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

579

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,595 parts In-Stock

1+ parts

$13.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,595

$13.150

-

-

-

Microchip USA

USA . 417 parts In-Stock

1+ parts

$16.074

100+ parts

-

1k+ parts

-

10k+ parts

-

417

$16.074

-

-

-

AZTECH Wire

Italy . 70 parts In-Stock

1+ parts

$20.190

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$20.190

-

-

-

IDEA Electronic Components Group

UK . 485 parts In-Stock

1+ parts

$31.661

100+ parts

-

1k+ parts

$28.495

10k+ parts

-

485

$31.661

-

$28.495

-

MKK Technologies

India . 1,848 parts In-Stock

1+ parts

$59.536

100+ parts

-

1k+ parts

-

10k+ parts

-

1,848

$59.536

-

-

-

DigiPath Technology Company

USA . 1,848 parts In-Stock

1+ parts

$59.536

100+ parts

-

1k+ parts

-

10k+ parts

-

1,848

$59.536

-

-

-

Corphita

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960

-

-

-

-

Parana Technologies

USA . 596 parts In-Stock

1+ parts

-

100+ parts

$37.855

1k+ parts

-

10k+ parts

-

596

-

$37.855

-

-

Overview

Unlock unparalleled performance with the SPC58EC70E1F0C0X microcontroller from STMicroelectronics, a leader in innovative tech solutions. Designed for automotive and industrial applications, this robust device features exceptional low power consumption, versatility, and reliability, making it ideal for demanding environments. Elevate your projects with advanced integrated features that ensure efficiency and longevity, while benefiting from ST's commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making this microcontroller ideal for performance-critical applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automation in manufacturing, promoting design flexibility.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage allows for energy-efficient designs, extending battery life in portable devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width provides compatibility with simpler data processing tasks while maintaining efficiency in memory use.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and robustness, making this microcontroller suitable for automotive applications.

Package Shape: SQUARE

Square package shape optimizes space on printed circuit boards, allowing for efficient component arrangement.

Bit Size: 32

The 32-bit architecture supports advanced processing capabilities and enables the execution of complex algorithms.

No. of Terminals: 64

A higher number of terminals allows for increased connectivity options and interfacing with multiple peripheral devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This versatile package style enhances thermal performance and allows for compact designs in various electronic applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage further enhances the energy efficiency of the device, making it ideal for battery-powered applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures reliability in harsh environments, suitable for industrial and automotive applications.

CPU Family: E200Z4

The E200Z4 CPU family offers optimized performance for embedded applications, ideal for high-performance tasks.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the microcontroller suitable for use in extreme environments, ensuring reliable performance.

ADC Channels: YES

Inclusion of ADC channels enhances analog signal processing capabilities, making it versatile for various sensing applications.

DMA Channels: YES

DMA channels allow for efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning facilitates improved thermal performance and simpler routing on PCBs.

ROM Words: 2097152

A large ROM capacity provides plenty of memory for program storage, enabling complex software applications.

Maximum Seated Height: 1.2 mm

A low seated height allows for compact device designs, making it suitable for modern, space-constrained applications.

Width: 10 mm

A compact width aids in space-efficient PCB layouts, allowing for integration into smaller devices.

Data EEPROM Size: 128K

Sufficient EEPROM size allows for the storage of critical data, enhancing device functionality in applications requiring data retention.

Boundary Scan: YES

Boundary scan capability facilitates easier testing and debugging processes, improving reliability and maintenance.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances the microcontroller's capabilities, providing extensive functionality for diverse applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster processing speeds, making it suitable for high-performance applications.

Length: 10 mm

A small length complements its compact design, assisting in space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture optimizes instruction execution efficiency, enhancing overall performance.

No. of Timers: 12

Having 12 timers allows for precise timing operations, which is beneficial for various timing-dependent applications.

RAM Bytes: 393216

A substantial RAM size facilitates handling larger data sets, allowing for more complex operations and multitasking.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, making it suitable for low-power applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and ensure good physical connection on printed circuit boards.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

These ADC specifications support high-precision and versatile analog signal conversion, making it suitable for various applications.

Maximum Supply Current: 50 mA

A low maximum supply current aids in energy-efficient operation, prolonging battery life in portable devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V enhances energy efficiency, suitable for battery and low-power applications.

No. of DMA Channels: 64

Many DMA channels facilitate simultaneous data transfers, boosting overall system performance and efficiency.

No. of Serial I/Os: 26

A high count of serial I/Os allows for extensive sensor connections and communications, increasing versatility.

PWM Channels: YES

Support for PWM channels allows for precise control of motors and other peripherals, making it suitable for automation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options ensure easy interfacing with different devices and networks, enhancing integration capability.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the firmware, enhancing flexibility and adaptability.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for densely packed designs, increasing the functionality within limited spaces.

Format: FLOATING POINT

Floating point format support enables sophisticated mathematical computations, making it ideal for advanced applications.

Speed: 160 rpm

The capability to operate at 160 rpm makes it suitable for applications requiring precise speed control.

Low Power Mode: YES

Low power mode capabilities significantly enhance energy efficiency, vital for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with simpler coding tasks while maintaining efficient memory utilization.

Technical Specifications

Microcontrollers SPC58EC70E1F0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC70E1F0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 21