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SPC584C74E3QEC1X

STMicroelectronics

SPC584C74E3QEC1X by STMicroelectronics

SPC584C74E3QEC1X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates up to 125 °C. It features integrated cache, DMA channels, and supports Ethernet connectivity. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,907 parts In-Stock

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3,907

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Digiode

USA . 3,123 parts In-Stock

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3,123

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Anansix

USA . 2,719 parts In-Stock

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2,719

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Distributors (Availability)

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$18.170

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431

$18.170

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IDEA Electronic Components Group

UK . 650 parts In-Stock

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$35.982

100+ parts

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$32.384

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650

$35.982

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$32.384

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MKK Technologies

India . 1,139 parts In-Stock

1+ parts

$67.662

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1,139

$67.662

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DigiPath Technology Company

USA . 1,139 parts In-Stock

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$67.662

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1,139

$67.662

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Corphita

USA . 3,612 parts In-Stock

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3,612

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Parana Technologies

USA . 2,234 parts In-Stock

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$43.022

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2,234

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$43.022

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Overview

Elevate your designs with the SPC584C74E3QEC1X microcontroller from STMicroelectronics, a trusted leader in innovation. This robust 32-bit MCU combines exceptional performance with low power consumption, making it ideal for automotive applications and smart devices. With integrated features like advanced ADCs, multiple timers, and connectivity options, it offers unmatched reliability and efficiency. Choose SPC584C74E3QEC1X for quality that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and cost-effectiveness, making it suitable for various applications.

Integrated Cache: YES

An integrated cache enhances processing efficiency and speed, improving overall performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient placement on PCBs, making it ideal for modern electronic devices.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage allows for energy-efficient operation, extending battery life in portable applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width provides adequate memory access performance for diverse applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 signifies reliability and robustness, making it ideal for automotive applications.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization in circuit designs.

Bit Size: 32

The 32-bit architecture allows for advanced processing capabilities, making it suitable for complex applications.

No. of Terminals: 100

Having 100 terminals offers extensive connectivity options, enabling integration with multiple peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style provides effective cooling and a compact footprint, enhancing performance in constrained spaces.

Minimum Supply Voltage: 1.14 V

Operating at a low minimum supply voltage signifies energy efficiency, making it suitable for low-power applications.

Maximum Operating Temperature: 125 °C

High operating temperature capability ensures reliability in extreme environments, making it suitable for industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family is designed for high-performance applications, enhancing processing speed and efficiency.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes the microcontroller suitable for harsh environments and outdoor applications.

ADC Channels: YES

Having integrated ADC channels allows for direct analog signal processing, enhancing functionality in sensor applications.

DMA Channels: YES

Integrated DMA channels allow for efficient data handling, reducing CPU load and improving performance.

Terminal Position: QUAD

A quad terminal position optimizes layout flexibility for designers, aiding in PCB design efficiency.

ROM Words: 3145728

A large ROM size accommodates complex applications and extensive codebases, enhancing the device's capabilities.

Maximum Seated Height: 1.2 mm

The low height allows for compact designs, making it suitable for space-constrained applications.

Width: 14 mm

A compact width enables ease of integration into small form factor designs.

Data EEPROM Size: 128K

Adequate EEPROM size allows for non-volatile data storage, essential for configuration settings and user data.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, improving reliability in manufacturing processes.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral integration enhances functionality and allows for design flexibility, suitable for various applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for fast processing speeds, making the microcontroller suitable for demanding tasks.

Length: 14 mm

The compact length contributes to space efficiency in design, accommodating smaller devices.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances execution efficiency, particularly in applications requiring fast instruction cycles.

No. of Timers: 12

Multiple timers provide flexible options for timing and control tasks, essential in various applications.

RAM Bytes: 393216

Ample RAM capacity ensures sufficient memory for data manipulation and program execution.

Technology: CMOS

CMOS technology offers low power consumption, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals support reliable soldering and easy assembly, enhancing manufacturing efficiency.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADCs with high resolution allow for precise signal conversion, crucial for sensor applications.

Maximum Supply Current: 50 mA

A low maximum supply current contributes to energy efficiency, ideal for power-sensitive applications.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage that matches energy-efficient standards enhances compatibility with low-power systems.

No. of DMA Channels: 64

A high number of DMA channels allows for efficient data transfer operations, reducing processing overhead.

No. of Serial I/Os: 18

Extensive serial I/O support provides versatility in connectivity for various external devices.

PWM Channels: YES

Integrated PWM channels facilitate motor control and other applications requiring precise signal modulation.

Connectivity: ETHERNET, I2C, SPI(8), UART(18)

Diverse connectivity options enhance the versatility of the microcontroller, suitable for IoT and communication applications.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates, enhancing product longevity and adaptability.

Terminal Pitch: 0.5 mm

A small terminal pitch enables more compact designs, fitting into tighter spaces on PCBs.

Format: FLOATING POINT

Floating point format supports complex mathematical operations, ideal for applications requiring high precision.

Speed: 180 rpm

The operational speed indicates capability in applications requiring precise motor control, such as robotics.

Low Power Mode: YES

The low power mode feature enhances battery life in portable devices, making it an energy-efficient option.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with a variety of software applications, broadening usage scenarios.

Technical Specifications

Microcontrollers SPC584C74E3QEC1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C74E3QEC1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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