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SPC584C74E3QEC0X

STMicroelectronics

SPC584C74E3QEC0X by STMicroelectronics

SPC584C74E3QEC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates up to 125 °C. It features integrated cache, DMA channels, and supports Ethernet connectivity. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,269 parts In-Stock

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Anansix

USA . 1,977 parts In-Stock

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1,977

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Digiode

USA . 550 parts In-Stock

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550

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Distributors (Availability)

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AZTECH Wire

Italy . 1,191 parts In-Stock

1+ parts

$12.230

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$12.230

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

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$21.199

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$19.079

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1,703

$21.199

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$19.079

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MKK Technologies

India . 1,497 parts In-Stock

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$39.863

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1,497

$39.863

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$39.863

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1,497

$39.863

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Corphita

USA . 3,184 parts In-Stock

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3,184

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 2,606 parts In-Stock

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2,606

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Parana Technologies

USA . 766 parts In-Stock

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$25.346

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$25.346

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Overview

Unlock unparalleled performance with the SPC584C74E3QEC0X microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and efficiency, this robust 32-bit MCU excels in automotive applications, ensuring optimal operation even under extreme conditions. Experience enhanced processing speed, integrated peripherals, and energy-saving features that deliver powerful benefits, driving your projects to new heights while maintaining exceptional quality and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides excellent insulation and protection for the microcontroller, ensuring durability in various operating environments.

Integrated Cache: YES

An integrated cache enhances processing speed and efficiency, allowing the microcontroller to quickly access frequently used data, which boosts overall performance.

Surface Mount: YES

Surface mount technology enables a compact design, allowing for high-density PCB layouts and facilitating automated assembly processes.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage ensures energy efficiency, making this microcontroller suitable for battery-operated devices and low-power applications.

On Chip Data RAM Width: 8

The 8-bit RAM width provides adequate data handling capabilities for various applications, allowing for efficient data processing.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the microcontroller meets automotive quality standards, making it ideal for automotive applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, making it easier to integrate within compact electronic designs.

Bit Size: 32

A 32-bit architecture supports complex calculations and offers superior performance for sophisticated applications compared to 8 or 16-bit alternatives.

No. of Terminals: 100

With 100 terminals, this microcontroller provides ample connectivity options for peripheral devices, enhancing expandability in designs.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style allows for optimal thermal performance and facilitates cooling, which is critical in high-performance applications.

Minimum Supply Voltage: 1.14 V

The ability to operate at lower voltages increases the versatility of the microcontroller in a wide range of applications, especially in energy-sensitive environments.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes this microcontroller suitable for high-temperature environments, such as industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family is known for its performance efficiency, making this microcontroller an excellent choice for demanding applications.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this microcontroller is reliable for outdoor and harsh environmental applications.

ADC Channels: YES

Inclusion of ADC channels allows for the integration of analog signals, making this microcontroller versatile for sensor applications.

DMA Channels: YES

DMA channels streamline data transfer processes, freeing up CPU resources for other tasks and enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for better soldering connections, ensuring reliability and durability in various applications.

ROM Words: 3145728

A substantial ROM capacity provides ample storage for software, supporting complex applications with larger codebases.

Maximum Seated Height: 1.2 mm

A lower seated height promotes compact designs, which is beneficial for applications where space is a premium.

Width: 14 mm

The compact width allows for easy placement in tight spaces on PCBs, making this microcontroller ideal for miniaturized electronics.

Data EEPROM Size: 128K

Sufficient EEPROM size allows for the storage of configuration settings or calibration data, enhancing the microcontroller’s flexibility.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of PCBs, significantly reducing time and cost in product development.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances functionality, making the microcontroller suitable for a wide range of applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency supports faster processing speeds, making this microcontroller suitable for demanding real-time applications.

Length: 14 mm

The compact length contributes to space-efficient designs, allowing it to fit into a variety of electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller typically results in higher performance and lower power consumption, ideal for efficient processing.

No. of Timers: 12

Having multiple timers offers extensive timing functions that can be utilized for various applications, enhancing the device’s capabilities.

RAM Bytes: 393216

A sizable RAM size allows for efficient data handling and supports complex applications that require ample runtime memory.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this microcontroller highly efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate automatic pick-and-place assembly, enhancing manufacturing efficiency and reliability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

The inclusion of multiple ADC channels allows for versatile interfacing with various sensors, making this microcontroller adaptable to diverse applications.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA offers balanced power management, making this microcontroller suitable for low to moderate power applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage aligns with low-power applications, promoting energy efficiency and longer battery life in devices.

No. of DMA Channels: 64

Having 64 DMA channels enhances data handling capabilities, allowing for complex operations without burdening the CPU.

No. of Serial I/Os: 18

With 18 serial I/O lines, the microcontroller can effectively communicate with multiple devices, making it suitable for multi-device architectures.

PWM Channels: YES

Incorporation of PWM channels offers the ability to control motors and other devices smoothly, expanding potential applications.

Connectivity: ETHERNET, I2C, SPI(8), UART(18)

Rich connectivity options provide flexibility in interfacing with various devices and communication protocols, enhancing integration capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, ensuring long-term usability and adaptability.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for compact designs and high-density connections, optimizing board space usage.

Format: FLOATING POINT

Support for floating point operations enhances the microcontroller's ability to handle complex mathematical computations efficiently.

Speed: 180 rpm

Operating at 180 rpm allows for effective control in various applications, particularly in motor control and robotics.

Low Power Mode: YES

Low power mode availability extends battery life and reduces energy consumption, essential for portable or energy-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit wide program ROM is suitable for accommodating various applications while ensuring efficient operation.

Technical Specifications

Microcontrollers SPC584C74E3QEC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C74E3QEC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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