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SPC584C70E5QMC0X

STMicroelectronics

SPC584C70E5QMC0X by STMicroelectronics

SPC584C70E5QMC0X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU, operates at a max voltage of 1.26V, and includes 393216 bytes of RAM. Ideal for automotive applications, it supports Ethernet and multiple I/O interfaces. Its AEC-Q100 screening ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,484 parts In-Stock

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8,484

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Digiode

USA . 740 parts In-Stock

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740

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Anansix

USA . 491 parts In-Stock

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491

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Distributors (Availability)

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AZTECH Wire

Italy . 270 parts In-Stock

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$14.290

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270

$14.290

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IDEA Electronic Components Group

UK . 2,257 parts In-Stock

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$34.257

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$30.831

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Microchip USA

USA . 2,978 parts In-Stock

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$53.861

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2,978

$53.861

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MKK Technologies

India . 1,788 parts In-Stock

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$64.418

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1,788

$64.418

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DigiPath Technology Company

USA . 1,788 parts In-Stock

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$64.418

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1,788

$64.418

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,734 parts In-Stock

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Parana Technologies

USA . 1,510 parts In-Stock

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$40.960

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1,510

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$40.960

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Overview

Unlock the power of innovation with the SPC584C70E5QMC0X microcontroller from STMicroelectronics. Renowned for their unmatched quality and reliability, STMicroelectronics offers a solution that's perfect for demanding automotive applications. This advanced microcontroller enhances performance while ensuring low power consumption, making it ideal for embedded systems. Experience seamless connectivity and robust processing capabilities that drive your projects to success. Elevate your designs with a trusted brand committed to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures robustness and reliability in various environmental conditions.

Integrated Cache: YES

The presence of integrated cache enhances the performance by speeding up data access times.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern electronic devices.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage makes this microcontroller suitable for low-power applications.

On Chip Data RAM Width: 8

With an 8-bit RAM width, it can handle a diverse range of data types effectively.

Screening Level: AEC-Q100

This screening level indicates the product is suitable for automotive applications, ensuring high reliability.

Package Shape: SQUARE

A square package shape allows for flexible mounting options in compact spaces.

Bit Size: 32

A 32-bit architecture allows for processing of larger values and more complex operations.

No. of Terminals: 144

A higher number of terminals provides better connectivity options for various peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This style supports efficient heat dissipation and improves the microcontroller's operational stability.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enhances energy efficiency, making it ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, this microcontroller is suitable for challenging environments.

CPU Family: E200Z4

This particular CPU family provides optimized performance for a range of applications.

Minimum Operating Temperature: -40 °C

This wide temperature range makes it suitable for use in extreme environmental conditions.

ADC Channels: YES

Having ADC channels allows for better interaction with the analog world, enhancing functionality.

DMA Channels: YES

The inclusion of DMA channels enables efficient data transfer, reducing CPU load during operations.

Terminal Position: QUAD

Quad terminal positions enable versatile layout options and easier soldering.

ROM Words: 2097152

A substantial ROM allows for extensive program storage, accommodating sophisticated applications.

Maximum Seated Height: 1.2 mm

A low seated height contributes to compact design and space efficiency.

Width: 20 mm

Compact width enables integration in space-constrained applications while maintaining functionality.

Data EEPROM Size: 128K

Ample EEPROM storage supports persistent data needs for applications that require data retention.

Boundary Scan: YES

The boundary scan feature simplifies testing and debugging, improving development efficiency.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances versatility for various application needs.

Maximum Clock Frequency: 40 MHz

A high clock frequency ensures the microcontroller can execute tasks quickly and efficiently.

Length: 20 mm

The 20 mm length complements the compact design, making it ideal for modern electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing and reduced power consumption.

No. of Timers: 12

With 12 timers, it supports complex time-sensitive applications efficiently.

RAM Bytes: 393216

A larger RAM capacity enables efficient multitasking and handling of more complex algorithms.

Technology: CMOS

CMOS technology ensures low power consumption, maximizing energy efficiency.

Terminal Form: GULL WING

The gull wing form factor enhances soldering reliability and improves electrical connection.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

High resolution ADCs support precise measurements, enhancing application performance.

Maximum Supply Current: 50 mA

Low maximum supply current capabilities support energy-efficient designs.

Nominal Supply Voltage: 1.2 V

This nominal voltage optimizes power management for various applications.

No. of DMA Channels: 64

Offering 64 DMA channels allows for high-speed data transfers without burdening the CPU.

No. of Serial I/Os: 18

Multiple serial I/O options facilitate diverse communication protocols and easy integration.

PWM Channels: YES

PWM channels enhance control over motors and various other applications requiring precise timing.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

A broad connectivity range ensures flexibility and ease in system integration.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing longevity.

Terminal Pitch: 0.5 mm

A fine terminal pitch aids in compact designs, suitable for modern electronic applications.

Format: FLOATING POINT

Supports complex mathematical computations natively, enhancing processing capabilities.

Speed: 180 rpm

This speed specification indicates optimal performance for motor control applications.

Low Power Mode: YES

Low power modes extend battery life in portable applications, making the product energy-efficient.

On Chip Program ROM Width: 8

The 8-bit program ROM width allows compatibility with a wide array of software platforms.

Technical Specifications

Microcontrollers SPC584C70E5QMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E5QMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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