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SPC584C80E5F0C0X

STMicroelectronics

SPC584C80E5F0C0X by STMicroelectronics

SPC584C80E5F0C0X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40 MHz clock speed. It includes integrated cache, DMA channels, and multiple connectivity options like CAN and UART. Ideal for automotive applications due to its AEC-Q100 screening level and robust performance in extreme temperatures (-40 °C to 105 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,715 parts In-Stock

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9,715

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Anansix

USA . 2,229 parts In-Stock

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2,229

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Digiode

USA . 2,014 parts In-Stock

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2,014

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Distributors (Availability)

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AZTECH Wire

Italy . 77 parts In-Stock

1+ parts

$11.430

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-

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77

$11.430

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Microchip USA

USA . 2,247 parts In-Stock

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$54.422

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2,247

$54.422

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IDEA Electronic Components Group

UK . 427 parts In-Stock

1+ parts

$71.146

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$64.032

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427

$71.146

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$64.032

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MKK Technologies

India . 1,092 parts In-Stock

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$133.786

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1,092

$133.786

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DigiPath Technology Company

USA . 1,092 parts In-Stock

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$133.786

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1,092

$133.786

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Component Stockers USA

USA . 97 parts In-Stock

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$307.800

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97

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Corphita

USA . 4,609 parts In-Stock

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4,609

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Parana Technologies

USA . 2,165 parts In-Stock

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$85.066

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2,165

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$85.066

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Overview

Unlock the power of innovation with the SPC584C80E5F0C0X microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for reliability and efficiency, this 32-bit marvel excels in automotive and industrial applications, ensuring optimal performance even in extreme conditions. With integrated peripherals and low power consumption, it empowers your designs while reducing costs. Experience unrivaled quality and support, making STMicroelectronics your trusted partner in success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances durability and thermal stability, making this microcontroller suitable for various demanding applications.

Integrated Cache: YES

Having integrated cache improves processing speed and efficiency, helping to enhance overall system performance.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern PCB layouts.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage helps in minimizing power consumption, making it ideal for battery-powered applications.

On Chip Data RAM Width: 8

An 8-bit RAM width supports efficient data handling and manipulation, suitable for various applications requiring moderate data throughput.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates suitability for automotive applications, ensuring reliability under extreme conditions.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and design, optimizing space on the circuit board.

Bit Size: 32

A 32-bit architecture supports complex computations and larger address spaces, making it apt for advanced applications requiring significant processing power.

No. of Terminals: 144

Having 144 terminals allows for numerous I/O connections, providing flexibility in interfacing with various peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This packaging style promotes efficient thermal management and a compact footprint, ideal for space-constrained applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enables operation in energy-sensitive applications and extends battery life.

Maximum Operating Temperature: 105 °C

Capability to operate at elevated temperatures expands application possibilities in harsh environments.

CPU Family: E200Z4

The E200Z4 family provides high efficiency and performance, optimized for embedded applications.

Minimum Operating Temperature: -40 °C

Operates effectively in extreme cold, making it perfect for outdoor and industrial applications.

ADC Channels: YES

Integration of ADC channels allows for better data acquisition from sensors, enhancing the microcontroller's applicability in analog signal processing.

DMA Channels: YES

Direct Memory Access improves data transfer efficiency and reduces CPU load, allowing for faster and more efficient operations.

Terminal Position: QUAD

Quad terminal positioning enables better accessibility and connection options on the PCB.

ROM Words: 4194304

A large ROM space allows for the storage of complex programs and data-heavy applications.

Maximum Seated Height: 1.2 mm

A low profile minimizes space requirements on PCBs, enabling the design of thinner and more compact devices.

Width: 20 mm

Standard width facilitates easy integration into a variety of designs and applications.

Data EEPROM Size: 128K

Offering substantial EEPROM space allows for the storage of configuration data, enhancing operational flexibility.

Boundary Scan: YES

Boundary scan capability enables easier debugging and testing of complex PCBs, improving product reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances functionality, making it suitable for a wide variety of control applications.

Maximum Clock Frequency: 40 MHz

Higher clock frequencies provide better performance capabilities for more demanding processing tasks.

Length: 20 mm

Consistent length promotes compatibility with standard PCB designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides improved performance per watt, making it very efficient for embedded applications.

No. of Timers: 12

Multiple timers increase the versatility of the microcontroller for timing tasks in various applications.

RAM Bytes: 393216

A substantial amount of RAM allows for more complex computations and larger data handling in applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it ideal for portable and battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are conducive for automated assembly processes, enhancing manufacturability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADC channels facilitate precise measurement from sensors, enhancing the accuracy of data processing.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA is acceptable for many applications, providing a good balance between performance and power consumption.

Nominal Supply Voltage: 1.2 V

The nominal voltage aligns with many low-power applications, supporting energy efficiency.

No. of DMA Channels: 64

A large number of DMA channels improves data transfer capabilities, reducing CPU overhead and increasing throughput.

No. of Serial I/Os: 26

Offering 26 serial I/Os allows for robust communication with peripherals and flexible system design.

PWM Channels: YES

Inclusion of PWM channels makes it ideal for motor control and other applications that require precise control of output signals.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options facilitate integration into various communication networks, enhancing versatility.

ROM Programmability: FLASH

FLASH programmability allows for easier firmware updates, ensuring the microcontroller remains adaptable to new requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for a compact design, fitting within small form factor applications.

Format: FLOATING POINT

Floating point support enhances the ability to handle complex mathematical computations, beneficial for engineering and scientific applications.

Speed: 160 rpm

This speed rating allows for quick operation of connected devices, enhancing the responsiveness of the overall system.

Low Power Mode: YES

The low power mode extends battery life in portable applications, making it suitable for energy-sensitive projects.

On Chip Program ROM Width: 8

The 8-bit width for program ROM supports efficient execution of instructions, optimizing performance in various applications.

Technical Specifications

Microcontrollers SPC584C80E5F0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C80E5F0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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