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SPC584C74E5FMC0X

STMicroelectronics

SPC584C74E5FMC0X by STMicroelectronics

SPC584C74E5FMC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates up to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and SPI. Ideal for automotive applications, it meets AEC-Q100 standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,107 parts In-Stock

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5,107

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Digiode

USA . 3,034 parts In-Stock

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3,034

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Anansix

USA . 1,192 parts In-Stock

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1,192

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 991 parts In-Stock

1+ parts

$15.110

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-

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991

$15.110

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IDEA Electronic Components Group

UK . 962 parts In-Stock

1+ parts

$37.143

100+ parts

-

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$33.429

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962

$37.143

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$33.429

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Microchip USA

USA . 2,765 parts In-Stock

1+ parts

$52.505

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2,765

$52.505

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MKK Technologies

India . 677 parts In-Stock

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$69.845

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677

$69.845

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DigiPath Technology Company

USA . 677 parts In-Stock

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$69.845

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677

$69.845

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Component Stockers USA

USA . 215 parts In-Stock

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$264.820

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215

$264.820

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Corphita

USA . 2,971 parts In-Stock

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2,971

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Parana Technologies

USA . 1,532 parts In-Stock

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$44.410

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1,532

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$44.410

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Overview

Elevate your designs with the SPC584C74E5FMC0X microcontroller from STMicroelectronics, a leader in semiconductor innovation. Engineered for reliability and performance, this 32-bit powerhouse excels in automotive and industrial applications, ensuring optimal efficiency even under extreme temperatures. With advanced connectivity options and integrated peripherals, it simplifies complex tasks while maximizing energy savings. Trust in STMicroelectronics’ legacy of quality to drive your next project forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and durability, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache enhances data processing speed and performance efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of automated assembly.

Maximum Supply Voltage: 1.26 V

Operating at a low maximum supply voltage improves energy efficiency, ideal for power-sensitive applications.

On Chip Data RAM Width: 8

With 8-bit RAM width, it supports efficient data management and processing capabilities.

Screening Level: AEC-Q100

AEC-Q100 certification signifies reliability and robustness for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient space utilization on circuit boards.

Bit Size: 32

The 32-bit size offers enhanced processing capability suitable for complex applications.

No. of Terminals: 144

A higher number of terminals provides better connectivity options and versatility in applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style ensures effective heat dissipation while maintaining a compact profile.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage allows for operation in energy-sensitive environments.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures reliable performance in demanding environments.

CPU Family: E200Z4

The E200Z4 family supports advanced processing features, suitable for high-performance applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliability in extreme conditions.

ADC Channels: YES

Built-in ADC channels facilitate direct analog signal processing.

DMA Channels: YES

DMA channels enhance data transfer efficiency, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning provides stable electrical connections and ease of integration.

ROM Words: 3145728

A large ROM capacity allows for extensive program storage, accommodating complex applications.

Maximum Seated Height: 1.2 mm

Low seated height contributes to a compact design, crucial for space-constrained applications.

Width: 20 mm

Standard width facilitates compatibility with various PCB layouts.

Data EEPROM Size: 128K

A substantial EEPROM size enables efficient data retention and update capabilities.

Boundary Scan: YES

Boundary scan support allows for effective testing and debugging of circuits.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral integration makes this microcontroller suitable for diverse applications, from timers to real-time clocks.

Maximum Clock Frequency: 40 MHz

High clock frequency facilitates faster data processing and execution of complex tasks.

Length: 20 mm

Standard length supports universal board designs and layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing efficiency and reduces power consumption.

No. of Timers: 12

Multiple timers enhance the capability to manage various tasks and events in real-time applications.

RAM Bytes: 393216

Ample RAM size supports high-speed access and complex application requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form ensures secure mounting and efficient soldering.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution allow for accurate signal conversion in diverse applications.

Maximum Supply Current: 50 mA

Low maximum supply current enhances energy efficiency, ideal for battery-operated devices.

Nominal Supply Voltage: 1.2 V

Low nominal supply voltage encourages low power design practices and minimizes heat generation.

No. of DMA Channels: 64

With 64 DMA channels, the microcontroller supports high-speed data transfers and multitasking.

No. of Serial I/Os: 18

An adequate number of serial I/Os provides flexibility for connections with various peripherals.

PWM Channels: YES

Support for PWM channels makes this microcontroller suitable for motor control and signal modulation.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Wide connectivity options ensure integration with numerous devices and systems, enhancing flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modification post-initialization.

Terminal Pitch: 0.5 mm

Fine terminal pitch contributes to compact designs and high-density PCB layouts.

Format: FLOATING POINT

Floating point format support enables complex mathematical computations.

Speed: 160 rpm

A speed rating of 160 rpm suggests suitability for control applications, particularly in robotics.

Low Power Mode: YES

Low power mode enhances energy savings, extending battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient program storage and execution.

Technical Specifications

Microcontrollers SPC584C74E5FMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C74E5FMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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